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IPB017N10N5ATMA1

Infineon Technologies

IPB017N10N5ATMA1 by Infineon Technologies

IPB017N10N5ATMA1 by Infineon is a N-CHANNEL FET with 100V DS breakdown voltage, 0.0017 ohm max RDS(on), and 180A max ID. Ideal for switching applications due to its 720A IDM rating and built-in diode. Features GULL WING terminals in a SMALL OUTLINE package style.

Median Price

$4.254

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25

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1k+

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Chip1Stop

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Newark

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$6.870

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$3.760

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$7.310

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$3.930

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$3.100

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Element14

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DigiKey

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Future Electronics

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Verical

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Arrow

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Corohmni

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$1.700

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RC Electronics

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USA . 1,000 parts In-Stock

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$5.235

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$5.124

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Argo Parts USA

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Perfect Parts

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Overview

Unleash the power of innovation with the IPB017N10N5ATMA1 by Infineon Technologies. This high-quality Power Field Effect Transistor (FET) offers unparalleled performance and reliability, thanks to its cutting-edge technology and top-notch manufacturing standards. Ideal for switching applications, this N-CHANNEL transistor comes with a built-in diode for added convenience. With a maximum pulsing drain current of 720 A and a minimum DS breakdown voltage of 100 V, this FET ensures efficient and effective operation in various electronic systems. Trust in the expertise of Infineon Technologies and experience the seamless integration and exceptional functionality that the IPB017N10N5ATMA1 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, ensuring durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher electron mobility and lower on-resistance, making them efficient for high-power applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation in power circuits.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, facilitating manufacturing processes and saving space.

Minimum DS Breakdown Voltage: 100 V

Can handle high voltage applications, offering a wide range of potential uses in power electronics.

Maximum Pulsed Drain Current (IDM): 720 A

Capable of handling high peak currents, making it suitable for applications requiring high power and fast switching.

Avalanche Energy Rating (EAS): 979 mJ

Provides a high energy rating, ensuring the FET can withstand transient voltage spikes and surges without damage.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes a common and reliable FET technology, known for high efficiency and performance in power electronics.

Maximum Drain Current (ID): 180 A

With a high drain current rating, the FET can handle substantial power levels in continuous operation.

Maximum Drain-Source On Resistance: 0.0017 ohm

Features low on-resistance, minimizing power loss and heat generation in the transistor, improving efficiency.

Technical Specifications

Power Field Effect Transistors (FET) IPB017N10N5ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

979 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

180 A

Maximum Drain-Source On Resistance:

.0017 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

720 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB017N10N5ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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