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IPB065N15N3GATMA1

Infineon Technologies

IPB065N15N3GATMA1 by Infineon Technologies

Infineon's IPB065N15N3GATMA1 is a N-CHANNEL FET with 150V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 520A IDM, 0.0065 ohm RDS(on), and 175°C Max Operating Temp. Suitable for high-power switching circuits in various electronic devices.

Median Price

$3.308

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 840 parts In-Stock

1+ parts

$3.850

100+ parts

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840

$3.850

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DigiKey

USA . 4,531 parts In-Stock

1+ parts

$7.050

100+ parts

$3.439

1k+ parts

$2.649

10k+ parts

-

4,531

$7.050

$3.439

$2.649

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Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.767

10k+ parts

$2.633

5,000

-

-

$2.767

$2.633

RS (Exports)

UK . 1,666 parts In-Stock

1+ parts

-

100+ parts

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$4.700

10k+ parts

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1,666

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$4.700

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Arrow

USA . 1,000 parts In-Stock

1+ parts

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$2.722

10k+ parts

$2.630

1,000

-

-

$2.722

$2.630

Farnell

UK . 982 parts In-Stock

1+ parts

-

100+ parts

$2.760

1k+ parts

$2.580

10k+ parts

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982

-

$2.760

$2.580

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Element14

Singapore . 982 parts In-Stock

1+ parts

-

100+ parts

$5.590

1k+ parts

$4.230

10k+ parts

-

982

-

$5.590

$4.230

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Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$2.650

1k+ parts

$2.370

10k+ parts

$2.230

2

-

$2.650

$2.370

$2.230

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 175 parts In-Stock

1+ parts

$2.793

100+ parts

-

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175

$2.793

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Nova Conductors

Japan . 27 parts In-Stock

1+ parts

$5.320

100+ parts

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27

$5.320

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Chip Stock

USA . 11,500 parts In-Stock

1+ parts

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11,500

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IBS Electronics

USA . 5,000 parts In-Stock

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$8.261

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5,000

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$8.261

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NexGen Digital

USA . 4,896 parts In-Stock

1+ parts

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4,896

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NAC Semi

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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$4.440

10k+ parts

$4.100

2,000

-

-

$4.440

$4.100

Vyrian

USA . 1,028 parts In-Stock

1+ parts

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1,028

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Rutronik

Germany . 1,000 parts In-Stock

1+ parts

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100+ parts

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$4.270

10k+ parts

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1,000

-

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$4.270

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ComSIT Distribution GmbH

Germany . 11 parts In-Stock

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11

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 142 parts In-Stock

1+ parts

$0.425

100+ parts

-

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10k+ parts

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142

$0.425

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-

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Modulus Dynamics

Lithuania . 6,380 parts In-Stock

1+ parts

$0.593

100+ parts

$0.569

1k+ parts

$0.546

10k+ parts

-

6,380

$0.593

$0.569

$0.546

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Aztec Data Supply Inc.

USA . 1,445 parts In-Stock

1+ parts

$1.410

100+ parts

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1,445

$1.410

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$1.522

100+ parts

$1.446

1k+ parts

$1.446

10k+ parts

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60

$1.522

$1.446

$1.446

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Ampacity Inc.

Singapore . 1,091 parts In-Stock

1+ parts

$2.310

100+ parts

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1,091

$2.310

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Semicontronic

India . 1,019 parts In-Stock

1+ parts

$2.310

100+ parts

$2.252

1k+ parts

$2.241

10k+ parts

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1,019

$2.310

$2.252

$2.241

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Corphita

USA . 873 parts In-Stock

1+ parts

$2.646

100+ parts

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873

$2.646

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Component Stockers USA

USA . 20,167 parts In-Stock

1+ parts

$3.050

100+ parts

$3.050

1k+ parts

$2.600

10k+ parts

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20,167

$3.050

$3.050

$2.600

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$5.214

100+ parts

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$5.005

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500

$5.214

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$5.005

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Benley Electronics

USA . 8 parts In-Stock

1+ parts

$7.500

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8

$7.500

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Microchip USA

USA . 4,967 parts In-Stock

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$28.023

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4,967

$28.023

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Lixinc

USA . 14,321 parts In-Stock

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14,321

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Eastek

USA . 10,000 parts In-Stock

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$4.654

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$4.654

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Argo Parts USA

USA . 3,790 parts In-Stock

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3,790

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Continental Prestige Electronics

USA . 1,557 parts In-Stock

1+ parts

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$4.840

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1,557

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$4.840

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GreenTree Electronics

Israel . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Discover the power and efficiency of the IPB065N15N3GATMA1 by Infineon Technologies. This high-quality Power Field Effect Transistor (FET) offers unparalleled performance in switching applications, thanks to its N-CHANNEL configuration and built-in diode. With a maximum pulsed drain current of 520A and a minimum DS breakdown voltage of 150V, this FET ensures reliable operation under various conditions. Whether you're designing industrial equipment or automotive systems, this transistor's metal-oxide semiconductor technology and low on-resistance of 0.0065 ohm provide unmatched value and benefits for your projects. Upgrade your designs with the IPB065N15N3GATMA1 and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics than P-channel FETs, making them suitable for high efficiency and power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and can help protect against reverse polarity and voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing efficient and reliable performance in various electronic circuits.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and enabling automated assembly processes.

Minimum DS Breakdown Voltage: 150 V

With a high breakdown voltage, this FET can handle higher voltages, making it suitable for high-power applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB and easy alignment during assembly.

Terminal Form: GULL WING

The gull wing terminals provide a strong and reliable connection to the PCB, ensuring stable performance under various conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off devices, allowing for easier control of the switching operation.

Maximum Pulsed Drain Current (IDM): 520 A

The high pulsed drain current rating enables the FET to handle large current spikes without overheating or damage.

Avalanche Energy Rating (EAS): 780 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage transients and surges, increasing its reliability in harsh conditions.

No. of Terminals: 6

Having 6 terminals allows for flexibility in circuit design and connectivity options, enhancing the FET's versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB while providing adequate protection and heat dissipation for the FET.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, low power consumption, and reliability, making it suitable for a wide range of applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation, making it suitable for industrial and automotive applications.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its stability, efficiency, and cost-effectiveness, making it a suitable choice for FETs.

Terminal Finish: TIN

Tin provides a reliable and corrosion-resistant finish for the terminals, ensuring long-term performance and connectivity.

Maximum Drain Current (ID): 130 A

With a high maximum drain current rating, this FET can handle significant power loads, making it suitable for high-current applications.

Maximum Drain-Source On Resistance: 0.0065 ohm

The low drain-source on resistance minimizes power loss and heat generation in the FET, ensuring efficient operation and improved overall performance.

Terminal Position: SINGLE

A single terminal position simplifies the connection and installation process, improving the overall reliability and ease of use of the FET.

Case Connection: DRAIN

The drain case connection allows for efficient heat dissipation, ensuring the FET can handle high power loads without overheating.

Technical Specifications

Power Field Effect Transistors (FET) IPB065N15N3GATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

780 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (ID):

130 A

Maximum Drain-Source On Resistance:

.0065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

520 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB065N15N3GATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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