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NTHL027N65S3HF

Onsemi

NTHL027N65S3HF by Onsemi

NTHL027N65S3HF by Onsemi is a Power FET with 650V DS Breakdown Voltage, 187.5A IDM, and 0.0274 ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 595W. The transistor features an avalanche energy rating of 1610mJ and can handle up to 75A drain current.

Median Price

$17.916

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 1,276 parts In-Stock

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$22.570

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1,276

$22.570

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DigiKey

USA . 578 parts In-Stock

1+ parts

$22.570

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$14.331

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$13.178

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578

$22.570

$14.331

$13.178

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Verical

USA . 5,400 parts In-Stock

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$13.261

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5,400

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$13.261

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Rochester

USA . 1,135 parts In-Stock

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$13.170

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$11.780

10k+ parts

$11.090

1,135

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$13.170

$11.780

$11.090

Flip Electronics (Authorized)

USA . 450 parts In-Stock

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450

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Avnet

USA . 120 parts In-Stock

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Digiode

USA . 1,203 parts In-Stock

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$16.806

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$16.806

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Vyrian

USA . 1,971 parts In-Stock

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$17.690

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Flip Electronics

USA . 5,850 parts In-Stock

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5,850

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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2,500

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NAC Semi

USA . 90 parts In-Stock

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$29.220

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$29.220

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Distributors (Availability)

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Andel Nordic

Denmark . 3,590 parts In-Stock

1+ parts

$1.140

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-

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$0.796

10k+ parts

$0.796

3,590

$1.140

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$0.796

$0.796

Corphita

USA . 1,820 parts In-Stock

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$15.921

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$15.921

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Continental Prestige Electronics

USA . 2 parts In-Stock

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$17.210

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$11.620

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2

$17.210

$11.620

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Corohmni

South Africa . 328 parts In-Stock

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$17.690

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328

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Microchip USA

USA . 5,050 parts In-Stock

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$49.611

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$49.611

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Perfect Parts

USA . 22,364 parts In-Stock

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Lixinc

USA . 9,092 parts In-Stock

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Kulean Microsystems

USA . 7,247 parts In-Stock

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SupplyDigital Components

Austria . 4,855 parts In-Stock

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TANS Electronics

Latvia . 2,505 parts In-Stock

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UHIMA Technologies

Türkiye . 553 parts In-Stock

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Problanco Electronics

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Eastek

USA . 150 parts In-Stock

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Overview

Experience high-quality performance with the NTHL027N65S3HF by Onsemi, a top-tier manufacturer known for cutting-edge technology and reliability. This power FET is perfect for switching applications, offering enhanced efficiency and durability. With a maximum operating temperature of 150°C and a minimum DS breakdown voltage of 650V, this transistor ensures optimal performance under any conditions. Trust in Onsemi to deliver superior products that meet your needs and exceed your expectations. Elevate your projects with the NTHL027N65S3HF and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring the reliability and durability of the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and faster switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient protection against reverse current flow, enhancing the product's robustness in real-world applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and reliable performance in power control circuits.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage spikes and surges, making it suitable for industrial and power distribution applications.

Maximum Pulsed Drain Current (IDM): 187.5 A

Capable of handling high peak currents during switching events, making it ideal for applications with high inrush current requirements.

Maximum Power Dissipation (Abs): 595 W

The high power dissipation capability allows the FET to operate at high power levels without overheating, ensuring reliable performance in demanding environments.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, suitable for applications where thermal considerations are critical.

Technical Specifications

Power Field Effect Transistors (FET) NTHL027N65S3HF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1610 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.0274 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

187.5 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHL027N65S3HF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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