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IPB036N12N3GATMA1

Infineon Technologies

IPB036N12N3GATMA1 by Infineon Technologies

Infineon's IPB036N12N3GATMA1 is a N-CHANNEL FET with 120V DS breakdown voltage, ideal for switching applications. Featuring a max ID of 180A and 0.0036 ohm RDS(on), it operates in enhancement mode with 175°C max temp. Its GULL WING terminals and built-in diode make it suitable for high-power circuit designs.

Median Price

$5.804

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 6,572 parts In-Stock

1+ parts

$4.550

100+ parts

$3.090

1k+ parts

$2.150

10k+ parts

-

6,572

$4.550

$3.090

$2.150

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Chip1Stop

Japan . 3,823 parts In-Stock

1+ parts

$6.280

100+ parts

$4.570

1k+ parts

-

10k+ parts

-

3,823

$6.280

$4.570

-

-

DigiKey

USA . 929 parts In-Stock

1+ parts

$6.650

100+ parts

$3.284

1k+ parts

$2.683

10k+ parts

-

929

$6.650

$3.284

$2.683

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Newark

USA . 5,965 parts In-Stock

1+ parts

$7.330

100+ parts

$3.580

1k+ parts

$3.390

10k+ parts

-

5,965

$7.330

$3.580

$3.390

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Mouser Electronics

USA . 1,579 parts In-Stock

1+ parts

$7.480

100+ parts

$3.980

1k+ parts

$3.260

10k+ parts

$3.110

1,579

$7.480

$3.980

$3.260

$3.110

Element14

Singapore . 5,990 parts In-Stock

1+ parts

$9.120

100+ parts

$5.660

1k+ parts

$4.300

10k+ parts

-

5,990

$9.120

$5.660

$4.300

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Verical

USA . 298,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.366

10k+ parts

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298,000

-

-

$3.366

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EBV Elektronik

Germany . 58,000 parts In-Stock

1+ parts

-

100+ parts

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58,000

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-

-

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Rochester

USA . 3,925 parts In-Stock

1+ parts

-

100+ parts

$2.690

1k+ parts

$2.410

10k+ parts

$2.260

3,925

-

$2.690

$2.410

$2.260

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.913

10k+ parts

-

1,000

-

-

$2.913

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RS (Exports)

UK . 1,000 parts In-Stock

1+ parts

-

100+ parts

$5.327

1k+ parts

-

10k+ parts

-

1,000

-

$5.327

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 857 parts In-Stock

1+ parts

$2.831

100+ parts

-

1k+ parts

-

10k+ parts

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857

$2.831

-

-

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Nova Conductors

Japan . 44 parts In-Stock

1+ parts

$4.480

100+ parts

-

1k+ parts

-

10k+ parts

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44

$4.480

-

-

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NAC Semi

USA . 47,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.600

10k+ parts

-

47,000

-

-

$4.600

-

Chip Stock

USA . 17,900 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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17,900

-

-

-

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Vyrian

USA . 16,552 parts In-Stock

1+ parts

-

100+ parts

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16,552

-

-

-

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IBS Electronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.373

10k+ parts

-

4,000

-

-

$8.373

-

Semtec, LLC

USA . 2,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,840

-

-

-

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Rutronik

Germany . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.120

10k+ parts

$2.410

2,000

-

-

$3.120

$2.410

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$0.600

100+ parts

$0.570

1k+ parts

$0.570

10k+ parts

-

600

$0.600

$0.570

$0.570

-

Aztec Data Supply Inc.

USA . 326 parts In-Stock

1+ parts

$0.776

100+ parts

-

1k+ parts

-

10k+ parts

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326

$0.776

-

-

-

Corohmni

South Africa . 80 parts In-Stock

1+ parts

$1.315

100+ parts

-

1k+ parts

-

10k+ parts

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80

$1.315

-

-

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Modulus Dynamics

Lithuania . 14,881 parts In-Stock

1+ parts

$1.316

100+ parts

$1.263

1k+ parts

$1.211

10k+ parts

-

14,881

$1.316

$1.263

$1.211

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Ampacity Inc.

