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NTHL025N065SC1

Onsemi

NTHL025N065SC1 by Onsemi

NTHL025N065SC1 by Onsemi is a Power FET with 650V DS Breakdown Voltage, 323A IDM, and 0.0285 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with SILICON CARBIDE element material. With a max power dissipation of 348W and operating temperature range from -55 to 175 °C, it offers high performance in various industrial settings.

Median Price

$14.565

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 30 parts In-Stock

1+ parts

$6.333

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-

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30

$6.333

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Farnell

UK . 19 parts In-Stock

1+ parts

$13.310

100+ parts

$10.800

1k+ parts

$10.580

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19

$13.310

$10.800

$10.580

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Mouser Electronics

USA . 1,202 parts In-Stock

1+ parts

$13.610

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1,202

$13.610

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Newark

USA . 90 parts In-Stock

1+ parts

$14.530

100+ parts

$14.130

1k+ parts

$13.750

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90

$14.530

$14.130

$13.750

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Chip1Stop

Japan . 30 parts In-Stock

1+ parts

$17.800

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30

$17.800

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DigiKey

USA . 501 parts In-Stock

1+ parts

$20.530

100+ parts

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$11.680

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501

$20.530

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$11.680

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Element14

Singapore . 19 parts In-Stock

1+ parts

$23.300

100+ parts

$17.790

1k+ parts

$17.160

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19

$23.300

$17.790

$17.160

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EBV Elektronik

Germany . 2,700 parts In-Stock

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2,700

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Rochester

USA . 970 parts In-Stock

1+ parts

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$11.680

1k+ parts

$10.450

10k+ parts

$9.830

970

-

$11.680

$10.450

$9.830

Verical

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$14.600

1k+ parts

$13.825

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900

-

$14.600

$13.825

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RS (Exports)

UK . 375 parts In-Stock

1+ parts

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100+ parts

$23.441

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375

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$23.441

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Distributors (In-Stock)

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Digiode

USA . 1,116 parts In-Stock

1+ parts

$12.331

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$12.331

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Vyrian

USA . 1,372 parts In-Stock

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$12.980

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1,372

$12.980

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NAC Semi

USA . 2,250 parts In-Stock

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$25.050

10k+ parts

$22.770

2,250

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$25.050

$22.770

Flip Electronics

USA . 450 parts In-Stock

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450

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Corohmni

South Africa . 168 parts In-Stock

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$3.918

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168

$3.918

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Corphita

USA . 467 parts In-Stock

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$11.682

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467

$11.682

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Continental Prestige Electronics

USA . 438 parts In-Stock

1+ parts

$22.120

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$17.420

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438

$22.120

$17.420

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Microchip USA

USA . 106 parts In-Stock

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$61.502

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106

$61.502

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Kulean Microsystems

USA . 5,699 parts In-Stock

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5,699

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SupplyDigital Components

Austria . 5,014 parts In-Stock

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Problanco Electronics

Mexico . 2,704 parts In-Stock

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TANS Electronics

Latvia . 2,143 parts In-Stock

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UHIMA Technologies

Türkiye . 984 parts In-Stock

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984

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GreenTree Electronics

Israel . 628 parts In-Stock

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Perfect Parts

USA . 448 parts In-Stock

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Eastek

USA . 108 parts In-Stock

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108

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Overview

Looking for a high-quality Power Field Effect Transistor that offers top-notch performance and reliability? Look no further than the NTHL025N065SC1 by Onsemi! With its N-CHANNEL configuration and built-in diode, this transistor is perfect for switching applications. Offering a maximum operating temperature of 175°C and a maximum drain current of 99A, this transistor provides exceptional value and efficiency. Trust Onsemi for all your power semiconductor needs and experience the difference in quality and performance with the NTHL025N065SC1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring reliable performance in various conditions.

Polarity or Channel Type: N-CHANNEL

Efficiently controls the flow of current in the desired direction, enhancing the transistor's functionality.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by already including a diode, saving space and reducing component count.

Transistor Application: SWITCHING

Designed specifically for switching applications, offering fast response times and high efficiency.

Minimum DS Breakdown Voltage: 650 V

Can handle high voltages, making it suitable for a wide range of power applications.

Maximum Pulsed Drain Current (IDM): 323 A

Capable of handling high current spikes, ensuring reliable operation in demanding conditions.

Maximum Power Dissipation (Abs): 348 W

With a high power dissipation rating, this transistor can handle large amounts of power without overheating.

Maximum Operating Temperature: 175 °C

Can operate at elevated temperatures without performance degradation, suitable for high-temperature environments.

Maximum Drain Current (ID): 99 A

Capable of handling high continuous current, making it suitable for power applications that require consistent performance.

Maximum Drain-Source On Resistance: 0.0285 ohm

Low on-resistance results in minimal power loss and heat generation, improving efficiency.

Technical Specifications

Power Field Effect Transistors (FET) NTHL025N065SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

62 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

99 A

Maximum Drain-Source On Resistance:

.0285 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

25 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

323 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NTHL025N065SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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