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NTHL040N120SC1

Onsemi

NTHL040N120SC1 by Onsemi

NTHL040N120SC1 by Onsemi is a N-CHANNEL FET with 1200V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 240A IDM, 613mJ EAS, and 0.056 ohm RDS(on). Operating from -55 to 175 °C, it has a max power dissipation of 348W in a RECTANGULAR package with THROUGH-HOLE terminals.

Median Price

$18.270

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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Farnell

UK . 359 parts In-Stock

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$16.780

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$11.560

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$11.320

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359

$16.780

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$11.320

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Chip1Stop

Japan . 30 parts In-Stock

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$18.270

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$15.600

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$15.600

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Mouser Electronics

USA . 608 parts In-Stock

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$19.240

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608

$19.240

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DigiKey

USA . 1,681 parts In-Stock

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$21.910

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$13.875

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$12.689

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$21.910

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Newark

USA . 389 parts In-Stock

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$26.070

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$26.070

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Element14

Singapore . 359 parts In-Stock

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$29.240

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$20.150

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$19.730

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359

$29.240

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Verical

USA . 12,150 parts In-Stock

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$12.900

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EBV Elektronik

Germany . 1,410 parts In-Stock

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RS (Exports)

UK . 450 parts In-Stock

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$13.768

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Arrow

USA . 30 parts In-Stock

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$12.900

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30

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$12.900

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Digiode

USA . 871 parts In-Stock

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$13.100

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$13.100

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Vyrian

USA . 1,942 parts In-Stock

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$13.768

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Flip Electronics

USA . 9,450 parts In-Stock

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NAC Semi

USA . 900 parts In-Stock

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$24.730

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Chip Stock

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Corphita

USA . 1,176 parts In-Stock

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$12.411

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Corohmni

South Africa . 375 parts In-Stock

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$13.768

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375

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Microchip USA

USA . 2,428 parts In-Stock

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Kulean Microsystems

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TANS Electronics

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Perfect Parts

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SupplyDigital Components

Austria . 4,128 parts In-Stock

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UHIMA Technologies

Türkiye . 747 parts In-Stock

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Eastek

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Authorized Procurement Solutions

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GreenTree Electronics

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Problanco Electronics

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Overview

Unlock the power of innovation with the NTHL040N120SC1 by Onsemi. This Power Field Effect Transistor (FET) is designed to exceed expectations in switching applications, offering unparalleled performance and reliability. With a single configuration and built-in diode, this N-CHANNEL transistor delivers 1200V minimum DS breakdown voltage and 240A maximum pulsed drain current. Trust Onsemi's expertise in semiconductor technology to provide high-quality solutions that meet your needs. Experience the difference with the NTHL040N120SC1 - where excellence meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance and efficiency compared to P-channel FETs, making this product a good choice for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from reverse voltage, enhancing the reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures efficient power management and fast switching speeds.

Minimum DS Breakdown Voltage: 1200 V

The high breakdown voltage allows the FET to handle high voltages without breakdown, making it suitable for high-power and high-voltage applications.

Maximum Pulsed Drain Current (IDM): 240 A

With a high pulsed drain current rating, this FET can handle large currents for short durations, making it ideal for high-power and high-performance applications.

Avalanche Energy Rating (EAS): 613 mJ

The high avalanche energy rating indicates the FET's ability to handle energy spikes and transient events, improving overall reliability.

Maximum Power Dissipation (Abs): 348 W

The high power dissipation rating allows the FET to handle high power levels without overheating, ensuring reliable performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low power consumption and high efficiency, making this FET a good choice for energy-efficient applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand high-temperature environments, improving overall reliability and performance.

Maximum Drain-Source On Resistance: 0.056 ohm

The low on-resistance of the FET results in lower power dissipation and higher efficiency, making it suitable for high-current applications.

Maximum Feedback Capacitance (Crss): 12 pF

The low feedback capacitance helps in reducing signal distortion and improving high-frequency performance, making this FET suitable for high-speed applications.

Technical Specifications

Power Field Effect Transistors (FET) NTHL040N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

613 mJ

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.056 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NTHL040N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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