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IRLML6401PBF

Infineon Technologies

IRLML6401PBF by Infineon Technologies

IRLML6401PBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 33mJ EAS. With ENHANCEMENT MODE operation, it has a -55 to 150 °C temperature range and 0.05 ohm RDS(on). Ideal for compact designs with its SMALL OUTLINE package style.

Median Price

$0.113

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 92 parts In-Stock

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$0.113

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Chip Stock

USA . 211,050 parts In-Stock

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Zilex Electronics Inc.

Canada . 5,360 parts In-Stock

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QIE Inc.

USA . 1,652 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,287 parts In-Stock

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Digiode

USA . 594 parts In-Stock

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Vyrian

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Avant Electronics Limited

UK . 195 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,609 parts In-Stock

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Argo Parts USA

USA . 2,662 parts In-Stock

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$0.113

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$0.110

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Modulus Dynamics

Lithuania . 24,956 parts In-Stock

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$0.113

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$0.108

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$0.104

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24,956

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Bastille Electronics

Australia . 4,815 parts In-Stock

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$0.113

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$0.107

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$0.102

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4,815

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Corohmni

South Africa . 1,032 parts In-Stock

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Advanced Electronics

New Zealand . 40 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,630 parts In-Stock

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$1.860

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Decca Corp

Germany . 411 parts In-Stock

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$7.050

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$6.909

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$6.840

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411

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AZTECH Wire

Italy . 769 parts In-Stock

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$10.658

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Ampacity Inc.

Singapore . 349 parts In-Stock

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$20.050

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Semicontronic

India . 686 parts In-Stock

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$50.050

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$48.799

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RC Electronics

USA . 51,085 parts In-Stock

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Corphita

USA . 608 parts In-Stock

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

USA . 250 parts In-Stock

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Overview

Upgrade your power systems with the IRLML6401PBF by Infineon Technologies. This high-quality P-Channel Power FET offers reliable switching capabilities in a compact package, making it ideal for a wide range of applications. With Infineon's reputation for excellence in semiconductor technology, you can trust that this transistor will deliver exceptional performance and efficiency. Say goodbye to compromised power solutions and hello to seamless operation with the IRLML6401PBF - your gateway to optimized power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the FET, ensuring a longer lifespan in various operating conditions.

Polarity or Channel Type: P-CHANNEL

P-channel FETs generally have lower on-state resistance and higher current-carrying capabilities compared to N-channel FETs, making them efficient for power switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, optimizing performance and efficiency for tasks that require frequent switching of power signals.

Avalanche Energy Rating (EAS): 33 mJ

Can handle energy spikes and surges without damage, providing a reliable solution for high-power applications.

Maximum Power Dissipation (Abs): 1.3 W

Efficiently dissipates heat generated during operation, ensuring stable performance under high-power conditions.

Maximum Operating Temperature: 150 °C

Able to operate reliably at high temperatures without overheating, making it suitable for demanding industrial environments.

Maximum Drain-Source On Resistance: 0.05 ohm

Low on-state resistance reduces power loss and heat generation, improving overall efficiency of the FET.

Technical Specifications

Power Field Effect Transistors (FET) IRLML6401PBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

HIGH RELIABILITY

Avalanche Energy Rating (EAS):

33 mJ

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (Abs) (ID):

4.3 A

Maximum Drain Current (ID):

4.3 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

125 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

34 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

460 ns

Maximum Turn On Time (ton):

43 ns

Trade Compliance

IRLML6401PBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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