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BSC320N20NS3GATMA1

Infineon Technologies

BSC320N20NS3GATMA1 by Infineon Technologies

BSC320N20NS3GATMA1 by Infineon is a N-CHANNEL FET with 200V DS breakdown voltage, 144A pulsed drain current, and 0.032 ohm max on resistance. Ideal for switching applications due to its single configuration with built-in diode and enhancement mode operation. Package style is small outline, suitable for surface mount technology.

Median Price

$1.302

Lifecycle Status

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27

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Arrow

USA . 2,474 parts In-Stock

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$1.182

100+ parts

$0.972

1k+ parts

$0.872

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2,474

$1.182

$0.972

$0.872

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Newark

USA . 1,599 parts In-Stock

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$1.200

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$1.200

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$1.200

$1.200

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Chip1Stop

Japan . 1,908 parts In-Stock

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$1.270

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Mouser Electronics

USA . 11,317 parts In-Stock

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$3.120

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$1.480

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$1.160

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$1.090

11,317

$3.120

$1.480

$1.160

$1.090

RS (Exports)

UK . 8,648 parts In-Stock

1+ parts

$3.286

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$1.803

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DigiKey

USA . 13,343 parts In-Stock

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$4.170

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$1.888

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$1.421

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$1.326

13,343

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$1.888

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$1.326

EBV Elektronik

Germany . 80,000 parts In-Stock

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Element14

Singapore . 79,114 parts In-Stock

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$1.732

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$1.658

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Farnell

UK . 51,856 parts In-Stock

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$2.303

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$1.658

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$1.620

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Avnet

USA . 35,000 parts In-Stock

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$0.838

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Rochester

USA . 25,858 parts In-Stock

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$1.280

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$1.060

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Verical

USA . 21,158 parts In-Stock

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$1.325

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$1.184

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Future Electronics

Canada . 15,000 parts In-Stock

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$0.970

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Digiode

USA . 228 parts In-Stock

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$1.083

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Nova Conductors

Japan . 600 parts In-Stock

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Vyrian

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IBS Electronics

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NAC Semi

USA . 25,000 parts In-Stock

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$1.840

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Chip Stock

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Rutronik

Germany . 10,000 parts In-Stock

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Sensible Micro Corp

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Semtec, LLC

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Component Sense

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VNN

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Cyclops Electronics Ltd

UK . 450 parts In-Stock

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Bristol Electronics

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NexGen Digital

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Ampacity Inc.

Singapore . 31,088 parts In-Stock

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$0.750

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$0.750

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Semicontronic

India . 29,066 parts In-Stock

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$0.750

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$0.731

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$0.728

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Corohmni

South Africa . 230 parts In-Stock

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$0.806

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Corphita

USA . 698 parts In-Stock

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$1.026

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Modulus Dynamics

Lithuania . 18,086 parts In-Stock

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$1.221

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$1.172

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$1.123

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Aztec Data Supply Inc.

USA . 246 parts In-Stock

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$1.326

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$1.856

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$1.763

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$1.763

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$1.856

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Argo Parts USA

USA . 2,512 parts In-Stock

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$2.110

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Netroflash

USA . 2,000 parts In-Stock

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$2.110

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$2.004

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$1.962

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$2.110

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Benley Electronics

USA . 1 parts In-Stock

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$7.500

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Microchip USA

USA . 2,372 parts In-Stock

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$10.531

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RC Electronics

USA . 32,001 parts In-Stock

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$2.470

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$2.250

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$2.190

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QUARKTWIN TECHNOLOGY LTD

USA . 26,984 parts In-Stock

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Perfect Parts

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Robosynatics

Brazil . 20,950 parts In-Stock

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Lucentia Tech

USA . 20,950 parts In-Stock

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$0.445

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$0.436

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$0.436

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Continental Prestige Electronics

USA . 14,446 parts In-Stock

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$1.970

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$1.370

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Glotronic Ltd.

UK . 12,000 parts In-Stock

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Lixinc

USA . 8,282 parts In-Stock

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Authorized Procurement Solutions

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iodParts Technologies Inc.

India . 3,062 parts In-Stock

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$3.274

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$2.910

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A-Z Elektronik GmbH

Germany . 2,360 parts In-Stock

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GreenTree Electronics

Israel . 121 parts In-Stock

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Overview

Unlock the power of high-quality performance with the BSC320N20NS3GATMA1 by Infineon Technologies. As a leader in the field of Power Field Effect Transistors, Infineon Technologies has crafted a product that delivers seamless switching capabilities for a wide range of applications. With a single configuration and built-in diode, this N-CHANNEL transistor offers enhanced efficiency and reliability. Whether you're looking to optimize energy consumption or improve overall system performance, the BSC320N20NS3GATMA1 is the perfect solution. Trust in the expertise of Infineon Technologies to provide top-of-the-line technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching and control of current flow in the circuit.

Minimum DS Breakdown Voltage: 200 V

Can handle high voltage applications with a safety margin, reducing the risk of breakdown.

Maximum Drain Current (ID): 36 A

Capable of handling high current loads, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.032 ohm

Low on-resistance leads to minimal power loss and efficient operation.

Avalanche Energy Rating (EAS): 190 mJ

Provides protection against voltage spikes and surges in the circuit.

Maximum Pulsed Drain Current (IDM): 144 A

Capable of handling short-duration high current spikes, improving reliability.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode prevents reverse current flow and offers added protection to the circuit.

Transistor Application: SWITCHING

Designed specifically for efficient switching applications, ensuring fast response times.

Package Shape: RECTANGULAR

Space-saving design that allows for efficient placement on the circuit board.

Terminal Finish: TIN

Provides good electrical conductivity and corrosion resistance for reliable connections.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, making it suitable for a wide range of operating environments.

Technical Specifications

Power Field Effect Transistors (FET) BSC320N20NS3GATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

190 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

36 A

Maximum Drain-Source On Resistance:

.032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

144 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC320N20NS3GATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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