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CPH6354-TL-W

Onsemi

CPH6354-TL-W by Onsemi

Onsemi's CPH6354-TL-W is a P-CHANNEL FET with 60V DS breakdown voltage, 16A IDM, and 0.1 ohm RDS(on). Ideal for SWITCHING applications in ENHANCEMENT MODE, it features GULL WING terminals and operates in SMALL OUTLINE package style.

Median Price

$0.952

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$0.204

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$0.204

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Tomark Electronics Ltd

UK . 200 parts In-Stock

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$1.700

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$1.700

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Chip Stock

USA . 144,676 parts In-Stock

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Vyrian

USA . 2,064 parts In-Stock

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Flip Electronics

USA . 916 parts In-Stock

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Digiode

USA . 804 parts In-Stock

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ComSIT Distribution GmbH

Germany . 95 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 58 parts In-Stock

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$0.196

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58

$0.196

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Aranea Global

USA . 500 parts In-Stock

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$0.200

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$0.192

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500

$0.200

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Continental Prestige Electronics

USA . 2,823 parts In-Stock

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$0.204

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$0.200

2,823

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Argo Parts USA

USA . 248 parts In-Stock

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$0.204

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$0.198

248

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Advanced Electronics

New Zealand . 900 parts In-Stock

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$0.210

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900

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Aztec Data Supply Inc.

USA . 447 parts In-Stock

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$0.340

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Ampacity Inc.

Singapore . 916 parts In-Stock

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$1.050

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$1.050

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Semicontronic

India . 2,576 parts In-Stock

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$9.050

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$8.824

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$8.778

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AZTECH Wire

Italy . 852 parts In-Stock

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$13.174

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Kulean Microsystems

USA . 5,721 parts In-Stock

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SupplyDigital Components

Austria . 4,707 parts In-Stock

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TANS Electronics

Latvia . 4,104 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,869 parts In-Stock

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Lixinc

USA . 1,916 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Corphita

USA . 435 parts In-Stock

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UHIMA Technologies

Türkiye . 126 parts In-Stock

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Overview

Upgrade your power systems with the CPH6354-TL-W by Onsemi. Crafted with precision and quality, this P-Channel Field Effect Transistor offers seamless switching applications in a compact package. With a built-in diode and a maximum pulsing drain current of 16A, this transistor ensures efficient performance for all your power needs. Trust Onsemi's expertise and elevate your projects with the reliability and value this product brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability in various operating conditions.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low on-state resistance and high current-carrying capability.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against reverse currents.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance and efficiency.

Surface Mount: YES

Enables easy and secure mounting on circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages without damage.

Package Shape: RECTANGULAR

Rectangular shape offers versatility in design and placement on circuit boards.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for fast and precise control of the transistor's conductivity.

Maximum Pulsed Drain Current (IDM): 16 A

Capable of handling high peak currents, suitable for heavy-duty applications.

No. of Terminals: 6

Six terminals provide ample connectivity options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and is ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds.

Transistor Element Material: SILICON

Silicon material ensures high performance and reliability in a wide range of operating conditions.

Terminal Finish: TIN BISMUTH

Tin bismuth finish provides corrosion resistance and stable electrical connections.

Maximum Drain Current (ID): 4 A

Capable of handling moderate currents, suitable for various applications.

Maximum Drain-Source On Resistance: 0.1 ohm

Low on-resistance ensures minimal power loss and efficient operation.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit design and layout.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration, ensuring reliability in soldering.

Peak Reflow Temperature °C: 260

Able to withstand high peak reflow temperatures, suitable for reflow soldering processes.

Technical Specifications

Power Field Effect Transistors (FET) CPH6354-TL-W attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

16 A

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CPH6354-TL-W Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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