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HUF76639S3ST-F085

Onsemi

HUF76639S3ST-F085 by Onsemi

HUF76639S3ST-F085 by Onsemi is a N-CHANNEL FET with 100V DS Breakdown Voltage, 51A Drain Current, and 0.026 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at up to 175°C. Package: PLASTIC/EPOXY, GULL WING terminals, and SMALL OUTLINE style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,017 parts In-Stock

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4,017

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Digiode

USA . 2,840 parts In-Stock

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2,840

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Nova Conductors

Japan . 964 parts In-Stock

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964

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,414 parts In-Stock

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$0.388

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1,414

$0.388

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Semicontronic

India . 1,619 parts In-Stock

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$8.050

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$7.849

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$7.808

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1,619

$8.050

$7.849

$7.808

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AZTECH Wire

Italy . 1,049 parts In-Stock

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$10.761

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1,049

$10.761

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Ampacity Inc.

Singapore . 2,506 parts In-Stock

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$25.050

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2,506

$25.050

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Component Stockers USA

USA . 764 parts In-Stock

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$99.990

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764

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 18,162 parts In-Stock

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Continental Prestige Electronics

USA . 8,558 parts In-Stock

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8,558

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TANS Electronics

Latvia . 7,232 parts In-Stock

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SupplyDigital Components

Austria . 6,064 parts In-Stock

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Argo Parts USA

USA . 5,979 parts In-Stock

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Problanco Electronics

Mexico . 5,049 parts In-Stock

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Kulean Microsystems

USA . 4,656 parts In-Stock

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Corphita

USA . 2,694 parts In-Stock

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Perfect Parts

USA . 2,671 parts In-Stock

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Supply Digital

USA . 2,472 parts In-Stock

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2,472

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Bastille Electronics

Australia . 550 parts In-Stock

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550

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Corohmni

South Africa . 328 parts In-Stock

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328

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UHIMA Technologies

Türkiye . 254 parts In-Stock

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254

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Overview

Discover the power and efficiency of the HUF76639S3ST-F085 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Field Effect Transistors. With applications in switching technology, this N-CHANNEL transistor offers enhanced performance and maximum power dissipation, making it ideal for various electronic devices. Experience the value and benefits of this product with its single configuration and built-in diode, providing customers with a high-quality solution for their power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body makes this FET lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower resistance and faster switching speeds, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage spikes, enhancing reliability.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control power flow in electronic circuits.

Surface Mount: YES

The surface-mount capability allows for easy and efficient PCB assembly, saving time and reducing production costs.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET is suitable for handling high voltage applications.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact footprint, making it suitable for space-constrained designs.

Terminal Form: GULL WING

The gull-wing terminal form ensures secure solder connections and easy PCB mounting.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode allows for precise control of the FET's conductivity, improving efficiency.

Maximum Drain Current (Abs) (ID): 51 A

With a high maximum drain current of 51A, this FET can handle high-power applications with ease.

No. of Terminals: 2

The two terminals simplify the FET's connection in the circuit, enhancing ease of use and reducing complexity.

Maximum Power Dissipation (Abs): 180 W

With a maximum power dissipation of 180W, this FET can handle high-power levels without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The use of metal-oxide semiconductor technology ensures high performance and reliability.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature of 175°C, this FET can withstand demanding environmental conditions.

Transistor Element Material: SILICON

The silicon transistor element material offers high performance and reliability in electronic circuits.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and ensures reliable electrical connections.

Maximum Drain-Source On Resistance: 0.026 ohm

The low on-resistance of 0.026 ohms minimizes power loss and improves efficiency in the circuit.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection of the FET in the circuit.

Case Connection: DRAIN

The drain case connection allows for efficient heat dissipation, prolonging the FET's lifespan.

Maximum Time At Peak Reflow Temperature (s): 30

The FET can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable solder joints during assembly.

Peak Reflow Temperature °C: 245

With a peak reflow temperature of 245°C, this FET can be effectively soldered onto the PCB without damage.

Technical Specifications

Power Field Effect Transistors (FET) HUF76639S3ST-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ULTRA LOW RESISTANCE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

51 A

Maximum Drain Current (ID):

50 A

Maximum Drain-Source On Resistance:

.026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

HUF76639S3ST-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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