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FDBL0630N150

Onsemi

FDBL0630N150 by Onsemi

FDBL0630N150 by Onsemi is a Power FET with 150V DS Breakdown Voltage, 169A Drain Current, and 0.0063 ohm On Resistance. Ideal for switching applications due to its N-CHANNEL configuration and built-in diode. Operates in Enhancement Mode with fast turn-on/off times of 80ns/130ns at temperatures ranging from -55°C to 175°C.

Median Price

$5.580

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 876 parts In-Stock

1+ parts

$4.420

100+ parts

$2.330

1k+ parts

$2.120

10k+ parts

-

876

$4.420

$2.330

$2.120

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DigiKey

USA . 2,874 parts In-Stock

1+ parts

$6.740

100+ parts

$3.344

1k+ parts

-

10k+ parts

$2.732

2,874

$6.740

$3.344

-

$2.732

Mouser Electronics

USA . 2,257 parts In-Stock

1+ parts

$7.490

100+ parts

$3.670

1k+ parts

$3.280

10k+ parts

-

2,257

$7.490

$3.670

$3.280

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Newark

USA . 342 parts In-Stock

1+ parts

$7.710

100+ parts

$3.790

1k+ parts

$3.620

10k+ parts

-

342

$7.710

$3.790

$3.620

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Rochester

USA . 1,456 parts In-Stock

1+ parts

-

100+ parts

$2.880

1k+ parts

$2.580

10k+ parts

$2.420

1,456

-

$2.880

$2.580

$2.420

Verical

USA . 1,456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.225

10k+ parts

$3.025

1,456

-

-

$3.225

$3.025

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Greenchips

USA . 2,000 parts In-Stock

1+ parts

$2.712

100+ parts

$2.583

1k+ parts

$2.460

10k+ parts

$2.220

2,000

$2.712

$2.583

$2.460

$2.220

Digiode

USA . 474 parts In-Stock

1+ parts

$2.888

100+ parts

-

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-

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474

$2.888

-

-

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Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$3.210

100+ parts

-

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-

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38

$3.210

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-

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Chip Stock

USA . 25,000 parts In-Stock

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25,000

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Component Sense

UK . 6,351 parts In-Stock

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6,351

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Vyrian

USA . 2,241 parts In-Stock

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2,241

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SIE Connect GmbH - GreenChips

Germany . 2,000 parts In-Stock

1+ parts

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2,000

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Cyclops Electronics Ltd

UK . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,064 parts In-Stock

1+ parts

$1.939

100+ parts

-

1k+ parts

-

10k+ parts

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3,064

$1.939

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-

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Semicontronic

India . 1,905 parts In-Stock

1+ parts

$1.980

100+ parts

$1.930

1k+ parts

$1.921

10k+ parts

-

1,905

$1.980

$1.930

$1.921

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Ampacity Inc.

Singapore . 1,994 parts In-Stock

1+ parts

$2.580

100+ parts

-

1k+ parts

-

10k+ parts

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1,994

$2.580

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Corohmni

South Africa . 164 parts In-Stock

1+ parts

$2.651

100+ parts

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164

$2.651

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Corphita

USA . 2,695 parts In-Stock

1+ parts

$2.736

100+ parts

-

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2,695

$2.736

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$3.146

100+ parts

-

1k+ parts

$3.020

10k+ parts

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2,000

$3.146

-

$3.020

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Component Stockers USA

USA . 3,890 parts In-Stock

1+ parts

$3.150

100+ parts

$2.960

1k+ parts

$2.680

10k+ parts

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3,890

$3.150

$2.960

$2.680

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Argo Parts USA

USA . 3,113 parts In-Stock

1+ parts

$3.210

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3,113

$3.210

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Continental Prestige Electronics

USA . 1,021 parts In-Stock

1+ parts

$5.300

100+ parts

$3.560

1k+ parts

$2.500

10k+ parts

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1,021

$5.300

$3.560

$2.500

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Microchip USA

USA . 8,420 parts In-Stock

1+ parts

$19.076

100+ parts

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8,420

$19.076

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Lixinc

USA . 17,613 parts In-Stock

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17,613

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Perfect Parts

USA . 15,618 parts In-Stock

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15,618

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A-Z Elektronik GmbH

Germany . 6,711 parts In-Stock

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6,711

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Problanco Electronics

Mexico . 4,760 parts In-Stock

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4,760

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SupplyDigital Components

Austria . 4,511 parts In-Stock

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4,511

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Alle Elektronik GmbH

Germany . 4,474 parts In-Stock

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4,474

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TANS Electronics

Latvia . 3,455 parts In-Stock

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3,455

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Kulean Microsystems

USA . 1,714 parts In-Stock

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1,714

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Supply Digital

USA . 960 parts In-Stock

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960

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UHIMA Technologies

Türkiye . 557 parts In-Stock

1+ parts

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557

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Overview

Experience the power of efficiency and reliability with the FDBL0630N150 by Onsemi. Crafted by a trusted manufacturer, this N-Channel Power Field Effect Transistor offers superior performance in switching applications. With a built-in diode and a high DS breakdown voltage of 150V, this transistor ensures seamless operation. Whether you're looking to enhance your electronic devices or streamline your power systems, the FDBL0630N150 provides the perfect solution. Trust Onsemi for quality components that deliver unmatched value and benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the FET, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher efficiency compared to P-channel FETs, making them a popular choice for switching applications.

Minimum DS Breakdown Voltage: 150 V

With a high breakdown voltage, this FET can handle higher voltages, making it suitable for a variety of high-power applications.

Maximum Drain Current (ID): 169 A

The high drain current rating allows for handling large amounts of current, making this FET suitable for high-power applications.

Maximum Power Dissipation (Abs): 500 W

With a high power dissipation rating, this FET can handle significant amounts of power without overheating.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows for reliable operation in various environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) FDBL0630N150 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

502 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

169 A

Maximum Drain Current (ID):

169 A

Maximum Drain-Source On Resistance:

.0063 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

16 pF

JEDEC-95 Code:

MO-299A

JESD-30 Code:

R-PSSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

130 ns

Maximum Turn On Time (ton):

80 ns

Trade Compliance

FDBL0630N150 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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