Singapore . 16,270 parts In-Stock

1+ parts

$1.700

100+ parts

-

1k+ parts

-

10k+ parts

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16,270

$1.700

-

-

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Semicontronic

India . 17,250 parts In-Stock

1+ parts

$1.740

100+ parts

$1.696

1k+ parts

$1.688

10k+ parts

-

17,250

$1.740

$1.696

$1.688

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Corphita

USA . 190 parts In-Stock

1+ parts

$2.682

100+ parts

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190

$2.682

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Benley Electronics

USA . 5 parts In-Stock

1+ parts

$3.750

100+ parts

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5

$3.750

-

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Argo Parts USA

USA . 4,755 parts In-Stock

1+ parts

$4.480

100+ parts

-

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10k+ parts

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4,755

$4.480

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Continental Prestige Electronics

USA . 5,118 parts In-Stock

1+ parts

$5.710

100+ parts

$3.870

1k+ parts

$2.950

10k+ parts

-

5,118

$5.710

$3.870

$2.950

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Component Stockers USA

USA . 12,588 parts In-Stock

1+ parts

$5.880

100+ parts

$3.580

1k+ parts

$2.840

10k+ parts

$3.300

12,588

$5.880

$3.580

$2.840

$3.300

Microchip USA

USA . 5,024 parts In-Stock

1+ parts

$23.599

100+ parts

-

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5,024

$23.599

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Glotronic Ltd.

UK . 46,800 parts In-Stock

1+ parts

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46,800

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-

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Perfect Parts

USA . 5,799 parts In-Stock

1+ parts

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5,799

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-

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RC Electronics

USA . 5,501 parts In-Stock

1+ parts

-

100+ parts

$4.570

1k+ parts

$4.170

10k+ parts

$4.050

5,501

-

$4.570

$4.170

$4.050

GreenTree Electronics

Israel . 2,000 parts In-Stock

1+ parts

-

100+ parts

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2,000

-

-

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Futuretech Components

Singapore . 1,250 parts In-Stock

1+ parts

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1,250

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$4.390

1k+ parts

$4.256

10k+ parts

$4.166

100

-

$4.390

$4.256

$4.166

Overview

Unleash the power of cutting-edge technology with the IPB036N12N3GATMA1 by Infineon Technologies. Crafted with precision and expertise, this Power Field Effect Transistor (FET) offers unparalleled performance in switching applications. With a built-in diode and N-channel configuration, this transistor ensures seamless operation while maximizing efficiency. Whether you're looking to enhance your electronic devices or optimize energy consumption, this product delivers unmatched reliability and versatility. Elevate your projects with the IPB036N12N3GATMA1 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics and lower on-resistance compared to P-channel FETs, making this product a good choice for efficient switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from voltage spikes, enhancing its reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor can handle high currents and voltages efficiently.

Surface Mount: YES

Surface mount technology allows for easy and compact integration into PCBs, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 120 V

With a high breakdown voltage, this FET can handle higher voltages without the risk of damage, ensuring reliable performance in various circuits.

Maximum Pulsed Drain Current (IDM): 720 A

The high pulsed drain current rating allows the transistor to handle short-duration high-power pulses, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 900 mJ

The high avalanche energy rating means that the transistor can withstand voltage spikes and transient events, increasing its robustness in harsh environments.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this transistor can operate reliably in elevated temperature conditions without compromising performance.

Maximum Drain Current (ID): 180 A

The high drain current rating allows the transistor to handle significant continuous currents, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.0036 ohm

The low on-resistance of the FET reduces power dissipation and improves efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) IPB036N12N3GATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

900 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

120 V

Maximum Drain Current (ID):

180 A

Maximum Drain-Source On Resistance:

.0036 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

720 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB036N12N3GATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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