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FQA30N40

Onsemi

FQA30N40 by Onsemi

FQA30N40 by Onsemi is a N-CHANNEL Power FET with 400V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 120A and EAS of 1400mJ, ensuring high performance in ENHANCEMENT MODE operation. With a max power dissipation of 290W and 0.14 ohm RDS(on), it offers reliable performance in various industrial settings.

Median Price

$5.100

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 28,476 parts In-Stock

1+ parts

$3.750

100+ parts

$3.680

1k+ parts

$3.600

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28,476

$3.750

$3.680

$3.600

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DigiKey

USA . 260 parts In-Stock

1+ parts

$6.450

100+ parts

$3.136

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260

$6.450

$3.136

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Distributors (In-Stock)

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TME

Poland . 324 parts In-Stock

1+ parts

$5.530

100+ parts

$3.340

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324

$5.530

$3.340

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Digiode

USA . 1,142 parts In-Stock

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$6.128

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1,142

$6.128

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Vyrian

USA . 3,097 parts In-Stock

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$6.450

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3,097

$6.450

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Chip Stock

USA . 5,300 parts In-Stock

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5,300

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

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1,000

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Bristol Electronics

USA . 450 parts In-Stock

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450

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ComSIT Distribution GmbH

Germany . 215 parts In-Stock

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215

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ACDS - Activité Composants Distribution Service

France . 19 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 220 parts In-Stock

1+ parts

$5.480

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220

$5.480

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Corphita

USA . 1,568 parts In-Stock

1+ parts

$5.805

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1,568

$5.805

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Corohmni

South Africa . 89 parts In-Stock

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$6.450

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89

$6.450

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Microchip USA

USA . 8,441 parts In-Stock

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$24.239

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8,441

$24.239

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GreenTree Electronics

Israel . 12,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,574 parts In-Stock

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RC Electronics

USA . 7,000 parts In-Stock

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Problanco Electronics

Mexico . 6,196 parts In-Stock

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Kulean Microsystems

USA . 6,101 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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TANS Electronics

Latvia . 3,282 parts In-Stock

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SupplyDigital Components

Austria . 2,659 parts In-Stock

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Infinite Electronics LLP (Excess)

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Supply Digital

USA . 1,273 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,149 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Kepictronics

USA . 450 parts In-Stock

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450

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UHIMA Technologies

Türkiye . 353 parts In-Stock

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353

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Overview

Upgrade your power systems with the FQA30N40 by Onsemi, a top-tier manufacturer known for delivering high-quality Power Field Effect Transistors. Ideal for switching applications, this N-channel transistor offers a maximum DS breakdown voltage of 400V and a maximum pulsed drain current of 120A. Its single configuration with built-in diode ensures efficient performance while its enhanced mode operation guarantees reliability. With a maximum power dissipation of 290W and an avalanche energy rating of 1400mJ, this transistor provides exceptional value and benefits for a wide range of electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching and control of current flow.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by eliminating the need for an external diode.

Transistor Application: SWITCHING

Suitable for applications where fast switching speeds are required.

Minimum DS Breakdown Voltage: 400 V

Can handle high voltages, making it suitable for power applications.

Maximum Pulsed Drain Current (IDM): 120 A

Capable of handling high current pulses for demanding applications.

Maximum Power Dissipation (Abs): 290 W

Can dissipate heat effectively, ensuring stable operation under high power conditions.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation.

Maximum Drain-Source On Resistance: 0.14 ohm

Provides low resistance for efficient power handling.

Technical Specifications

Power Field Effect Transistors (FET) FQA30N40 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1400 mJ

Minimum DS Breakdown Voltage:

400 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

120 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQA30N40 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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