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FDBL0210N80

Onsemi

FDBL0210N80 by Onsemi

FDBL0210N80 by Onsemi is a N-CHANNEL Power FET with 80V DS Breakdown Voltage, ideal for SWITCHING applications. It features a built-in DIODE, 0.002 ohm RDS(on), and 240A ID max. Operating from -55 to 175 °C, this MOSFET has a PLASTIC/EPOXY package in SMALL OUTLINE style for surface mount assembly.

Median Price

$2.927

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,000 parts In-Stock

1+ parts

$2.442

100+ parts

-

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2,000

$2.442

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Mouser Electronics

USA . 3,808 parts In-Stock

1+ parts

$6.430

100+ parts

$3.360

1k+ parts

$3.140

10k+ parts

-

3,808

$6.430

$3.360

$3.140

-

DigiKey

USA . 3,349 parts In-Stock

1+ parts

$6.760

100+ parts

$3.353

1k+ parts

-

10k+ parts

$2.739

3,349

$6.760

$3.353

-

$2.739

Rochester

USA . 383,276 parts In-Stock

1+ parts

-

100+ parts

$2.750

1k+ parts

$2.460

10k+ parts

$2.310

383,276

-

$2.750

$2.460

$2.310

Farnell

UK . 381,866 parts In-Stock

1+ parts

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$2.760

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381,866

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$2.760

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Verical

USA . 352,116 parts In-Stock

1+ parts

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$3.075

10k+ parts

$2.888

352,116

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-

$3.075

$2.888

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

-

100+ parts

$2.927

1k+ parts

$2.580

10k+ parts

$2.539

2,000

-

$2.927

$2.580

$2.539

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,191 parts In-Stock

1+ parts

$2.888

100+ parts

-

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1,191

$2.888

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Vyrian

USA . 161,011 parts In-Stock

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161,011

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IBS Electronics

USA . 16,000 parts In-Stock

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$8.794

16,000

-

-

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$8.794

Chip Stock

USA . 15,500 parts In-Stock

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15,500

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NAC Semi

USA . 12,000 parts In-Stock

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$8.960

12,000

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$8.960

Flip Electronics

USA . 1,101 parts In-Stock

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1,101

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Nova Conductors

Japan . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 5,461 parts In-Stock

1+ parts

$1.308

100+ parts

-

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5,461

$1.308

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Ampacity Inc.

Singapore . 160,838 parts In-Stock

1+ parts

$2.350

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160,838

$2.350

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Corphita

USA . 435 parts In-Stock

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$2.736

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435

$2.736

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Corohmni

South Africa . 206 parts In-Stock

1+ parts

$2.760

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206

$2.760

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Microchip USA

USA . 5,627 parts In-Stock

1+ parts

$19.125

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5,627

$19.125

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Continental Prestige Electronics

USA . 353,678 parts In-Stock

1+ parts

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100+ parts

$3.650

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353,678

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$3.650

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A-Z Elektronik GmbH

Germany . 7,316 parts In-Stock

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7,316

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TANS Electronics

Latvia . 7,294 parts In-Stock

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Kulean Microsystems

USA . 5,064 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,877 parts In-Stock

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SupplyDigital Components

Austria . 3,762 parts In-Stock

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Supply Digital

USA . 1,603 parts In-Stock

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Lixinc

USA . 1,511 parts In-Stock

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Problanco Electronics

Mexico . 1,156 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 817 parts In-Stock

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817

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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UHIMA Technologies

Türkiye . 344 parts In-Stock

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344

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Overview

Discover the power of the FDBL0210N80 by Onsemi, a high-quality N-CHANNEL Power Field Effect Transistor with a built-in diode for enhanced performance in switching applications. Manufactured by Onsemi, a trusted name in semiconductor technology, this transistor offers unrivaled reliability and efficiency. Ideal for a wide range of applications, this transistor provides seamless operation even in challenging conditions. Elevate your projects with the value and benefits of the FDBL0210N80, delivering maximum performance and durability for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and faster switching speeds, making them more efficient for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Minimum DS Breakdown Voltage: 80 V

With a minimum breakdown voltage of 80 V, this FET can handle higher voltages without damage, making it suitable for a wide range of applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, making this FET a dependable choice for electronic devices.

Maximum Operating Temperature: 175 °C

Can operate efficiently at high temperatures without compromising performance, ideal for applications where heat dissipation is a concern.

Maximum Drain Current (ID): 240 A

Capable of handling high current loads, making it suitable for power applications where a large amount of current is required.

Maximum Drain-Source On Resistance: 0.002 ohm

Low ON resistance ensures minimal power loss and heat generation during operation, improving overall efficiency.

Technical Specifications

Power Field Effect Transistors (FET) FDBL0210N80 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

512 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

240 A

Maximum Drain-Source On Resistance:

.002 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MO-299A

JESD-30 Code:

R-PSSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDBL0210N80 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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