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NTHL020N120SC1

Onsemi

NTHL020N120SC1 by Onsemi

NTHL020N120SC1 by Onsemi is a N-CHANNEL FET with 1200V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 412A IDM, 264mJ EAS, and 0.028 ohm RDS(on). Operating from -55 to 175 °C, it has a max power dissipation of 535W in a RECTANGULAR package with THROUGH-HOLE terminals.

Median Price

$28.834

Lifecycle Status

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19

In-Stock Inventory

1k+

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Chip1Stop

Japan . 10 parts In-Stock

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$22.200

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$22.200

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Arrow

USA . 80 parts In-Stock

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$22.310

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80

$22.310

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Mouser Electronics

USA . 437 parts In-Stock

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$33.680

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437

$33.680

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DigiKey

USA . 338 parts In-Stock

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$36.120

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$23.911

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$23.837

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338

$36.120

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$23.837

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Newark

USA . 386 parts In-Stock

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$36.170

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$36.170

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Farnell

UK . 330 parts In-Stock

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$41.490

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$26.970

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330

$41.490

$26.970

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Element14

Singapore . 330 parts In-Stock

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$67.100

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$49.780

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330

$67.100

$49.780

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Rochester

USA . 8,840 parts In-Stock

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$23.840

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$21.330

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$20.070

8,840

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$23.840

$21.330

$20.070

Verical

USA . 1,800 parts In-Stock

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$23.987

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$23.987

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EBV Elektronik

Germany . 900 parts In-Stock

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900

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Avnet

USA . 36 parts In-Stock

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$6.847

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36

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$6.847

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Distributors (In-Stock)

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Digiode

USA . 878 parts In-Stock

1+ parts

$24.624

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878

$24.624

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IBS Electronics

USA . 23 parts In-Stock

1+ parts

$34.838

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$34.053

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23

$34.838

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$34.053

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Nova Conductors

Japan . 1,000 parts In-Stock

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$38.953

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$38.953

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Flip Electronics

USA . 1,800 parts In-Stock

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Chip Stock

USA . 1,088 parts In-Stock

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Vyrian

USA . 757 parts In-Stock

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NAC Semi

USA . 18 parts In-Stock

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$49.680

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Tectiva GmbH

Germany . 13 parts In-Stock

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$0.492

100+ parts

$0.448

1k+ parts

$0.403

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10

$0.492

$0.448

$0.403

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Ampacity Inc.

Singapore . 707 parts In-Stock

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$5.820

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$5.820

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Corohmni

South Africa . 109 parts In-Stock

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$6.847

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Corphita

USA . 1,097 parts In-Stock

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$23.328

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Continental Prestige Electronics

USA . 94 parts In-Stock

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$34.520

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$26.850

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Netroflash

USA . 2,000 parts In-Stock

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$38.953

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$37.006

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$36.227

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$38.953

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$36.227

Microchip USA

USA . 2,376 parts In-Stock

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$97.129

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SupplyDigital Components

Austria . 7,337 parts In-Stock

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Kulean Microsystems

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Argo Parts USA

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TANS Electronics

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Eastek

USA . 450 parts In-Stock

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Problanco Electronics

Mexico . 382 parts In-Stock

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UHIMA Technologies

Türkiye . 146 parts In-Stock

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Overview

Unlock the power of innovation with the NTHL020N120SC1 by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor offers exceptional quality and performance. Perfect for switching applications, this N-CHANNEL transistor boasts a built-in diode, enhancing its functionality. With a high DS Breakdown Voltage of 1200V and maximum Drain Current of 103A, this transistor ensures reliable operation in various environments. Trust Onsemi to deliver cutting-edge technology and superior products that provide unmatched value and benefits to customers across industries. Elevate your projects with the NTHL020N120SC1 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type:

N-CHANNEL - Offers efficient performance in switching applications.

Minimum DS Breakdown Voltage:

1200 V - Ensures reliable operation under high voltage conditions.

Configuration:

SINGLE WITH BUILT-IN DIODE - Simplifies circuit design and saves space.

Transistor Application:

SWITCHING - Ideal for applications where fast switching speeds are required.

Package Shape:

RECTANGULAR - Allows for easy installation and secure mounting.

Terminal Form:

THROUGH-HOLE - Facilitates easy soldering onto circuit boards.

Operating Mode:

ENHANCEMENT MODE - Enhances overall efficiency and performance.

Maximum Pulsed Drain Current (IDM):

412 A - Capable of handling high current pulses for peak performance.

Avalanche Energy Rating (EAS):

264 mJ - Provides protection against voltage spikes and surges.

Maximum Power Dissipation (Abs):

535 W - Can handle high power levels without overheating.

Package Style (Meter):

FLANGE MOUNT - Allows for secure mounting in various applications.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Offers high reliability and efficiency.

Maximum Operating Temperature:

175 °C - Can operate in high temperature environments without issues.

Transistor Element Material:

SILICON CARBIDE - Provides superior performance and durability.

Minimum Operating Temperature:

55 °C - Can operate in low temperature conditions without any problems.

Terminal Finish:

Matte Tin (Sn) - annealed - Ensures reliable connections and longevity.

Maximum Drain Current (ID):

103 A - Capable of handling high continuous current for sustained use.

Maximum Drain-Source On Resistance:

0.028 ohm - Provides low on resistance for minimal power loss.

Terminal Position:

SINGLE - Simplifies circuit connections and layout.

Case Connection:

DRAIN - Facilitates efficient heat dissipation during operation.

Maximum Feedback Capacitance (Crss):

22 pF - Minimizes feedback effects for stable operation.

Technical Specifications

Power Field Effect Transistors (FET) NTHL020N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

264 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

103 A

Maximum Drain Current (ID):

103 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

22 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

412 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NTHL020N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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