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FQA32N20C

Onsemi

FQA32N20C by Onsemi

FQA32N20C by Onsemi is a N-CHANNEL Power FET with 200V DS Breakdown Voltage, 128A IDM, and 0.082 ohm RDS(ON). Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE. Operating in ENHANCEMENT MODE, this transistor has a max power dissipation of 204W and can withstand temperatures up to 150°C.

Median Price

$1.570

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 350 parts In-Stock

1+ parts

$1.320

100+ parts

$1.240

1k+ parts

$1.120

10k+ parts

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350

$1.320

$1.240

$1.120

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Chip1Stop

Japan . 12 parts In-Stock

1+ parts

$3.430

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12

$3.430

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Verical

USA . 260 parts In-Stock

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$1.190

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$1.123

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$1.123

260

-

$1.190

$1.123

$1.123

RS (Exports)

UK . 5 parts In-Stock

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-

100+ parts

$1.821

1k+ parts

$1.295

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5

-

$1.821

$1.295

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Distributors (In-Stock)

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Digiode

USA . 2,367 parts In-Stock

1+ parts

$1.254

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2,367

$1.254

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Nova Conductors

Japan . 17 parts In-Stock

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$1.270

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17

$1.270

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Flip Electronics

USA . 3,150 parts In-Stock

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3,150

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Vyrian

USA . 2,366 parts In-Stock

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2,366

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NAC Semi

USA . 300 parts In-Stock

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$1.770

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300

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$1.770

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Freddi Giovanni

Italy . 270 parts In-Stock

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270

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Speed Components Ltd

Israel . 21 parts In-Stock

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21

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R&J Components

USA . 6 parts In-Stock

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6

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Bristol Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Ampacity Inc.

Singapore . 157 parts In-Stock

1+ parts

$1.010

100+ parts

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157

$1.010

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Corphita

USA . 1,680 parts In-Stock

1+ parts

$1.188

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1,680

$1.188

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Corohmni

South Africa . 264 parts In-Stock

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$1.190

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264

$1.190

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Argo Parts USA

USA . 3,615 parts In-Stock

1+ parts

$1.270

100+ parts

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3,615

$1.270

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Continental Prestige Electronics

USA . 197 parts In-Stock

1+ parts

$3.080

100+ parts

$1.810

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197

$3.080

$1.810

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Microchip USA

USA . 297 parts In-Stock

1+ parts

$7.865

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297

$7.865

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AZTECH Wire

Italy . 300 parts In-Stock

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$15.485

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300

$15.485

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Perfect Parts

USA . 24,192 parts In-Stock

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24,192

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Problanco Electronics

Mexico . 6,114 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Kulean Microsystems

USA . 2,661 parts In-Stock

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2,661

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SupplyDigital Components

Austria . 2,430 parts In-Stock

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2,430

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Supply Digital

USA . 1,585 parts In-Stock

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1,585

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TANS Electronics

Latvia . 1,084 parts In-Stock

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1,084

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Eastek

USA . 390 parts In-Stock

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390

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GreenTree Electronics

Israel . 390 parts In-Stock

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390

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UHIMA Technologies

Türkiye . 324 parts In-Stock

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324

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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iodParts Technologies Inc.

India . 10 parts In-Stock

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10

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Overview

Unlock the power of innovation with the FQA32N20C by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are designed for superior performance and reliability. Ideal for switching applications, this N-CHANNEL transistor offers a seamless experience with its single configuration and built-in diode. With a maximum drain current of 32A and an operating temperature of 150°C, this transistor ensures optimal functionality and efficiency. Experience the value and benefits that Onsemi's FQA32N20C brings to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel design allows for efficient power handling, making it suitable for high-power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves efficiency, making this product a cost-effective choice.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in power control systems.

Minimum DS Breakdown Voltage: 200 V

With a high breakdown voltage, this product is ideal for applications requiring high voltage capabilities.

Package Shape: RECTANGULAR

The rectangular shape provides easy mounting and integration into various electronic devices.

Terminal Form: THROUGH-HOLE

The through-hole terminals offer a secure and stable connection, ideal for industrial applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control over the switching process, improving overall performance.

Maximum Pulsed Drain Current (IDM): 128 A

The high pulsed drain current rating ensures reliable operation under high load conditions.

Avalanche Energy Rating (EAS): 955 mJ

The high avalanche energy rating allows for robust performance in harsh operating conditions.

Maximum Drain Current (Abs) (ID): 32 A

The high drain current rating enables the product to handle heavy loads without overheating.

No. of Terminals: 3

The three terminals provide easy connectivity and flexibility in circuit design.

Maximum Power Dissipation (Abs): 204 W

With a high power dissipation rating, this product can handle high power levels without compromising performance.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers easy installation and secure mounting, ideal for industrial environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOSFET technology provides high efficiency and fast switching speeds, making it suitable for power applications.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows the product to be used in extreme environments without overheating.

Transistor Element Material: SILICON

Silicon transistor elements offer high reliability and performance, ensuring long-term stability in operation.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent conductivity and corrosion resistance, prolonging the product's lifespan.

Maximum Drain-Source On Resistance: 0.082 ohm

The low drain-source on resistance reduces power loss and improves efficiency in power management.

Terminal Position: SINGLE

The single terminal position simplifies installation and enhances reliability in circuit connections.

Technical Specifications

Power Field Effect Transistors (FET) FQA32N20C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

955 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

32 A

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.082 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

128 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQA32N20C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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