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NTHL080N120SC1A

Onsemi

NTHL080N120SC1A by Onsemi

NTHL080N120SC1A by Onsemi is a N-CHANNEL FET with 1200V DS Breakdown Voltage, 31A ID, and 0.11 ohm RDS(ON). Ideal for SWITCHING applications due to its 132A IDM and 171mJ EAS ratings. Operates in ENHANCEMENT MODE with -55 to 175 °C temperature range.

Median Price

$12.930

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 883 parts In-Stock

1+ parts

$6.910

100+ parts

$6.870

1k+ parts

$6.630

10k+ parts

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883

$6.910

$6.870

$6.630

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Farnell

UK . 592 parts In-Stock

1+ parts

$11.371

100+ parts

$7.767

1k+ parts

$7.079

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592

$11.371

$7.767

$7.079

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Mouser Electronics

USA . 1,269 parts In-Stock

1+ parts

$12.930

100+ parts

$7.460

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-

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1,269

$12.930

$7.460

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DigiKey

USA . 684 parts In-Stock

1+ parts

$12.930

100+ parts

$7.820

1k+ parts

$6.438

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684

$12.930

$7.820

$6.438

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Element14

Singapore . 532 parts In-Stock

1+ parts

$17.420

100+ parts

$12.540

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532

$17.420

$12.540

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Chip1Stop

Japan . 325 parts In-Stock

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$44.100

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$18.400

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325

$44.100

$18.400

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Verical

USA . 89,550 parts In-Stock

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$6.479

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$6.479

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RS (Exports)

UK . 398 parts In-Stock

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$13.171

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398

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$13.171

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Rochester

USA . 36 parts In-Stock

1+ parts

-

100+ parts

$6.440

1k+ parts

$5.760

10k+ parts

$5.420

36

-

$6.440

$5.760

$5.420

Distributors (In-Stock)

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Digiode

USA . 2,090 parts In-Stock

1+ parts

$6.564

100+ parts

-

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$6.564

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$9.190

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650

$9.190

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IBS Electronics

USA . 2,995 parts In-Stock

1+ parts

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100+ parts

$7.559

1k+ parts

$9.439

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2,995

-

$7.559

$9.439

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NAC Semi

USA . 2,250 parts In-Stock

1+ parts

-

100+ parts

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$13.580

10k+ parts

$12.350

2,250

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-

$13.580

$12.350

Vyrian

USA . 760 parts In-Stock

1+ parts

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760

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 83 parts In-Stock

1+ parts

$1.130

100+ parts

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83

$1.130

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Ampacity Inc.

Singapore . 959 parts In-Stock

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$5.480

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959

$5.480

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Semicontronic

India . 940 parts In-Stock

1+ parts

$5.480

100+ parts

$5.343

1k+ parts

$5.316

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940

$5.480

$5.343

$5.316

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Corphita

USA . 1,611 parts In-Stock

1+ parts

$6.219

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1,611

$6.219

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Corohmni

South Africa . 354 parts In-Stock

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$6.450

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354

$6.450

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Continental Prestige Electronics

USA . 858 parts In-Stock

1+ parts

$10.300

100+ parts

$8.350

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858

$10.300

$8.350

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Microchip USA

USA . 876 parts In-Stock

1+ parts

$38.750

100+ parts

$38.750

1k+ parts

$38.750

10k+ parts

$38.750

876

$38.750

$38.750

$38.750

$38.750

Kulean Microsystems

USA . 4,942 parts In-Stock

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Argo Parts USA

USA . 4,912 parts In-Stock

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SupplyDigital Components

Austria . 4,613 parts In-Stock

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TANS Electronics

Latvia . 1,870 parts In-Stock

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Perfect Parts

USA . 1,053 parts In-Stock

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Problanco Electronics

Mexico . 767 parts In-Stock

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767

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GreenTree Electronics

Israel . 450 parts In-Stock

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UHIMA Technologies

Türkiye . 268 parts In-Stock

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Eastek

USA . 150 parts In-Stock

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Authorized Procurement Solutions

USA . 108 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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100+ parts

$9.006

1k+ parts

$8.731

10k+ parts

$8.547

100

-

$9.006

$8.731

$8.547

Overview

Discover the power of the NTHL080N120SC1A by Onsemi, a high-quality Power Field Effect Transistor designed for switching applications. Manufactured with precision and expertise by Onsemi, this N-CHANNEL transistor offers customers exceptional value and performance. With a minimum DS Breakdown Voltage of 1200V and a maximum Drain Current of 31A, this transistor is perfect for a wide range of applications. Trust in Onsemi for reliable technology and choose the NTHL080N120SC1A for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various industrial applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer high mobility and faster switching speeds, making them ideal for high-frequency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enables efficient and reliable current control, enhancing the overall performance of the transistor.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring efficient power management and control in various electronic circuits.

Minimum DS Breakdown Voltage: 1200 V

With a high breakdown voltage, this FET can handle large voltage spikes, making it suitable for high-power applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into circuit boards, increasing convenience during assembly.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, ensuring reliable performance in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and low on-resistance, improving efficiency and reducing power loss.

Maximum Pulsed Drain Current (IDM): 132 A

The high pulsed drain current rating allows for handling peak currents without compromising performance, ideal for transient loads.

Avalanche Energy Rating (EAS): 171 mJ

The high avalanche energy rating ensures robustness against voltage spikes, enhancing the reliability and longevity of the transistor.

Maximum Drain Current (Abs) (ID): 31 A

With a high drain current rating, this FET can handle substantial currents, making it suitable for power applications.

No. of Terminals: 3

The three terminals provide the necessary connections for power, control, and protection, ensuring versatile use in various circuit configurations.

Maximum Power Dissipation (Abs): 178 W

The high power dissipation rating allows for efficient heat dissipation, ensuring reliable performance under high load conditions.

Package Style (Meter): FLANGE MOUNT

The flange mount design simplifies installation and provides stability, ideal for applications requiring secure mounting.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low on-resistance, providing optimal performance for switching applications.

Maximum Operating Temperature: 175 °C

The high operating temperature range ensures reliable operation in harsh environments, making it suitable for industrial applications.

Transistor Element Material: SILICON CARBIDE

Silicon carbide elements offer high thermal conductivity and low on-resistance, enhancing the overall efficiency of the transistor.

Minimum Operating Temperature: -55 °C

The wide operating temperature range enables consistent performance in extreme cold conditions, ensuring reliability in various environments.

Terminal Finish: Matte Tin (Sn) - annealed

The annealed matte tin finish provides corrosion resistance and ensures stable connections, prolonging the lifespan of the transistor.

Maximum Drain-Source On Resistance: 0.11 ohm

The low on-resistance results in minimal power loss and heat generation, making it suitable for high-efficiency applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and reduces complexity, suitable for compact circuit designs.

Maximum Feedback Capacitance (Crss): 6.5 pF

The low feedback capacitance minimizes signal distortion and ensures accurate switching, ideal for high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) NTHL080N120SC1A attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

171 mJ

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

31 A

Maximum Drain Current (ID):

31 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

6.5 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

132 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NTHL080N120SC1A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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