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JANTX2N6796U

Infineon Technologies

JANTX2N6796U by Infineon Technologies

JANTX2N6796U by Infineon Technologies is a power FET with N-channel configuration and built-in diode. It is used for switching applications, has a min DS breakdown voltage of 100V, and can handle a max pulsed drain current of 32A.

Median Price

$71.820

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 1 parts In-Stock

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$55.812

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1

$55.812

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Nova Conductors

Japan . 500 parts In-Stock

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$71.820

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500

$71.820

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Vyrian

USA . 1,574 parts In-Stock

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1,574

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Digiode

USA . 679 parts In-Stock

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679

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NAC Semi

USA . 158 parts In-Stock

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$81.420

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158

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$81.420

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NexGen Digital

USA . 79 parts In-Stock

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79

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Resion

USA . 8 parts In-Stock

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QIE Inc.

USA . 5 parts In-Stock

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5

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North Shore Components

USA . 5 parts In-Stock

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Sunrise Surplus Inc.

USA . 3 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,043 parts In-Stock

1+ parts

$1.117

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2,043

$1.117

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AZTECH Wire

Italy . 411 parts In-Stock

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$18.559

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411

$18.559

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Semicontronic

India . 538 parts In-Stock

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$33.050

100+ parts

$32.224

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$32.058

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538

$33.050

$32.224

$32.058

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Modulus Dynamics

Lithuania . 22,519 parts In-Stock

1+ parts

$49.140

100+ parts

$47.174

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$45.209

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22,519

$49.140

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Corohmni

South Africa . 69 parts In-Stock

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$49.140

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69

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$50.614

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$48.083

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$48.083

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$50.614

$48.083

$48.083

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Ampacity Inc.

Singapore . 617 parts In-Stock

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$58.050

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617

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Continental Prestige Electronics

USA . 6,071 parts In-Stock

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$71.820

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$70.384

6,071

$71.820

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$70.384

QUARKTWIN TECHNOLOGY LTD

USA . 6,902 parts In-Stock

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Argo Parts USA

USA . 2,675 parts In-Stock

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Corphita

USA . 734 parts In-Stock

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734

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Robosynatics

Brazil . 350 parts In-Stock

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$6.339

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$6.339

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$6.339

350

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$6.339

$6.339

$6.339

Lucentia Tech

USA . 350 parts In-Stock

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100+ parts

$6.339

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$6.339

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$6.339

350

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$6.339

$6.339

$6.339

Overview

Discover the unrivaled power and performance of the JANTX2N6796U by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality products that meet the highest standards. The JANTX2N6796U belongs to the Power Field Effect Transistors (FET) category and offers a multitude of applications, particularly in switching. With its built-in diode and N-channel configuration, this product provides exceptional functionality and reliability. Its maximum pulsed drain current of 32A and avalanche energy rating of 134mJ ensure optimal performance even in demanding conditions. Experience the value and benefits of the JANTX2N6796U - a true game-changer in power electronics.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides high durability and thermal performance, making this FET suitable for harsh operating environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and faster switching speeds compared to P-channel FETs, making them efficient for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and protects against reverse polarity, enhancing the functionality of the FET in switching applications.

Transistor Application: SWITCHING

Designed specifically for high-speed switching applications, this FET provides efficient power management solutions in various electronic devices.

Maximum Power Dissipation (Abs): 25 W

With a high maximum power dissipation rating, this FET can handle large power loads without overheating, ensuring reliable performance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this FET to operate reliably in extreme temperature conditions, making it ideal for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) JANTX2N6796U attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

HIGH RELIABILITY

Avalanche Energy Rating (EAS):

134 mJ

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.207 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-CQCC-N15

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

15

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

32 A

Qualification:

Qualified

Reference Standard:

MIL-19500/557

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

JANTX2N6796U Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-519-4957, 5961015194957

NIIN

015194957

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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