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BSC150N03LDGATMA1

Infineon Technologies

BSC150N03LDGATMA1 by Infineon Technologies

Infineon's BSC150N03LDGATMA1 is a N-CHANNEL FET with 30V DS breakdown voltage, suitable for switching applications. It features 2 elements with built-in diode, capable of handling up to 80A pulsed drain current and dissipating 26W power. Ideal for enhancement mode operation in small outline packages at temperatures ranging from -55°C to 150°C.

Median Price

$1.259

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 4,080 parts In-Stock

1+ parts

$0.482

100+ parts

-

1k+ parts

-

10k+ parts

-

4,080

$0.482

-

-

-

Farnell

UK . 3,814 parts In-Stock

1+ parts

$1.178

100+ parts

$0.519

1k+ parts

$0.430

10k+ parts

$0.404

3,814

$1.178

$0.519

$0.430

$0.404

Newark

USA . 2,144 parts In-Stock

1+ parts

$1.340

100+ parts

$0.551

1k+ parts

$0.388

10k+ parts

$0.302

2,144

$1.340

$0.551

$0.388

$0.302

Mouser Electronics

USA . 8,554 parts In-Stock

1+ parts

$1.570

100+ parts

$0.643

1k+ parts

$0.425

10k+ parts

$0.335

8,554

$1.570

$0.643

$0.425

$0.335

DigiKey

USA . 48,039 parts In-Stock

1+ parts

$1.580

100+ parts

$0.657

1k+ parts

$0.465

10k+ parts

$0.425

48,039

$1.580

$0.657

$0.465

$0.425

Adafruit Industries

USA . 5,000 parts In-Stock

1+ parts

$1.782

100+ parts

$1.622

1k+ parts

$1.461

10k+ parts

-

5,000

$1.782

$1.622

$1.461

-

Element14

Singapore . 13,198 parts In-Stock

1+ parts

$1.800

100+ parts

$0.736

1k+ parts

$0.547

10k+ parts

$0.535

13,198

$1.800

$0.736

$0.547

$0.535

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.315

10,000

-

-

-

$0.315

Rochester

USA . 9,890 parts In-Stock

1+ parts

-

100+ parts

$0.379

1k+ parts

$0.315

10k+ parts

$0.281

9,890

-

$0.379

$0.315

$0.281

Arrow

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.299

5,000

-

-

-

$0.299

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 19 parts In-Stock

1+ parts

$0.294

100+ parts

-

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19

$0.294

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$0.531

100+ parts

-

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150

$0.531

-

-

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Chip Stock

USA . 179,150 parts In-Stock

1+ parts

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179,150

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Vyrian

USA . 9,065 parts In-Stock

1+ parts

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9,065

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VNN

France . 520 parts In-Stock

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520

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 8,859 parts In-Stock

1+ parts

$0.204

100+ parts

$0.199

1k+ parts

$0.198

10k+ parts

-

8,859

$0.204

$0.199

$0.198

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Ampacity Inc.

Singapore . 8,520 parts In-Stock

1+ parts

$0.204

100+ parts

-

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8,520

$0.204

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Corphita

USA . 838 parts In-Stock

1+ parts

$0.279

100+ parts

-

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838

$0.279

-

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Corohmni

South Africa . 241 parts In-Stock

1+ parts

$0.336

100+ parts

-

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241

$0.336

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.531

100+ parts

$0.521

1k+ parts

-

10k+ parts

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2,000

$0.531

$0.521

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Argo Parts USA

USA . 92 parts In-Stock

1+ parts

$0.531

100+ parts

-

1k+ parts

-

10k+ parts

$0.516

92

$0.531

-

-

$0.516

Aztec Data Supply Inc.

USA . 3,492 parts In-Stock

1+ parts

$0.814

100+ parts

-

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10k+ parts

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3,492

$0.814

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Continental Prestige Electronics

USA . 4,815 parts In-Stock

1+ parts

$0.971

100+ parts

$0.594

1k+ parts

$0.382

10k+ parts

$0.340

4,815

$0.971

$0.594

$0.382

$0.340

Modulus Dynamics

Lithuania . 15,886 parts In-Stock

1+ parts

$1.391

100+ parts

$1.335

1k+ parts

$1.280

10k+ parts

-

15,886

$1.391

$1.335

$1.280

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$1.782

100+ parts

$1.622

1k+ parts

$1.461

10k+ parts

-

5,000

$1.782

$1.622

$1.461

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RC Electronics

USA . 60,094 parts In-Stock

1+ parts

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100+ parts

$0.620

1k+ parts

$0.570

10k+ parts

$0.550

60,094

-

$0.620

$0.570

$0.550

Perfect Parts

USA . 38,291 parts In-Stock

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38,291

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Lixinc

USA . 6,508 parts In-Stock

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6,508

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Overview

Experience the power of the BSC150N03LDGATMA1 by Infineon Technologies, a top-quality Power Field Effect Transistor designed to elevate your applications to the next level. With its N-CHANNEL configuration and 30V minimum DS Breakdown Voltage, this transistor is perfect for switching tasks. Its small outline package and 2 elements with built-in diode make it versatile and easy to use. Trust in the reliability and efficiency of Infineon Technologies to deliver exceptional performance every time. Upgrade your projects with the BSC150N03LDGATMA1 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides high durability and reliability, making the product suitable for rugged environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower conduction losses and higher efficiency, making them a preferred choice for many applications.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this FET is suitable for applications requiring high voltage operation.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast and efficient switching performance.

Surface Mount: YES

The surface mount design allows for easy and space-saving integration into circuit boards.

Maximum Pulsed Drain Current (IDM): 80 A

With a high pulsed drain current rating, this FET can handle sudden surges in current without damage.

Avalanche Energy Rating (EAS): 10 mJ

The high avalanche energy rating ensures reliable operation under high-energy transient conditions.

Maximum Power Dissipation (Abs): 26 W

This FET can dissipate up to 26 watts of power, making it suitable for high-power applications.

Package Style (Meter): SMALL OUTLINE

The small outline package offers space-saving benefits and easy integration into compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high speed and low power consumption, making this FET ideal for various applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand elevated temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon-based FETs offer high performance and reliability, making them a popular choice in the industry.

Minimum Operating Temperature: -55 °C

The wide operating temperature range ensures reliable operation even in extreme environmental conditions.

Terminal Finish: TIN

The tin finish on the terminals provides corrosion resistance and ensures reliable electrical connections.

Maximum Drain Current (ID): 20 A

With a high drain current rating, this FET can handle large current loads with ease.

Maximum Drain-Source On Resistance: 0.022 ohm

The low on-resistance minimizes power losses and improves efficiency in circuit applications.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options in various circuit layouts.

Case Connection: DRAIN

The drainage connection ensures efficient heat dissipation, keeping the FET operating at optimal temperatures.

Technical Specifications

Power Field Effect Transistors (FET) BSC150N03LDGATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

10 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC150N03LDGATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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