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BSC123N08NS3GXT

Infineon Technologies

BSC123N08NS3GXT by Infineon Technologies

BSC123N08NS3GXT by Infineon is a N-CHANNEL Power FET with 80V DS Breakdown Voltage and 220A IDM. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with 0.0123 ohm RDS(on) and 66W power dissipation.

Median Price

$0.404

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 25,000 parts In-Stock

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$0.404

25,000

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$0.404

Distributors (In-Stock)

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Vyrian

USA . 24,518 parts In-Stock

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24,518

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VNN

France . 2,520 parts In-Stock

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2,520

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Digiode

USA . 922 parts In-Stock

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922

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 24,950 parts In-Stock

1+ parts

$0.343

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-

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24,950

$0.343

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Decca Corp

Germany . 24,911 parts In-Stock

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$0.343

100+ parts

$0.336

1k+ parts

$0.333

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-

24,911

$0.343

$0.336

$0.333

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Semicontronic

India . 24,626 parts In-Stock

1+ parts

$0.343

100+ parts

$0.334

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$0.333

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-

24,626

$0.343

$0.334

$0.333

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Modulus Dynamics

Lithuania . 3,988 parts In-Stock

1+ parts

$0.609

100+ parts

$0.585

1k+ parts

$0.560

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-

3,988

$0.609

$0.585

$0.560

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Aztec Data Supply Inc.

USA . 39,556 parts In-Stock

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$0.670

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$0.670

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$1.274

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$1.210

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$1.210

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600

$1.274

$1.210

$1.210

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Corohmni

South Africa . 1,044 parts In-Stock

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$1.921

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Argo Parts USA

USA . 4,318 parts In-Stock

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Continental Prestige Electronics

USA . 2,548 parts In-Stock

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Robosynatics

Brazil . 655 parts In-Stock

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655

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Lucentia Tech

USA . 655 parts In-Stock

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$9.710

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$9.710

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$9.710

655

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$9.710

$9.710

Corphita

USA . 378 parts In-Stock

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378

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unleash the power of innovation with the BSC123N08NS3GXT from Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor (FET) offers unparalleled performance in switching applications. With a single configuration and built-in diode, this transistor provides seamless functionality and efficiency. Experience the benefits of enhanced mode operation, high pulsing capabilities, and exceptional thermal performance. Elevate your projects with Infineon's top-of-the-line technology, setting new standards in power management and control.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the transistor, making it a reliable choice for various applications.

Polarity or Channel Type:

N-CHANNEL - This type allows for efficient electron flow, making the transistor suitable for high-performance switching applications.

Configuration:

SINGLE WITH BUILT-IN DIODE - The built-in diode enhances the functionality of the transistor, offering additional protection and improved performance.

Transistor Application:

SWITCHING - Designed specifically for switching applications, this transistor delivers fast and efficient operation.

Surface Mount:

YES - With surface mount capability, this transistor can be easily integrated into circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage:

80 V - The high breakdown voltage ensures reliability and protects the transistor from voltage spikes, making it suitable for demanding environments.

Package Shape:

RECTANGULAR - The rectangular shape allows for efficient packaging and easy mounting, making it a practical choice for various electronic devices.

Terminal Form:

NO LEAD - The no-lead terminal form simplifies installation and improves thermal performance, making it ideal for high-power applications.

Operating Mode:

ENHANCEMENT MODE - The enhancement mode operation enhances control and efficiency, making this transistor an excellent choice for power management.

Maximum Pulsed Drain Current (IDM):

220 A - With a high pulsed drain current rating, this transistor can handle large current spikes, making it suitable for high-power applications.

Avalanche Energy Rating (EAS):

70 mJ - The high avalanche energy rating provides protection against voltage spikes and transient events, ensuring reliable operation in harsh conditions.

No. of Terminals:

8 - The multiple terminals offer flexibility in circuit design and connectivity options, making this transistor versatile and adaptable to various applications.

Maximum Power Dissipation (Abs):

66 W - The high power dissipation rating allows the transistor to handle significant power levels without overheating, ensuring long-term reliability.

Package Style (Meter):

SMALL OUTLINE - The small outline package style saves space and allows for high-density mounting, making it suitable for compact electronic devices.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - The metal-oxide semiconductor technology offers high performance and efficiency, making this transistor a reliable choice for power management applications.

Maximum Operating Temperature:

150 °C - With a high maximum operating temperature, this transistor can withstand extreme conditions, making it suitable for a wide range of environments.

Transistor Element Material:

SILICON - The silicon element material provides stable and consistent performance, ensuring long-term reliability and durability.

Minimum Operating Temperature:

55 °C - The low minimum operating temperature allows the transistor to operate reliably in cold environments, expanding its range of applications.

Maximum Drain Current (ID):

55 A - With a high drain current rating, this transistor can handle significant current loads, making it suitable for high-power applications.

Maximum Drain-Source On Resistance:

0.0123 ohm - The low drain-source on resistance minimizes power losses and improves efficiency, making this transistor an excellent choice for power management applications.

Terminal Position:

DUAL - The dual terminal position offers flexibility in circuit design and layout, making this transistor versatile and adaptable to different configurations.

Case Connection:

DRAIN - The drain case connection simplifies circuit design and improves thermal management, making this transistor easy to integrate into various systems.

Technical Specifications

Power Field Effect Transistors (FET) BSC123N08NS3GXT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

70 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

55 A

Maximum Drain-Source On Resistance:

.0123 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

220 A

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC123N08NS3GXT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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