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BSC340N08NS3G

Infineon Technologies

BSC340N08NS3G by Infineon Technologies

BSC340N08NS3G by Infineon is a N-CHANNEL FET for SWITCHING applications. Features 80V DS Breakdown Voltage, 92A IDM, and 0.034 ohm RDS(on). Operates in ENHANCEMENT MODE with 32W power dissipation. Ideal for high-power switching circuits requiring fast response times.

Median Price

$0.956

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 26,480 parts In-Stock

1+ parts

$1.590

100+ parts

$0.647

1k+ parts

$0.435

10k+ parts

$0.337

26,480

$1.590

$0.647

$0.435

$0.337

Verical

USA . 35,000 parts In-Stock

1+ parts

-

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$0.321

35,000

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$0.321

Distributors (In-Stock)

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Maritex

Poland . 4,791 parts In-Stock

1+ parts

$0.580

100+ parts

$0.343

1k+ parts

$0.321

10k+ parts

$0.281

4,791

$0.580

$0.343

$0.321

$0.281

Component Electronics Inc.

Canada . 7,379 parts In-Stock

1+ parts

$0.650

100+ parts

$0.490

1k+ parts

$0.430

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7,379

$0.650

$0.490

$0.430

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Digiode

USA . 672 parts In-Stock

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$0.836

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672

$0.836

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Atlantic Semiconductor

USA . 62,157 parts In-Stock

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Vyrian

USA . 40,826 parts In-Stock

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40,826

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Cyclops Electronics Ltd

UK . 22,344 parts In-Stock

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J2 Sourcing AB

Sweden . 5,008 parts In-Stock

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Rutronik

Germany . 5,000 parts In-Stock

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$0.239

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$0.239

Infinite Electronics LLP

India . 5,000 parts In-Stock

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Sensible Micro Corp

USA . 4,688 parts In-Stock

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VNN

France . 2,261 parts In-Stock

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2,261

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Inventory MP

USA . 1,872 parts In-Stock

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Bristol Electronics

USA . 1,672 parts In-Stock

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1,672

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Odintec Ltd.

Israel . 100 parts In-Stock

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100

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Nova Conductors

Japan . 10 parts In-Stock

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10

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ComSIT Distribution GmbH

Germany . 5 parts In-Stock

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ComSIT USA

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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Semicontronic

India . 40,580 parts In-Stock

1+ parts

$0.273

100+ parts

$0.266

1k+ parts

$0.265

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40,580

$0.273

$0.266

$0.265

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Ampacity Inc.

Singapore . 40,571 parts In-Stock

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$0.273

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40,571

$0.273

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Corphita

USA . 154 parts In-Stock

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$0.792

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154

$0.792

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Corohmni

South Africa . 828 parts In-Stock

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$1.122

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828

$1.122

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Modulus Dynamics

Lithuania . 17,530 parts In-Stock

1+ parts

$1.267

100+ parts

$1.216

1k+ parts

$1.166

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17,530

$1.267

$1.216

$1.166

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$1.814

100+ parts

$1.723

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$1.723

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$1.814

$1.723

$1.723

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Perfect Parts

USA . 105,517 parts In-Stock

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A-Z Elektronik GmbH

Germany . 20,800 parts In-Stock

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Kepictronics

USA . 5,500 parts In-Stock

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S.R.D Solutions

India . 5,000 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,003 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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Argo Parts USA

USA . 482 parts In-Stock

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Futuretech Components

Singapore . 165 parts In-Stock

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Lixinc

USA . 165 parts In-Stock

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Overview

Infineon Power MOSFETs are designed to bring more efficiency and power density to designers' products. The full range of OptiMOS™ and StrongIRFET™ N-channel Power MOSFETs enable innovation and performance in applications such as switch mode power supplies (SMPS), motor control and drives, inverters, and computing. The OptiMOS™ and StrongIRFET™ families cover the 20V to 300V range of Power MOSFET products. Infineon offers the OptiMOS™ and StrongIRFET™ product families. These are two highly innovative families that consistently meet the highest quality and performance demands in key specifications for power system design. OptiMOS™ is the market leader in highly efficient solutions for power generation, power supply, and power consumption.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower resistance compared to P-channel FETs, making them ideal for high-power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling of inductive loads, providing protection for the transistor and improving overall system reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation in power control circuits.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration onto PCBs, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 80 V

The high breakdown voltage ensures reliable operation and protection against voltage spikes and fluctuations.

Package Shape: RECTANGULAR

The rectangular shape provides a compact size and easy handling during installation, suitable for space-constrained environments.

Terminal Form: NO LEAD

The absence of leads simplifies soldering and mounting processes, enhancing overall product reliability and performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control and higher efficiency in switching applications, making them suitable for a wide range of power management tasks.

Maximum Pulsed Drain Current (IDM): 92 A

The high pulsed drain current rating allows the product to handle sudden surges in current, ensuring reliable performance in demanding conditions.

Avalanche Energy Rating (EAS): 20 mJ

The Avalanche energy rating indicates the ability of the FET to withstand energy spikes without damage, ensuring long-term durability in rugged environments.

No. of Terminals: 8

With a sufficient number of terminals, the FET provides flexible connectivity options and ease of integration into complex circuit designs.

Maximum Power Dissipation (Abs): 32 W

The high power dissipation rating ensures efficient heat dissipation, allowing the FET to operate at optimal performance levels under heavy loads.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices and applications where size is a critical factor.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high switching speeds and low on-resistance, delivering excellent performance in power control applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the FET can withstand elevated temperatures without sacrificing performance, ensuring reliable operation in harsh environmental conditions.

Transistor Element Material: SILICON

Silicon-based transistors offer high reliability, low leakage currents, and excellent thermal stability, making them an ideal choice for a wide range of power management applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the FET to function effectively in cold environments, ensuring consistent performance in a variety of operating conditions.

Terminal Finish: TIN

The tin terminal finish provides good solderability and corrosion resistance, ensuring secure electrical connections and long-term reliability in harsh environments.

Maximum Drain Current (ID): 23 A

The high drain current rating allows the FET to handle substantial current loads, making it suitable for high-power applications that require efficient switching control.

Maximum Drain-Source On Resistance: 0.034 ohm

The low on-resistance ensures minimal power loss and high efficiency in power switching applications, making the FET an excellent choice for energy-efficient designs.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit layout and offers multiple connection options, enabling versatile integration into various electronic systems.

Case Connection: DRAIN

The drain connection simplifies the circuit design and enhances the FET's performance in high-power applications where efficient current handling is essential.

Maximum Time At Peak Reflow Temperature (s): 40

The specified peak reflow temperature and time ensure proper soldering and mounting of the FET onto the PCB, preventing damage and ensuring reliable operation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for efficient soldering and secure attachment of the FET onto the PCB, maintaining electrical connections under harsh manufacturing conditions.

Technical Specifications

Power Field Effect Transistors (FET) BSC340N08NS3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

20 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

23 A

Maximum Drain-Source On Resistance:

.034 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

92 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC340N08NS3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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