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IPB072N15N3GXT

Infineon Technologies

IPB072N15N3GXT by Infineon Technologies

IPB072N15N3GXT by Infineon is a N-CHANNEL FET with 150V DS Breakdown Voltage, 400A IDM, and 0.0072 ohm RDS(on). It's used for SWITCHING applications in ENHANCEMENT MODE. The transistor operates at up to 175°C and has a built-in DIODE, making it suitable for high-power requirements.

Median Price

$1.119

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 23,000 parts In-Stock

1+ parts

-

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-

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$1.119

10k+ parts

$1.063

23,000

-

-

$1.119

$1.063

Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$3.849

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-

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150

$3.849

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Vyrian

USA . 23,955 parts In-Stock

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23,955

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Digiode

USA . 320 parts In-Stock

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320

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 2,710 parts In-Stock

1+ parts

$0.846

100+ parts

$0.812

1k+ parts

$0.778

10k+ parts

-

2,710

$0.846

$0.812

$0.778

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Ampacity Inc.

Singapore . 23,674 parts In-Stock

1+ parts

$0.970

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23,674

$0.970

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Semicontronic

India . 22,814 parts In-Stock

1+ parts

$0.970

100+ parts

$0.946

1k+ parts

$0.941

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-

22,814

$0.970

$0.946

$0.941

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Corohmni

South Africa . 409 parts In-Stock

1+ parts

$1.127

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409

$1.127

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Aztec Data Supply Inc.

USA . 29,498 parts In-Stock

1+ parts

$1.350

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29,498

$1.350

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$1.778

100+ parts

$1.689

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$1.689

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-

2,000

$1.778

$1.689

$1.689

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Argo Parts USA

USA . 3,912 parts In-Stock

1+ parts

$3.849

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3,912

$3.849

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Continental Prestige Electronics

USA . 1,229 parts In-Stock

1+ parts

$3.849

100+ parts

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$3.772

1,229

$3.849

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$3.772

Netroflash

USA . 50 parts In-Stock

1+ parts

$3.849

100+ parts

$3.772

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50

$3.849

$3.772

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Corphita

USA . 795 parts In-Stock

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795

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Overview

Unleash the power of innovation with the IPB072N15N3GXT by Infineon Technologies. Crafted with precision and expertise, this Power Field Effect Transistor (FET) is designed to revolutionize your switching applications. With a robust construction and high-quality materials, this N-CHANNEL transistor offers unparalleled performance and reliability. Say goodbye to inefficiency and hello to seamless operation with the built-in diode configuration and enhancement mode operation. Embrace the future of technology with the IPB072N15N3GXT and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the FET, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs have lower ON resistance and higher electron mobility compared to P-Channel FETs, resulting in better performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control the flow of current, making it ideal for power management.

Surface Mount: YES

Being surface mountable makes installation easier and more space-efficient, especially in compact electronic devices.

Minimum DS Breakdown Voltage: 150 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown, ensuring reliability in high-power applications.

Maximum Pulsed Drain Current (IDM): 400 A

The high pulsed drain current rating allows for handling sudden surges in current without damage, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 780 mJ

The high avalanche energy rating indicates the FET's ability to withstand sudden voltage spikes, enhancing its reliability in harsh conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high efficiency and low power consumption, making this FET energy-efficient.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, ensuring stable performance even in demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) IPB072N15N3GXT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

780 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0072 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB072N15N3GXT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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