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NTHL020N090SC1

Onsemi

NTHL020N090SC1 by Onsemi

NTHL020N090SC1 by Onsemi is a Power FET with 900V DS Breakdown Voltage, ideal for switching applications. It features a max IDM of 472A and EAS of 264mJ, operating in Enhancement Mode. With a max ID of 118A and RDS(on) of 0.028 ohm, it offers high power dissipation up to 503W in a rectangular package style.

Median Price

$25.970

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 90 parts In-Stock

1+ parts

$22.140

100+ parts

$17.980

1k+ parts

$17.590

10k+ parts

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90

$22.140

$17.980

$17.590

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Mouser Electronics

USA . 231 parts In-Stock

1+ parts

$25.970

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231

$25.970

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Farnell

UK . 1,037 parts In-Stock

1+ parts

$27.875

100+ parts

$21.662

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-

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1,037

$27.875

$21.662

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DigiKey

USA . 1,555 parts In-Stock

1+ parts

$28.350

100+ parts

$18.371

1k+ parts

$17.592

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1,555

$28.350

$18.371

$17.592

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Element14

Singapore . 744 parts In-Stock

1+ parts

$50.010

100+ parts

$36.670

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-

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744

$50.010

$36.670

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Chip1Stop

Japan . 70 parts In-Stock

1+ parts

$89.300

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70

$89.300

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Flip Electronics (Authorized)

USA . 450 parts In-Stock

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450

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Rochester

USA . 69 parts In-Stock

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-

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$17.580

1k+ parts

$15.730

10k+ parts

$14.810

69

-

$17.580

$15.730

$14.810

Future Electronics

Canada . 65 parts In-Stock

1+ parts

-

100+ parts

$17.730

1k+ parts

$17.460

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65

-

$17.730

$17.460

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Verical

USA . 65 parts In-Stock

1+ parts

-

100+ parts

$21.975

1k+ parts

$19.663

10k+ parts

$18.512

65

-

$21.975

$19.663

$18.512

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,140 parts In-Stock

1+ parts

$17.119

100+ parts

-

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2,140

$17.119

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$25.900

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650

$25.900

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Flip Electronics

USA . 450 parts In-Stock

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450

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Vyrian

USA . 293 parts In-Stock

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293

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NAC Semi

USA . 52 parts In-Stock

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$33.150

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52

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$33.150

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Halfin

Belgium . 8 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$0.874

100+ parts

$0.795

1k+ parts

$0.717

10k+ parts

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600

$0.874

$0.795

$0.717

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Corohmni

South Africa . 185 parts In-Stock

1+ parts

$4.218

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185

$4.218

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Ampacity Inc.

Singapore . 307 parts In-Stock

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$15.320

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307

$15.320

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Semicontronic

India . 142 parts In-Stock

1+ parts

$15.320

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$14.937

1k+ parts

$14.860

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142

$15.320

$14.937

$14.860

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Corphita

USA . 991 parts In-Stock

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$16.218

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991

$16.218

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Continental Prestige Electronics

USA . 1,167 parts In-Stock

1+ parts

$29.550

100+ parts

$23.270

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$29.550

$23.270

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Microchip USA

USA . 3,607 parts In-Stock

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$93.725

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3,607

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Perfect Parts

USA . 23,065 parts In-Stock

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Lixinc

USA . 19,291 parts In-Stock

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TANS Electronics

Latvia . 7,821 parts In-Stock

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Problanco Electronics

Mexico . 7,059 parts In-Stock

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Kulean Microsystems

USA . 2,690 parts In-Stock

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Argo Parts USA

USA . 1,284 parts In-Stock

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SupplyDigital Components

Austria . 1,122 parts In-Stock

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Eastek

USA . 570 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$25.382

1k+ parts

$24.605

10k+ parts

$24.087

500

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$25.382

$24.605

$24.087

UHIMA Technologies

Türkiye . 317 parts In-Stock

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317

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Overview

Unleash the power of innovation with the NTHL020N090SC1 by Onsemi, a cutting-edge Power Field Effect Transistor designed for high-performance switching applications. Built with top-quality materials and advanced technology, this N-CHANNEL FET offers unparalleled reliability and efficiency. With a robust design and impressive specifications, this transistor ensures optimal performance and longevity, making it the perfect choice for your electronic projects. Experience the difference with Onsemi's superior products and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and protection for the internal components, making it suitable for various environments.

Polarity or Channel Type

N-CHANNEL - Offers efficient operation for power switching applications.

Configuration

SINGLE WITH BUILT-IN DIODE - Simplifies circuit design by integrating a diode within the transistor package.

Transistor Application

SWITCHING - Ideal for high-performance switching applications requiring fast response times.

Minimum DS Breakdown Voltage

900 V - Offers high voltage tolerance, ensuring reliable operation in demanding conditions.

Package Shape

RECTANGULAR - Allows for easy placement and installation within a circuit.

Terminal Form

THROUGH-HOLE - Facilitates secure connections on a circuit board.

Operating Mode

ENHANCEMENT MODE - Enables precise control of the transistor's conduction state for optimized performance.

Maximum Pulsed Drain Current (IDM)

472 A - Handles high currents during pulsed operation, suitable for power-heavy applications.

Avalanche Energy Rating (EAS)

264 mJ - Provides protection against energy spikes, ensuring the longevity of the transistor.

Maximum Drain Current (Abs) (ID)

118 A - Capable of handling high continuous currents for sustained operation.

No. of Terminals

3 - Simplifies circuit connections and reduces complexity.

Maximum Power Dissipation (Abs)

503 W - Dissipates heat effectively, preventing overheating during operation.

Package Style (Meter)

FLANGE MOUNT - Allows for secure mounting and easy integration into a system.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR - Offers high efficiency and performance characteristics for power applications.

Maximum Operating Temperature

175 °C - Can operate reliably in high-temperature environments.

Transistor Element Material

SILICON CARBIDE - Provides durability and efficiency for power switching applications.

Minimum Operating Temperature

55 °C - Capable of operating in harsh cold environments without performance degradation.

Terminal Finish

Matte Tin (Sn) - annealed - Ensures reliable connections and prevents oxidation for long-term performance.

Maximum Drain Current (ID)

118 A - Capable of handling high current loads without overheating.

Maximum Drain-Source On Resistance

0.028 ohm - Provides low resistance for efficient power transfer and reduced heat generation.

Terminal Position

SINGLE - Simplifies circuit layout and connections.

Maximum Feedback Capacitance (Crss)

24 pF - Offers low capacitance for minimal signal loss and efficient operation.

Technical Specifications

Power Field Effect Transistors (FET) NTHL020N090SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

264 mJ

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

118 A

Maximum Drain Current (ID):

118 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

24 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

472 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NTHL020N090SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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