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BSS138BKS,115

NXP Semiconductors

BSS138BKS,115 by NXP Semiconductors

NXP Semiconductors' BSS138BKS,115 is an N-CHANNEL Power FET with 0.32A max drain current and 0.99W power dissipation. Ideal for surface mount applications, it operates in enhancement mode at up to 150°C.

Median Price

$0.200

Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

1k+

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Chip1Stop

Japan . 23,908 parts In-Stock

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DigiKey

USA . 14,998 parts In-Stock

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Mouser Electronics

USA . 664,983 parts In-Stock

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Newark

USA . 142,142 parts In-Stock

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Adafruit Industries

USA . 5,000 parts In-Stock

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Elektronika Sales Private Limited

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Arrow

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Verical

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Farnell

UK . 54,105 parts In-Stock

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Future Electronics

Canada . 24,000 parts In-Stock

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Avnet

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EBV Elektronik

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Element14

Singapore . 92 parts In-Stock

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Nova Conductors

Japan . 31 parts In-Stock

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Digiode

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TME

Poland . 5,763 parts In-Stock

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Chip Stock

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IBS Electronics

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NAC Semi

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Sensible Micro Corp

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LIBRA Elektronik GmbH

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Right Parts Inc.

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Bristol Electronics

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Semicontronic

India . 525,659 parts In-Stock

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Ampacity Inc.

Singapore . 180,133 parts In-Stock

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AZTECH Wire

Italy . 8,062 parts In-Stock

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Argo Parts USA

USA . 4,861 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Modulus Dynamics

Lithuania . 64 parts In-Stock

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Corphita

USA . 4,479 parts In-Stock

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Aztec Data Supply Inc.

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Advanced Electronics

New Zealand . 15,000 parts In-Stock

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Infinite Electronics LLP (Excess)

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GreenTree Electronics

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Eastek

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Continental Prestige Electronics

USA . 81,145 parts In-Stock

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Futuretech Components

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Lucentia Tech

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iodParts Technologies Inc.

India . 7,580 parts In-Stock

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UNI Independent Distributors

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Robosynatics

Brazil . 3,073 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,950 parts In-Stock

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Supply Digital

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Corohmni

South Africa . 1,677 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 535 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the NXP Semiconductors BSS138BKS,115 Power Field Effect Transistor. Designed for efficiency and reliability, this N-CHANNEL FET offers enhanced performance in a compact surface mount package. Ideal for a variety of applications, this transistor provides seamless operation at high temperatures, making it a versatile and valuable component for your projects. Trust NXP Semiconductors to deliver quality products that exceed expectations. Elevate your designs with the BSS138BKS,115 today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically offer higher switching speeds and lower ON resistance compared to P-CHANNEL FETs, making them a good choice for high-performance applications.

Surface Mount: YES

Surface mount technology allows for compact and lightweight designs, making this FET suitable for space-constrained applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs have normally-off characteristics, providing better control and preventing unintended current flow when the FET is off.

Maximum Drain Current (Abs) (ID): 0.32 A

With a maximum drain current of 0.32 A, this FET can handle moderate power requirements in various circuits.

Maximum Power Dissipation (Abs): 0.99 W

The high maximum power dissipation allows for reliable operation and thermal performance under high load conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides good stability and performance in different operating conditions, ensuring consistent operation.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand elevated temperatures without compromising performance.

Terminal Finish: TIN

TIN terminal finish offers good solderability and corrosion resistance, ensuring reliable connections in various environments.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this FET can be efficiently integrated into manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable solder joints and assembly during manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) BSS138BKS,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Maximum Drain Current (Abs) (ID):

.32 A

Maximum Drain Current (ID):

.32 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BSS138BKS,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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