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IPB010N06NATMA1

Infineon Technologies

IPB010N06NATMA1 by Infineon Technologies

Infineon's IPB010N06NATMA1 is a N-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. Features include 720A pulsed drain current, 1600mJ avalanche energy rating, and 0.001 ohm max on-resistance. With a max power dissipation of 300W and operating temp up to 175°C, it's suitable for high-power circuits in various industries.

Median Price

$2.863

Lifecycle Status

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16

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1k+

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Chip1Stop

Japan . 2,000 parts In-Stock

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$3.460

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2,000

$3.460

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Mouser Electronics

USA . 452 parts In-Stock

1+ parts

$7.360

100+ parts

$3.960

1k+ parts

$3.120

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452

$7.360

$3.960

$3.120

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Element14

Singapore . 1,625 parts In-Stock

1+ parts

$7.737

100+ parts

$5.531

1k+ parts

$4.882

10k+ parts

-

1,625

$7.737

$5.531

$4.882

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DigiKey

USA . 18,254 parts In-Stock

1+ parts

$8.880

100+ parts

$4.369

1k+ parts

$3.675

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18,254

$8.880

$4.369

$3.675

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Rochester

USA . 7,001 parts In-Stock

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$2.470

1k+ parts

$2.210

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$2.080

7,001

-

$2.470

$2.210

$2.080

Verical

USA . 4,000 parts In-Stock

1+ parts

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$2.763

10k+ parts

$2.600

4,000

-

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$2.763

$2.600

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

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$2.790

10k+ parts

$2.760

3,000

-

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$2.790

$2.760

Arrow

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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$2.863

10k+ parts

$2.737

1,000

-

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$2.863

$2.737

Farnell

UK . 562 parts In-Stock

1+ parts

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$2.850

1k+ parts

$2.280

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562

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$2.850

$2.280

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 615 parts In-Stock

1+ parts

$3.752

100+ parts

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615

$3.752

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Nova Conductors

Japan . 33 parts In-Stock

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$5.784

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$5.784

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Chip Stock

USA . 19,500 parts In-Stock

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19,500

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IBS Electronics

USA . 18,000 parts In-Stock

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$8.681

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18,000

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$8.681

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Rutronik

Germany . 3,000 parts In-Stock

1+ parts

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$2.390

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3,000

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$2.390

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Vyrian

USA . 2,385 parts In-Stock

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Bristol Electronics

USA . 247 parts In-Stock

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Modulus Dynamics

Lithuania . 18,203 parts In-Stock

1+ parts

$0.812

100+ parts

$0.780

1k+ parts

$0.747

10k+ parts

-

18,203

$0.812

$0.780

$0.747

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$0.976

100+ parts

$0.888

1k+ parts

$0.800

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200

$0.976

$0.888

$0.800

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Corohmni

South Africa . 1,077 parts In-Stock

1+ parts

$1.066

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$1.066

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Aztec Data Supply Inc.

USA . 5,271 parts In-Stock

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$1.380

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$1.380

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Ampacity Inc.

Singapore . 2,200 parts In-Stock

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$3.190

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$3.190

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Semicontronic

India . 2,138 parts In-Stock

1+ parts

$3.190

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$3.110

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$3.094

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$3.190

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Corphita

USA . 129 parts In-Stock

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$3.555

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$3.555

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Component Stockers USA

USA . 21,134 parts In-Stock

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$4.290

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$5.050

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$3.500

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$4.290

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Netroflash

USA . 1,000 parts In-Stock

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$5.784

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$5.784

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Microchip USA

USA . 6,651 parts In-Stock

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$27.825

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Robosynatics

Brazil . 22,467 parts In-Stock

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$1.128

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$1.105

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$1.105

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$1.105

Lucentia Tech

USA . 22,467 parts In-Stock

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$1.128

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$1.105

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$1.105

22,467

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$1.105

RC Electronics

USA . 7,706 parts In-Stock

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$6.050

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$5.520

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$5.350

7,706

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Perfect Parts

USA . 6,742 parts In-Stock

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6,742

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Continental Prestige Electronics

USA . 3,034 parts In-Stock

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$4.000

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$3.470

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3,034

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Argo Parts USA

USA . 710 parts In-Stock

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710

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Overview

Discover the power of the IPB010N06NATMA1 by Infineon Technologies, a high-quality Power Field Effect Transistor that offers unmatched performance and reliability. With its N-CHANNEL design and built-in diode, this transistor is ideal for switching applications, ensuring seamless operation. From its small outline package to its low on-resistance, this product excels in delivering maximum power dissipation and efficiency. Trust Infineon Technologies to provide cutting-edge technology that exceeds expectations. Elevate your projects with the IPB010N06NATMA1 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher efficiency compared to P-channel FETs, making them a better choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, preventing damage to the FET in case of voltage spikes or reverse polarity.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control the flow of current in circuits, making it ideal for power management.

Maximum Pulsed Drain Current (IDM): 720 A

With a high pulsed drain current rating, this FET can handle sudden spikes in current without getting damaged, ensuring reliable performance in demanding conditions.

Maximum Power Dissipation (Abs): 300 W

The high power dissipation capability of this FET allows it to handle high power loads without overheating, making it suitable for high-power applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can operate efficiently in a wide range of temperature conditions, ensuring reliable performance in various environments.

Technical Specifications

Power Field Effect Transistors (FET) IPB010N06NATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

1600 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

180 A

Maximum Drain Current (ID):

45 A

Maximum Drain-Source On Resistance:

.001 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

720 A

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB010N06NATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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