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NTHL110N65S3F

Onsemi

NTHL110N65S3F by Onsemi

NTHL110N65S3F by Onsemi is a Power FET with 650V DS Breakdown Voltage, 69A IDM, and 0.11 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features include built-in diode, 380mJ EAS rating, and operating temperature range of -55 to 150 °C.

Median Price

$8.985

Lifecycle Status

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10

In-Stock Inventory

1k+

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Farnell

UK . 450 parts In-Stock

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$3.830

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450

$3.830

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DigiKey

USA . 668 parts In-Stock

1+ parts

$8.650

100+ parts

$5.058

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$3.804

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668

$8.650

$5.058

$3.804

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Mouser Electronics

USA . 9,637 parts In-Stock

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$9.320

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$4.330

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9,637

$9.320

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$4.330

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Element14

Singapore . 450 parts In-Stock

1+ parts

$10.450

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$7.460

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$7.020

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450

$10.450

$7.460

$7.020

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Newark

USA . 16 parts In-Stock

1+ parts

$11.540

100+ parts

$6.910

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$6.710

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16

$11.540

$6.910

$6.710

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RS (Exports)

UK . 1 parts In-Stock

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$3.801

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$3.612

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1

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$3.801

$3.612

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Distributors (In-Stock)

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Digiode

USA . 1,430 parts In-Stock

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$3.638

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$3.638

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Nova Conductors

Japan . 67 parts In-Stock

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$4.355

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$4.355

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Vyrian

USA . 2,125 parts In-Stock

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Flip Electronics

USA . 450 parts In-Stock

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450

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Ampacity Inc.

Singapore . 1,634 parts In-Stock

1+ parts

$3.230

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$3.230

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Corphita

USA . 669 parts In-Stock

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$3.447

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669

$3.447

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Corohmni

South Africa . 437 parts In-Stock

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$3.801

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$3.801

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Argo Parts USA

USA . 3,584 parts In-Stock

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$4.355

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3,584

$4.355

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Continental Prestige Electronics

USA . 2,775 parts In-Stock

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$4.355

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$4.268

2,775

$4.355

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$4.268

Netroflash

USA . 500 parts In-Stock

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$4.355

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$4.137

10k+ parts

$4.050

500

$4.355

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$4.137

$4.050

QUARKTWIN TECHNOLOGY LTD

USA . 26,380 parts In-Stock

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Microchip USA

USA . 6,482 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,955 parts In-Stock

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TANS Electronics

Latvia . 4,998 parts In-Stock

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Problanco Electronics

Mexico . 3,855 parts In-Stock

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Kulean Microsystems

USA . 3,331 parts In-Stock

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Perfect Parts

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SupplyDigital Components

Austria . 2,787 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 70 parts In-Stock

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iodParts Technologies Inc.

India . 61 parts In-Stock

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UHIMA Technologies

Türkiye . 60 parts In-Stock

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Overview

Upgrade your power systems with the NTHL110N65S3F by Onsemi, a top-of-the-line Power Field Effect Transistor that guarantees reliability and efficiency. Manufactured by Onsemi, a renowned industry leader, this N-CHANNEL FET with a built-in diode is perfect for switching applications. With a high DS Breakdown Voltage of 650V and an impressive Maximum Pulsed Drain Current of 69A, this transistor offers unmatched performance and durability. Say goodbye to power issues and hello to seamless operation with the NTHL110N65S3F from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protects the FET from external factors, ensuring reliability.

Polarity or Channel Type: N-CHANNEL

Offers efficient and reliable current flow in the specified direction, enhancing performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by including a diode, saving space and reducing component count.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in those scenarios.

Minimum DS Breakdown Voltage: 650 V

Handles high voltage levels, making it suitable for applications requiring such voltage thresholds.

Maximum Pulsed Drain Current (IDM): 69 A

Can handle high pulsed currents, making it suitable for applications with occasional high current demands.

Avalanche Energy Rating (EAS): 380 mJ

Has a high energy rating, making it reliable and durable in high-stress situations.

Maximum Power Dissipation (Abs): 240 W

Can dissipate high levels of power, ensuring stable operation even under heavy load conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced MOSFET technology for efficient performance and energy savings.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures, making it suitable for demanding environments.

Minimum Operating Temperature: -55 °C

Can operate in cold temperatures, ensuring versatility in different operating conditions.

Maximum Drain-Source On Resistance: 0.11 ohm

Low on-resistance minimizes power loss and heat generation, improving efficiency.

Technical Specifications

Power Field Effect Transistors (FET) NTHL110N65S3F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

380 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

69 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHL110N65S3F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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