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BSC13DN30NSFDATMA1

Infineon Technologies

BSC13DN30NSFDATMA1 by Infineon Technologies

Infineon's BSC13DN30NSFDATMA1 is a N-CHANNEL FET with 300V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 64A IDM, 56mJ EAS, and 0.13 ohm RDS(on). With ENHANCEMENT MODE operation and DUAL terminals, it offers high performance in power electronics.

Median Price

$3.490

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2 parts In-Stock

1+ parts

$3.490

100+ parts

-

1k+ parts

-

10k+ parts

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2

$3.490

-

-

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Chip1Stop

Japan . 4,960 parts In-Stock

1+ parts

$3.880

100+ parts

$1.790

1k+ parts

$1.590

10k+ parts

-

4,960

$3.880

$1.790

$1.590

-

Newark

USA . 227 parts In-Stock

1+ parts

$3.890

100+ parts

$1.890

1k+ parts

$1.870

10k+ parts

-

227

$3.890

$1.890

$1.870

-

Mouser Electronics

USA . 87 parts In-Stock

1+ parts

$3.890

100+ parts

$1.890

1k+ parts

$1.440

10k+ parts

$1.430

87

$3.890

$1.890

$1.440

$1.430

Rochester

USA . 21,119 parts In-Stock

1+ parts

-

100+ parts

$1.430

1k+ parts

$1.280

10k+ parts

$1.210

21,119

-

$1.430

$1.280

$1.210

Verical

USA . 16,385 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.887

10k+ parts

-

16,385

-

-

$1.887

-

Future Electronics

Canada . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.280

5,000

-

-

-

$1.280

RS (Exports)

UK . 4,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.684

4,990

-

-

-

$1.684

Element14

Singapore . 2 parts In-Stock

1+ parts

-

100+ parts

$3.910

1k+ parts

-

10k+ parts

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2

-

$3.910

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 53 parts In-Stock

1+ parts

$1.520

100+ parts

-

1k+ parts

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53

$1.520

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.210

100+ parts

-

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10

$2.210

-

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Chip Stock

USA . 19,560 parts In-Stock

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19,560

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Vyrian

USA . 6,867 parts In-Stock

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6,867

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Rutronik

Germany . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

-

-

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IBS Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$1.677

5,000

-

-

-

$1.677

VNN

France . 453 parts In-Stock

1+ parts

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453

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Bristol Electronics

USA . 29 parts In-Stock

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29

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 2,310 parts In-Stock

1+ parts

$0.792

100+ parts

$0.760

1k+ parts

$0.729

10k+ parts

-

2,310

$0.792

$0.760

$0.729

-

Semicontronic

India . 8,468 parts In-Stock

1+ parts

$1.230

100+ parts

$1.199

1k+ parts

$1.193

10k+ parts

-

8,468

$1.230

$1.199

$1.193

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Ampacity Inc.

Singapore . 6,717 parts In-Stock

1+ parts

$1.230

100+ parts

-

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6,717

$1.230

-

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Corphita

USA . 576 parts In-Stock

1+ parts

$1.440

100+ parts

-

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576

$1.440

-

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Corohmni

South Africa . 694 parts In-Stock

1+ parts

$1.740

100+ parts

-

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694

$1.740

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Aztec Data Supply Inc.

USA . 310 parts In-Stock

1+ parts

$1.874

100+ parts

-

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310

$1.874

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Argo Parts USA

USA . 428 parts In-Stock

1+ parts

$2.180

100+ parts

-

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428

$2.180

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Netroflash

USA . 500 parts In-Stock

1+ parts

$2.210

100+ parts

-

1k+ parts

$2.100

10k+ parts

$2.055

500

$2.210

-

$2.100

$2.055

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$2.254

100+ parts

$2.254

1k+ parts

$2.254

10k+ parts

-

50

$2.254

$2.254

$2.254

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Continental Prestige Electronics

USA . 12,867 parts In-Stock

1+ parts

$3.180

100+ parts

$2.090

1k+ parts

$1.420

10k+ parts

-

12,867

$3.180

$2.090

$1.420

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Microchip USA

USA . 1,484 parts In-Stock

1+ parts

$8.870

100+ parts

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1,484

$8.870

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Perfect Parts

USA . 11,215 parts In-Stock

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11,215

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RC Electronics

USA . 10,970 parts In-Stock

1+ parts

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100+ parts

$2.320

1k+ parts

$2.190

10k+ parts

$2.140

10,970

-

$2.320

$2.190

$2.140

GreenTree Electronics

Israel . 5,000 parts In-Stock

1+ parts

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5,000

-

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Allen Electronics Distributors

USA . 4,990 parts In-Stock

1+ parts

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100+ parts

$2.754

1k+ parts

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10k+ parts

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4,990

-

$2.754

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Infinite Electronics LLP (Excess)

. 4,673 parts In-Stock

1+ parts

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100+ parts

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4,673

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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Overview

Enhance your power systems with the BSC13DN30NSFDATMA1 by Infineon Technologies, a high-quality N-channel Power FET designed for switching applications. With a minimum DS breakdown voltage of 300V and maximum pulsed drain current of 64A, this transistor offers reliable performance and durability. The single configuration with built-in diode makes installation easy, while the small outline package ensures space-saving efficiency. Trust in Infineon's expertise in semiconductor technology to deliver a product that exceeds expectations, providing value and benefits to customers in various industrial applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor components, ensuring reliability and longevity.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON resistance and higher efficiency compared to P-Channel FETs, making them a good choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode can help protect the transistor from voltage spikes and reverse polarity, improving overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high currents and voltages efficiently.

Surface Mount: YES

Surface mount packaging allows for easy and convenient PCB assembly, saving time and space.

Minimum DS Breakdown Voltage: 300 V

The high breakdown voltage makes this FET suitable for applications where high voltages may be present, ensuring safety and reliability.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space and easy mounting alongside other components.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage at the gate to turn on, providing better control over the switching operation.

Maximum Pulsed Drain Current (IDM): 64 A

The high pulsed drain current rating allows for reliable performance in high-demand applications.

Avalanche Energy Rating (EAS): 56 mJ

The high avalanche energy rating ensures the FET can withstand short-duration high energy pulses without damage.

No. of Terminals: 8

Having 8 terminals provides flexibility in PCB design and allows for additional features or connections.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the PCB and allows for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance and reliability in a wide range of operating conditions.

Transistor Element Material: SILICON

Silicon is a commonly used material in transistors due to its high conductivity and reliability.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the FET to be used in a variety of environments and applications.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections.

Maximum Drain Current (ID): 16 A

The high maximum drain current rating allows the FET to handle large currents without overheating.

Maximum Drain-Source On Resistance: 0.13 ohm

The low ON resistance helps to minimize power losses and improve efficiency in switching applications.

Terminal Position: DUAL

Dual terminal position allows for versatile PCB layout options and ease of connection.

Case Connection: DRAIN

The case connection at the drain terminal helps dissipate heat efficiently, improving overall thermal performance.

Technical Specifications

Power Field Effect Transistors (FET) BSC13DN30NSFDATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

56 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

300 V

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.13 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

64 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC13DN30NSFDATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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