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BSC123N08NS3G

Infineon Technologies

BSC123N08NS3G by Infineon Technologies

BSC123N08NS3G by Infineon is a N-CHANNEL FET with 80V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 220A IDM, 70mJ EAS, and 0.0123 ohm Drain-Source Resistance. Operating from -55 to 150 °C, it has a max power dissipation of 66W in a SMALL OUTLINE package.

Median Price

$2.120

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 10,253 parts In-Stock

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$2.120

100+ parts

-

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10k+ parts

$1.800

10,253

$2.120

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$1.800

Distributors (In-Stock)

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Maritex

Poland . 979 parts In-Stock

1+ parts

$1.106

100+ parts

$0.655

1k+ parts

$0.608

10k+ parts

$0.536

979

$1.106

$0.655

$0.608

$0.536

Digiode

USA . 429 parts In-Stock

1+ parts

$1.406

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429

$1.406

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Flip Electronics

USA . 60,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 51,537 parts In-Stock

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Infinite Electronics LLP

India . 20,000 parts In-Stock

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Vyrian

USA . 14,187 parts In-Stock

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Rutronik

Germany . 10,000 parts In-Stock

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$0.371

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$0.371

J2 Sourcing AB

Sweden . 9,265 parts In-Stock

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Sensible Micro Corp

USA . 2,808 parts In-Stock

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VNN

France . 1,961 parts In-Stock

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ComSIT USA

USA . 957 parts In-Stock

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ComSIT Distribution GmbH

Germany . 957 parts In-Stock

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Atlantic Semiconductor

USA . 439 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Bristol Electronics

USA . 170 parts In-Stock

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$0.563

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170

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$0.563

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Elcom Components

USA . 32 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 6,082 parts In-Stock

1+ parts

$0.631

100+ parts

$0.606

1k+ parts

$0.581

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-

6,082

$0.631

$0.606

$0.581

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Ampacity Inc.

Singapore . 14,371 parts In-Stock

1+ parts

$1.260

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14,371

$1.260

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Semicontronic

India . 14,219 parts In-Stock

1+ parts

$1.260

100+ parts

$1.228

1k+ parts

$1.222

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14,219

$1.260

$1.228

$1.222

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Corphita

USA . 802 parts In-Stock

1+ parts

$1.332

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802

$1.332

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$1.473

100+ parts

$1.399

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$1.399

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100

$1.473

$1.399

$1.399

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Corohmni

South Africa . 251 parts In-Stock

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$1.595

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Andel Nordic

Denmark . 578 parts In-Stock

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$43.060

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$30.144

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$30.144

578

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$30.144

Infinite Electronics LLP (Excess)

. 515,025 parts In-Stock

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Perfect Parts

USA . 224,787 parts In-Stock

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Lixinc

USA . 19,444 parts In-Stock

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A-Z Elektronik GmbH

Germany . 18,000 parts In-Stock

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S.R.D Solutions

India . 12,000 parts In-Stock

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GreenTree Electronics

Israel . 10,245 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,104 parts In-Stock

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Argo Parts USA

USA . 2,072 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,000 parts In-Stock

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Lucentia Tech

USA . 2,000 parts In-Stock

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$1.057

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$1.057

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$1.057

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$1.057

$1.057

Assy Fe

Spain . 1,579 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 79 parts In-Stock

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Overview

Discover the power of the BSC123N08NS3G by Infineon Technologies, a top-quality Power Field Effect Transistor designed for switching applications. With a maximum drain current of 55A and a low on-resistance of 0.0123 ohm, this N-CHANNEL FET offers exceptional performance and reliability. Whether you're looking to optimize power management in automotive, industrial, or consumer electronics, this transistor delivers outstanding efficiency and durability. Trust in the expertise of Infineon Technologies and elevate your projects with the BSC123N08NS3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the FET, making it suitable for various environments and applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and lower ON resistance, making them efficient for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient performance in controlling power flow.

Minimum DS Breakdown Voltage: 80 V

With a high breakdown voltage, this FET can handle higher voltages without failure, providing robust protection.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and time during production.

Maximum Pulsed Drain Current (IDM): 220 A

High pulsed drain current rating enables the FET to handle sudden surges in current, making it reliable for demanding applications.

Maximum Power Dissipation (Abs): 66 W

The FET can dissipate high amounts of power without overheating, ensuring stable performance under heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers high efficiency and fast switching speeds, ideal for applications requiring precise control.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand elevated temperatures without performance degradation.

Maximum Drain Current (ID): 55 A

The high drain current rating allows the FET to handle substantial current loads, ensuring reliable operation in power circuits.

Technical Specifications

Power Field Effect Transistors (FET) BSC123N08NS3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

70 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

55 A

Maximum Drain-Source On Resistance:

.0123 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

220 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC123N08NS3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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