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NTHL040N65S3F

Onsemi

NTHL040N65S3F by Onsemi

NTHL040N65S3F by Onsemi is a power FET with 650V DS breakdown voltage, 162.5A IDM, and 0.04 ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 446W. This N-channel transistor has a rectangular package shape and can handle up to 65A ID.

Median Price

$17.300

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 357 parts In-Stock

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$17.300

100+ parts

$10.734

1k+ parts

$9.384

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357

$17.300

$10.734

$9.384

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Mouser Electronics

USA . 265 parts In-Stock

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$17.300

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265

$17.300

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Verical

USA . 5,850 parts In-Stock

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$9.443

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5,850

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$9.443

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Distributors (In-Stock)

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Nova Conductors

Japan . 51 parts In-Stock

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$11.060

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51

$11.060

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Digiode

USA . 1,335 parts In-Stock

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$15.124

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$15.124

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Chip Stock

USA . 11,500 parts In-Stock

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11,500

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Vyrian

USA . 4,680 parts In-Stock

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4,680

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Flip Electronics

USA . 370 parts In-Stock

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370

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Distributors (Availability)

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Corohmni

South Africa . 318 parts In-Stock

1+ parts

$10.839

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318

$10.839

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Continental Prestige Electronics

USA . 4,923 parts In-Stock

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$11.060

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$10.839

4,923

$11.060

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$10.839

Netroflash

USA . 500 parts In-Stock

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$11.060

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500

$11.060

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Semicontronic

India . 345 parts In-Stock

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$13.530

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$13.192

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$13.124

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345

$13.530

$13.192

$13.124

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Ampacity Inc.

Singapore . 130 parts In-Stock

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$13.530

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130

$13.530

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Corphita

USA . 1,090 parts In-Stock

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$14.328

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$14.328

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AZTECH Wire

Italy . 476 parts In-Stock

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$18.196

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Microchip USA

USA . 9,210 parts In-Stock

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Lixinc

USA . 8,151 parts In-Stock

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Problanco Electronics

Mexico . 7,097 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,435 parts In-Stock

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Argo Parts USA

USA . 3,749 parts In-Stock

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TANS Electronics

Latvia . 2,493 parts In-Stock

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SupplyDigital Components

Austria . 2,081 parts In-Stock

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UHIMA Technologies

Türkiye . 966 parts In-Stock

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Kulean Microsystems

USA . 764 parts In-Stock

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Authorized Procurement Solutions

USA . 400 parts In-Stock

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iodParts Technologies Inc.

India . 350 parts In-Stock

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GreenTree Electronics

Israel . 80 parts In-Stock

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80

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Overview

Power up your projects with the NTHL040N65S3F by Onsemi! This high-quality Power Field Effect Transistor offers superior performance and reliability, making it the ideal choice for a wide range of switching applications. With a single configuration and built-in diode, this transistor provides easy installation and enhanced efficiency. Whether you're working on industrial equipment or consumer electronics, the NTHL040N65S3F delivers the power you need to take your designs to the next level. Choose Onsemi for cutting-edge technology and unmatched value in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, making it durable and reliable in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics compared to P-channel transistors, making this product suitable for high-power applications.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage applications effectively.

Maximum Power Dissipation (Abs): 446 W

This high power dissipation rating ensures the transistor can handle significant power levels without overheating.

Maximum Drain-Source On Resistance: 0.04 ohm

Low on-resistance leads to less power loss and improved efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTHL040N65S3F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1009 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

65 A

Maximum Drain Current (ID):

65 A

Maximum Drain-Source On Resistance:

.04 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

162.5 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHL040N65S3F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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