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NTHL095N65S3H

Onsemi

NTHL095N65S3H by Onsemi

NTHL095N65S3H by Onsemi is a Power FET with 650V DS Breakdown Voltage, 84A IDM, and 0.095 ohm RDS(on). Ideal for SWITCHING applications due to its N-CHANNEL configuration and ENHANCEMENT MODE operation. Package style is FLANGE MOUNT with METAL-OXIDE SEMICONDUCTOR technology.

Median Price

$6.920

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 114 parts In-Stock

1+ parts

$4.280

100+ parts

$3.310

1k+ parts

$3.230

10k+ parts

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114

$4.280

$3.310

$3.230

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Mouser Electronics

USA . 214 parts In-Stock

1+ parts

$6.920

100+ parts

$4.410

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-

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214

$6.920

$4.410

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Newark

USA . 92 parts In-Stock

1+ parts

$7.850

100+ parts

$4.540

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-

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92

$7.850

$4.540

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DigiKey

USA . 214 parts In-Stock

1+ parts

$8.480

100+ parts

$4.963

1k+ parts

$3.858

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214

$8.480

$4.963

$3.858

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Element14

Singapore . 122 parts In-Stock

1+ parts

$10.890

100+ parts

$7.780

1k+ parts

$7.090

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122

$10.890

$7.780

$7.090

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Chip1Stop

Japan . 25 parts In-Stock

1+ parts

$24.500

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25

$24.500

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Future Electronics

Canada . 450 parts In-Stock

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$6.710

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450

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$6.710

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Rochester

USA . 437 parts In-Stock

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-

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$3.860

1k+ parts

$3.450

10k+ parts

$3.250

437

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$3.860

$3.450

$3.250

Verical

USA . 437 parts In-Stock

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-

100+ parts

$4.825

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437

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$4.825

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Distributors (In-Stock)

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Digiode

USA . 1,209 parts In-Stock

1+ parts

$4.076

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Flip Electronics

USA . 48,150 parts In-Stock

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Vyrian

USA . 7,941 parts In-Stock

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NAC Semi

USA . 900 parts In-Stock

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$12.290

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900

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$12.290

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IBS Electronics

USA . 450 parts In-Stock

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$9.411

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450

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$9.411

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Distributors (Availability)

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Corphita

USA . 427 parts In-Stock

1+ parts

$3.861

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427

$3.861

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Corohmni

South Africa . 214 parts In-Stock

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$4.290

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214

$4.290

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Continental Prestige Electronics

USA . 174 parts In-Stock

1+ parts

$5.850

100+ parts

$3.710

1k+ parts

$3.310

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174

$5.850

$3.710

$3.310

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Microchip USA

USA . 4,130 parts In-Stock

1+ parts

$21.812

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4,130

$21.812

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SupplyDigital Components

Austria . 4,248 parts In-Stock

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Kulean Microsystems

USA . 3,189 parts In-Stock

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Problanco Electronics

Mexico . 2,761 parts In-Stock

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TANS Electronics

Latvia . 1,222 parts In-Stock

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UHIMA Technologies

Türkiye . 761 parts In-Stock

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Perfect Parts

USA . 308 parts In-Stock

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GreenTree Electronics

Israel . 125 parts In-Stock

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Authorized Procurement Solutions

USA . 25 parts In-Stock

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Overview

Enhance your power control solutions with the NTHL095N65S3H by Onsemi, a high-quality Power Field Effect Transistor designed for switching applications. With a maximum DS Breakdown Voltage of 650V and an Avalanche Energy Rating of 284mJ, this N-CHANNEL FET offers superior performance and reliability. Its SINGLE configuration with a built-in diode ensures efficient operation, while the Matte Tin finish and FLANGE MOUNT package style provide ease of installation. Trust Onsemi's expertise in semiconductor technology to deliver a product that exceeds expectations in power dissipation and thermal management. Upgrade your systems with the NTHL095N65S3H and experience enhanced efficiency and robustness in your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material enhances durability and reliability of the power FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making them ideal for various applications.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage of 650V allows the FET to handle high power applications with ease.

Maximum Pulsed Drain Current (IDM): 84 A

With a high pulsed drain current rating of 84A, this FET can handle sudden surges in current effectively.

Maximum Power Dissipation (Abs): 208 W

The high power dissipation rating of 208W ensures that the FET can efficiently dissipate heat, improving overall performance and reliability.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can operate in harsh environments without risk of overheating.

Maximum Drain Current (ID): 30 A

The high drain current rating of 30A allows the FET to handle high current loads without issues.

Maximum Drain-Source On Resistance: 0.095 ohm

The low drain-source on resistance of 0.095 ohm reduces power losses and improves efficiency of the FET.

Technical Specifications

Power Field Effect Transistors (FET) NTHL095N65S3H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

284 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.095 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

84 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHL095N65S3H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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