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BSC350N20NSFDATMA1

Infineon Technologies

BSC350N20NSFDATMA1 by Infineon Technologies

Infineon BSC350N20NSFDATMA1 is a N-CHANNEL FET with 200V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 140A IDM, 97mJ EAS, and 0.035 ohm RDS(ON). With ENHANCEMENT MODE operation and DUAL terminal position, it offers high performance in a SMALL OUTLINE package.

Median Price

$2.040

Lifecycle Status

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20

In-Stock Inventory

1k+

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Chip1Stop

Japan . 1,700 parts In-Stock

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$1.490

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$1.490

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Arrow

USA . 29 parts In-Stock

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$1.499

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$1.449

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29

$1.499

$1.449

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Farnell

UK . 1 parts In-Stock

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$2.960

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1

$2.960

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Mouser Electronics

USA . 6,899 parts In-Stock

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$3.150

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$1.690

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$1.380

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$1.350

6,899

$3.150

$1.690

$1.380

$1.350

DigiKey

USA . 17 parts In-Stock

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$4.930

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$4.930

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Future Electronics

Canada . 15,000 parts In-Stock

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$1.510

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Avnet

USA . 5,000 parts In-Stock

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RS (Exports)

UK . 3,725 parts In-Stock

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$2.629

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$2.262

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3,725

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$2.629

$2.262

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Rochester

USA . 1,697 parts In-Stock

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$1.330

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$1.190

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$1.120

1,697

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$1.120

Verical

USA . 29 parts In-Stock

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$1.449

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29

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Element14

Singapore . 1 parts In-Stock

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$2.570

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$1.730

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1

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$1.730

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Digiode

USA . 965 parts In-Stock

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$1.406

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Nova Conductors

Japan . 500 parts In-Stock

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$2.130

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500

$2.130

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Maritex

Poland . 318 parts In-Stock

1+ parts

$4.149

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$3.000

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$2.433

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318

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Chip Stock

USA . 23,500 parts In-Stock

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Vyrian

USA . 6,951 parts In-Stock

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Rutronik

Germany . 5,000 parts In-Stock

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$1.420

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VNN

France . 2,522 parts In-Stock

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Inventory MP

USA . 1,144 parts In-Stock

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Bristol Electronics

USA . 524 parts In-Stock

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Semicontronic

India . 7,767 parts In-Stock

1+ parts

$1.050

100+ parts

$1.024

1k+ parts

$1.018

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7,767

$1.050

$1.024

$1.018

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Ampacity Inc.

Singapore . 6,949 parts In-Stock

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$1.050

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$1.050

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Aztec Data Supply Inc.

USA . 341 parts In-Stock

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$1.207

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Corphita

USA . 344 parts In-Stock

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$1.332

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Corohmni

South Africa . 30 parts In-Stock

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$1.490

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Modulus Dynamics

Lithuania . 21,520 parts In-Stock

1+ parts

$1.883

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$1.808

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$1.732

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Argo Parts USA

USA . 2,142 parts In-Stock

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$2.130

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Continental Prestige Electronics

USA . 7,207 parts In-Stock

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$3.190

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$2.070

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$1.450

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RC Electronics

USA . 38,359 parts In-Stock

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Lixinc

USA . 15,622 parts In-Stock

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Authorized Procurement Solutions

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Advanced Electronics

New Zealand . 50 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of innovation with the BSC350N20NSFDATMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-notch quality and reliability in their Power Field Effect Transistors (FET). This N-CHANNEL transistor with a built-in diode is perfect for switching applications, offering a breakthrough in performance and efficiency. Experience seamless operation with its small outline package and impressive features like a minimum DS Breakdown Voltage of 200V and a Maximum Pulsed Drain Current of 140A. Trust in Infineon to deliver cutting-edge technology that brings value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good insulation and mechanical protection, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally more efficient and have lower resistance compared to P-channel FETs, resulting in better performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides a path for reverse current protection, enhancing the reliability of the transistor in high voltage applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid switching operations with minimal power loss.

Maximum Pulsed Drain Current (IDM): 140 A

The high pulsed drain current rating allows the FET to handle short-duration peak loads effectively, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 97 mJ

With a high avalanche energy rating, this FET can withstand transient voltage spikes without damage, ensuring long-term reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making this FET suitable for energy-efficient applications.

Maximum Drain-Source On Resistance: 0.035 ohm

The low on-resistance of the FET results in reduced power losses and higher efficiency in conducting current, making it an ideal choice for high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) BSC350N20NSFDATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

97 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

35 A

Maximum Drain-Source On Resistance:

.035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

140 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC350N20NSFDATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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