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FDBL0110N60

Onsemi

FDBL0110N60 by Onsemi

FDBL0110N60 by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage. It is used for SWITCHING applications in ENHANCEMENT MODE, featuring a Drain Current of 300A and Drain-Source Resistance of 0.0011 ohm. This PLASTIC/EPOXY transistor operates b/w -55 to 175 °C, suitable for surface mount designs.

Median Price

$2.890

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 4,745 parts In-Stock

1+ parts

$5.530

100+ parts

$2.740

1k+ parts

$2.210

10k+ parts

-

4,745

$5.530

$2.740

$2.210

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Newark

USA . 3,244 parts In-Stock

1+ parts

$7.760

100+ parts

$3.910

1k+ parts

$3.700

10k+ parts

-

3,244

$7.760

$3.910

$3.700

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Element14

Singapore . 5,450 parts In-Stock

1+ parts

$8.850

100+ parts

$6.020

1k+ parts

$4.590

10k+ parts

$4.180

5,450

$8.850

$6.020

$4.590

$4.180

Flip Electronics (Authorized)

USA . 8,000 parts In-Stock

1+ parts

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8,000

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DigiKey

USA . 6,000 parts In-Stock

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$2.090

6,000

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$2.090

Rochester

USA . 2,287 parts In-Stock

1+ parts

-

100+ parts

$2.890

1k+ parts

$2.580

10k+ parts

$2.430

2,287

-

$2.890

$2.580

$2.430

Arrow

USA . 2,000 parts In-Stock

1+ parts

-

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$2.872

2,000

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$2.872

Verical

USA . 2,000 parts In-Stock

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$2.872

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$2.872

Distributors (In-Stock)

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Digiode

USA . 2,950 parts In-Stock

1+ parts

$3.050

100+ parts

-

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2,950

$3.050

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.920

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10

$3.920

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Flip Electronics

USA . 6,000 parts In-Stock

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Chip Stock

USA . 5,500 parts In-Stock

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Vyrian

USA . 4,372 parts In-Stock

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4,372

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North Shore Components

USA . 107 parts In-Stock

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107

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Distributors (Availability)

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$1.004

100+ parts

$0.914

1k+ parts

$0.823

10k+ parts

-

5,000

$1.004

$0.914

$0.823

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Ampacity Inc.

Singapore . 4,496 parts In-Stock

1+ parts

$2.210

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4,496

$2.210

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Corphita

USA . 754 parts In-Stock

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$2.889

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754

$2.889

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Corohmni

South Africa . 56 parts In-Stock

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$3.210

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56

$3.210

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Argo Parts USA

USA . 1,594 parts In-Stock

1+ parts

$3.920

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1,594

$3.920

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Continental Prestige Electronics

USA . 1,249 parts In-Stock

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$3.920

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$3.842

1,249

$3.920

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$3.842

Netroflash

USA . 500 parts In-Stock

1+ parts

$3.920

100+ parts

$3.842

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500

$3.920

$3.842

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Component Stockers USA

USA . 4,419 parts In-Stock

1+ parts

$4.620

100+ parts

$4.390

1k+ parts

$4.250

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4,419

$4.620

$4.390

$4.250

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iodParts Technologies Inc.

India . 19,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,144 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,930 parts In-Stock

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Microchip USA

USA . 5,045 parts In-Stock

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Lixinc

USA . 4,787 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,620 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Perfect Parts

USA . 4,385 parts In-Stock

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SupplyDigital Components

Austria . 4,381 parts In-Stock

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Kulean Microsystems

USA . 2,932 parts In-Stock

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TANS Electronics

Latvia . 2,907 parts In-Stock

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Problanco Electronics

Mexico . 2,164 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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UHIMA Technologies

Türkiye . 494 parts In-Stock

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494

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Supply Digital

USA . 462 parts In-Stock

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462

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GreenTree Electronics

Israel . 55 parts In-Stock

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55

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Overview

Unlock the power of efficient switching with the Onsemi FDBL0110N60 Power Field Effect Transistor. Manufactured by a trusted industry leader, this N-CHANNEL transistor offers reliable performance and a built-in diode for added convenience. Ideal for various applications, this transistor provides enhanced functionality and durability. Experience seamless operation and superior quality with the FDBL0110N60, delivering value and benefits to customers seeking top-notch performance in their electronic devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FET, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower conduction losses, making them a more efficient option for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can help protect against voltage spikes, making this FET a convenient choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high performance and reliability in controlling current flow.

Surface Mount: YES

With surface mount capability, this FET can be easily mounted on a PCB, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures reliable performance in high voltage applications, making this FET a safe and efficient choice.

Package Shape: RECTANGULAR

The rectangular shape offers compatibility with standard PCB layouts and allows for easy integration into existing systems.

Terminal Form: FLAT

The flat terminal shape provides a secure connection and allows for efficient heat dissipation, enhancing the overall performance of the FET.

Operating Mode: ENHANCEMENT MODE

This mode allows for improved control over the FET's conductivity, making it ideal for precise switching applications.

Avalanche Energy Rating (EAS): 1167 mJ

The high avalanche energy rating ensures the FET can handle sudden power surges or spikes, enhancing its reliability in demanding conditions.

Technical Specifications

Power Field Effect Transistors (FET) FDBL0110N60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1167 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

300 A

Maximum Drain-Source On Resistance:

.0011 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MO-299A

JESD-30 Code:

R-PSSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDBL0110N60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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