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IPB025N10N3GATMA1

Infineon Technologies

IPB025N10N3GATMA1 by Infineon Technologies

IPB025N10N3GATMA1 by Infineon is a N-CHANNEL FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 720A IDM, 1000mJ EAS, and 0.0025 ohm Drain-Source On Resistance. Operating b/w -55 to 175 °C, it has a max power dissipation of 300W in a SMALL OUTLINE package.

Median Price

$3.190

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 14,202 parts In-Stock

1+ parts

$4.405

100+ parts

-

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14,202

$4.405

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Chip1Stop

Japan . 3,470 parts In-Stock

1+ parts

$6.270

100+ parts

$4.730

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-

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3,470

$6.270

$4.730

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Newark

USA . 11,440 parts In-Stock

1+ parts

$7.320

100+ parts

$3.570

1k+ parts

$3.380

10k+ parts

-

11,440

$7.320

$3.570

$3.380

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Farnell

UK . 12,776 parts In-Stock

1+ parts

$7.709

100+ parts

$4.516

1k+ parts

$3.608

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12,776

$7.709

$4.516

$3.608

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Mouser Electronics

USA . 1,235 parts In-Stock

1+ parts

$7.960

100+ parts

$4.280

1k+ parts

$3.370

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1,235

$7.960

$4.280

$3.370

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Verical

USA . 793,000 parts In-Stock

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100+ parts

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1k+ parts

$3.009

10k+ parts

$2.865

793,000

-

-

$3.009

$2.865

Arrow

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.216

10k+ parts

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16,000

-

-

$2.216

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Avnet

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.381

10k+ parts

$2.274

15,000

-

-

$2.381

$2.274

DigiKey

USA . 6,572 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.190

10k+ parts

$2.924

6,572

-

-

$3.190

$2.924

EBV Elektronik

Germany . 4,000 parts In-Stock

1+ parts

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4,000

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Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

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100+ parts

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$2.790

10k+ parts

$2.750

3,000

-

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$2.790

$2.750

Rochester

USA . 9 parts In-Stock

1+ parts

-

100+ parts

$2.670

1k+ parts

$2.390

10k+ parts

$2.250

9

-

$2.670

$2.390

$2.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 768 parts In-Stock

1+ parts

$4.185

100+ parts

-

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768

$4.185

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$4.560

100+ parts

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100

$4.560

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TME

Poland . 998 parts In-Stock

1+ parts

$6.090

100+ parts

$3.890

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-

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998

$6.090

$3.890

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Semtec, LLC

USA . 21,331 parts In-Stock

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21,331

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Vyrian

USA . 18,626 parts In-Stock

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18,626

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IBS Electronics

USA . 14,000 parts In-Stock

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$11.402

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14,000

-

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$11.402

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Chip Stock

USA . 3,500 parts In-Stock

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3,500

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NAC Semi

USA . 1,000 parts In-Stock

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$4.080

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1,000

-

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$4.080

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Semi Source

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 18,524 parts In-Stock

1+ parts

$0.517

100+ parts

$0.496

1k+ parts

$0.476

10k+ parts

-

18,524

$0.517

$0.496

$0.476

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Corohmni

South Africa . 127 parts In-Stock

1+ parts

$0.868

100+ parts

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127

$0.868

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Ampacity Inc.

Singapore . 17,158 parts In-Stock

1+ parts

$1.840

100+ parts

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17,158

$1.840

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Semicontronic

India . 16,774 parts In-Stock

1+ parts

$1.840

100+ parts

$1.794

1k+ parts

$1.785

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16,774

$1.840

$1.794

$1.785

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Aztec Data Supply Inc.

USA . 62 parts In-Stock

1+ parts

$1.901

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62

$1.901

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$1.939

100+ parts

$1.843

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$1.843

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500

$1.939

$1.843

$1.843

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Corphita

USA . 283 parts In-Stock

1+ parts

$3.964

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283

$3.964

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Argo Parts USA

USA . 1,908 parts In-Stock

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$4.512

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Netroflash

USA . 2,000 parts In-Stock

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$4.560

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2,000

$4.560

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Continental Prestige Electronics

USA . 14,309 parts In-Stock

1+ parts

$6.070

100+ parts

$4.140

1k+ parts

$3.140

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14,309

$6.070

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$3.140

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Microchip USA

USA . 3,812 parts In-Stock

1+ parts

$25.176

100+ parts

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$25.176

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GreenTree Electronics

Israel . 50,000 parts In-Stock

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Perfect Parts

USA . 19,284 parts In-Stock

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Robosynatics

Brazil . 15,951 parts In-Stock

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$1.230

1k+ parts

$1.205

10k+ parts

$1.205

15,951

-

$1.230

$1.205

$1.205

Lucentia Tech

USA . 15,951 parts In-Stock

1+ parts

-

100+ parts

$1.230

1k+ parts

$1.205

10k+ parts

$1.205

15,951

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$1.230

$1.205

$1.205

Lixinc

USA . 9,771 parts In-Stock

1+ parts

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9,771

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RC Electronics

USA . 8,982 parts In-Stock

1+ parts

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$4.880

1k+ parts

$4.450

10k+ parts

$4.320

8,982

-

$4.880

$4.450

$4.320

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Overview

Unlock the power of innovation with the IPB025N10N3GATMA1 by Infineon Technologies. Crafted with precision and expertise, this Power Field Effect Transistor offers unmatched quality and reliability. Ideal for switching applications, this N-channel transistor boasts a single configuration with a built-in diode, providing seamless performance. With a high maximum drain current of 180A and a low drain-source on resistance of 0.0025 ohm, this transistor ensures efficient power management. Elevate your projects with the cutting-edge technology of Infineon Technologies and experience superior functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various environments and applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher current carrying capability, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse polarity and inductive voltage spikes, enhancing the reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast switching speeds and efficient power handling.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are normally off devices, providing better control over the switching operation and reducing power consumption.

Maximum Pulsed Drain Current (IDM): 720 A

High pulsed drain current rating allows for handling sudden surges of current without damage, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 1000 mJ

High avalanche energy rating ensures the transistor can withstand high energy spikes, increasing its reliability in harsh conditions.

Maximum Power Dissipation (Abs): 300 W

With a high power dissipation rating, this FET can handle high power loads without overheating, ensuring reliable performance.

Maximum Operating Temperature: 175 °C

Wide operating temperature range allows for use in various temperature conditions, ensuring consistent performance.

Maximum Drain Current (ID): 180 A

High drain current rating allows for handling large currents, suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.0025 ohm

Low on-resistance minimizes power losses and improves efficiency, making it ideal for high-current switching applications.

Technical Specifications

Power Field Effect Transistors (FET) IPB025N10N3GATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

1000 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

180 A

Maximum Drain-Source On Resistance:

.0025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

720 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB025N10N3GATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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