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HUF75645P3

Onsemi

HUF75645P3 by Onsemi

HUF75645P3 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage and 75A Drain Current. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it offers 0.014 ohm Drain-Source On Resistance and can handle up to 310W power dissipation at 175°C.

Median Price

$2.370

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 80 parts In-Stock

1+ parts

$2.460

100+ parts

$1.270

1k+ parts

$1.250

10k+ parts

$1.140

80

$2.460

$1.270

$1.250

$1.140

Mouser Electronics

USA . 1,107 parts In-Stock

1+ parts

$3.800

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-

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1,107

$3.800

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DigiKey

USA . 764 parts In-Stock

1+ parts

$3.800

100+ parts

$1.743

1k+ parts

$1.323

10k+ parts

$1.262

764

$3.800

$1.743

$1.323

$1.262

Element14

Singapore . 175 parts In-Stock

1+ parts

$209.620

100+ parts

$144.050

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$118.400

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$209.620

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$118.400

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Future Electronics

Canada . 102,381 parts In-Stock

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$2.370

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$2.310

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$2.250

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RS (Exports)

UK . 800 parts In-Stock

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$1.847

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$1.689

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$1.689

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Arrow

USA . 689 parts In-Stock

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$1.534

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$1.282

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$1.282

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Verical

USA . 650 parts In-Stock

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$1.534

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$1.282

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650

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$1.534

$1.282

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Farnell

UK . 175 parts In-Stock

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$1.130

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$1.130

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Distributors (In-Stock)

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Digiode

USA . 3,253 parts In-Stock

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$1.340

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Nova Conductors

Japan . 50 parts In-Stock

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$1.498

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TME

Poland . 53 parts In-Stock

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$2.180

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Forefront Electronics and Design

USA . 48 parts In-Stock

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$2.450

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48

$2.450

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IBS Electronics

USA . 149,131 parts In-Stock

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$3.324

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$1.935

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$1.921

149,131

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$3.324

$1.935

$1.921

NAC Semi

USA . 82,200 parts In-Stock

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$4.020

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Flip Electronics

USA . 14,400 parts In-Stock

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Chip Stock

USA . 9,000 parts In-Stock

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Vyrian

USA . 278 parts In-Stock

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R&J Components

USA . 250 parts In-Stock

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250

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Connector Distribution Corp

USA . 150 parts In-Stock

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150

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Right Parts Inc.

USA . 150 parts In-Stock

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LWI Electronics Inc

India . 97 parts In-Stock

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Inventory MP

USA . 85 parts In-Stock

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Bristol Electronics

USA . 85 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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Semi Source

USA . 40 parts In-Stock

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EMSNET

USA . 14 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,680 parts In-Stock

1+ parts

$0.711

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4,680

$0.711

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Semicontronic

India . 439 parts In-Stock

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$0.960

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$0.936

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$0.931

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439

$0.960

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$0.931

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Ampacity Inc.

Singapore . 426 parts In-Stock

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$0.960

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Corohmni

South Africa . 70 parts In-Stock

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$1.130

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$1.130

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Corphita

USA . 2,680 parts In-Stock

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$1.269

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2,680

$1.269

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Argo Parts USA

USA . 4,141 parts In-Stock

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$1.498

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Continental Prestige Electronics

USA . 1,523 parts In-Stock

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$1.498

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$1.468

1,523

$1.498

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$1.468

Microchip USA

USA . 4,936 parts In-Stock

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$18.460

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RC Electronics

USA . 30,000 parts In-Stock

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$8.860

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$8.430

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$7.650

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$8.860

$8.430

$7.650

A-Z Elektronik GmbH

Germany . 10,697 parts In-Stock

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Perfect Parts

USA . 9,184 parts In-Stock

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SupplyDigital Components

Austria . 7,197 parts In-Stock

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Problanco Electronics

Mexico . 7,111 parts In-Stock

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Kulean Microsystems

USA . 6,752 parts In-Stock

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TANS Electronics

Latvia . 5,008 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,798 parts In-Stock

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Supply Digital

USA . 3,002 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Kepictronics

USA . 800 parts In-Stock

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800

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Eastek

USA . 650 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 50 parts In-Stock

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UHIMA Technologies

Türkiye . 44 parts In-Stock

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Overview

Discover the power of the HUF75645P3 by Onsemi, a high-quality Power Field Effect Transistor that offers unparalleled performance and reliability. With Onsemi's reputation for excellence in semiconductor manufacturing, this N-CHANNEL FET is ideal for a wide range of switching applications. Experience the value of its 100V minimum DS breakdown voltage, 75A maximum drain current, and 0.014 ohm maximum drain-source on resistance. Trust in Onsemi to deliver cutting-edge technology and superior quality with the HUF75645P3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and performance in switching applications.

Minimum DS Breakdown Voltage: 100 V

Suitable for applications where a high breakdown voltage is required, providing reliability in operation.

Maximum Drain Current (Abs) (ID): 75 A

Capable of handling high current loads, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 310 W

Can dissipate high power levels efficiently, making it ideal for applications where heat dissipation is a concern.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments without compromising performance.

Maximum Drain-Source On Resistance: 0.014 ohm

Low on-resistance leads to minimal power loss and improved efficiency.

Technical Specifications

Power Field Effect Transistors (FET) HUF75645P3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

HUF75645P3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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