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FDBL86063-F085

Onsemi

FDBL86063-F085 by Onsemi

FDBL86063-F085 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a max ID of 240A and 0.0026 ohm Drain-Source Resistance. Operating in ENHANCEMENT MODE, this transistor has an EAS of 160mJ and can handle up to 357W power dissipation.

Median Price

$5.242

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 5,113 parts In-Stock

1+ parts

$6.270

100+ parts

$4.630

1k+ parts

$3.330

10k+ parts

$3.030

5,113

$6.270

$4.630

$3.330

$3.030

Mouser Electronics

USA . 187 parts In-Stock

1+ parts

$7.900

100+ parts

$4.140

1k+ parts

$3.870

10k+ parts

-

187

$7.900

$4.140

$3.870

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Rochester

USA . 32,025 parts In-Stock

1+ parts

-

100+ parts

$3.370

1k+ parts

$3.020

10k+ parts

$2.840

32,025

-

$3.370

$3.020

$2.840

Verical

USA . 28,489 parts In-Stock

1+ parts

-

100+ parts

$4.213

1k+ parts

$3.775

10k+ parts

$3.550

28,489

-

$4.213

$3.775

$3.550

Flip Electronics (Authorized)

USA . 10,000 parts In-Stock

1+ parts

-

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-

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10,000

-

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Distributors (In-Stock)

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Digiode

USA . 380 parts In-Stock

1+ parts

$3.572

100+ parts

-

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-

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380

$3.572

-

-

-

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$3.970

100+ parts

-

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-

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15

$3.970

-

-

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Vyrian

USA . 18,014 parts In-Stock

1+ parts

-

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18,014

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Chip Stock

USA . 17,500 parts In-Stock

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-

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17,500

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Flip Electronics

USA . 13,571 parts In-Stock

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-

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13,571

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,629 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

-

10k+ parts

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3,629

$1.500

-

-

-

Semicontronic

India . 28,289 parts In-Stock

1+ parts

$3.200

100+ parts

$3.120

1k+ parts

$3.104

10k+ parts

-

28,289

$3.200

$3.120

$3.104

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Ampacity Inc.

Singapore . 14,560 parts In-Stock

1+ parts

$3.200

100+ parts

-

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-

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14,560

$3.200

-

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Corphita

USA . 230 parts In-Stock

1+ parts

$3.384

100+ parts

-

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230

$3.384

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Corohmni

South Africa . 196 parts In-Stock

1+ parts

$3.760

100+ parts

-

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196

$3.760

-

-

-

Bastille Electronics

Australia . 668 parts In-Stock

1+ parts

$3.970

100+ parts

$3.772

1k+ parts

$3.583

10k+ parts

$3.533

668

$3.970

$3.772

$3.583

$3.533

Argo Parts USA

USA . 3,560 parts In-Stock

1+ parts

$3.970

100+ parts

-

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3,560

$3.970

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-

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Continental Prestige Electronics

USA . 1,282 parts In-Stock

1+ parts

$3.970

100+ parts

-

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10k+ parts

$3.891

1,282

$3.970

-

-

$3.891

Microchip USA

USA . 6,609 parts In-Stock

1+ parts

$24.222

100+ parts

-

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6,609

$24.222

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-

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Eastek

USA . 14,000 parts In-Stock

1+ parts

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$6.450

10k+ parts

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14,000

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$6.450

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Problanco Electronics

Mexico . 7,524 parts In-Stock

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7,524

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SupplyDigital Components

Austria . 6,258 parts In-Stock

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6,258

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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TANS Electronics

Latvia . 5,271 parts In-Stock

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Lixinc

USA . 5,033 parts In-Stock

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5,033

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Perfect Parts

USA . 1,294 parts In-Stock

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1,294

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UHIMA Technologies

Türkiye . 759 parts In-Stock

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759

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Kulean Microsystems

USA . 199 parts In-Stock

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199

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Overview

Unleash the power of innovation with the FDBL86063-F085 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors designed for switching applications. With a single configuration and built-in diode, this N-CHANNEL transistor offers unparalleled performance and reliability. Whether you're looking to optimize power management or enhance efficiency, this product guarantees maximum value and benefits for all your electronic projects. Trust Onsemi to provide cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides a durable and lightweight housing for the FET, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher current capabilities compared to P-channel FETs, making them ideal for high-power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and reverse current protection, enhancing the overall performance of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and low on-state resistance for efficient power control.

Surface Mount: YES

The surface mount capability of this FET enables easy integration into compact electronic devices and PCBs, saving space and simplifying manufacturing processes.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100 V, this FET can handle high voltage levels without risk of damage, ensuring reliable operation in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape offers a standardized form factor for easy mounting and handling, enhancing compatibility with existing designs.

Terminal Form: FLAT

The flat terminal form allows for secure solder connections and efficient heat dissipation, contributing to the overall reliability and performance of the FET.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer lower power consumption and faster response times compared to depletion mode FETs, making them well-suited for a wide range of applications.

Avalanche Energy Rating (EAS): 160 mJ

The high avalanche energy rating of 160 mJ ensures that the FET can withstand transient voltage spikes and overloads, enhancing overall robustness and reliability.

Technical Specifications

Power Field Effect Transistors (FET) FDBL86063-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

160 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

240 A

Maximum Drain Current (ID):

240 A

Maximum Drain-Source On Resistance:

.0026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MO-299A

JESD-30 Code:

R-PSSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

51 ns

Maximum Turn On Time (ton):

53 ns

Trade Compliance

FDBL86063-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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