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CPH6337

Onsemi

CPH6337 by Onsemi

CPH6337 by Onsemi is a P-CHANNEL FET with 12V DS breakdown voltage, ideal for switching applications. It features a max IDM of 14A and ID of 3.5A, with 0.07 ohm RDS(on). This MOSFET operates in enhancement mode at up to 150 °C, making it suitable for high-power tasks.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 2,246 parts In-Stock

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Digiode

USA . 1,447 parts In-Stock

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Northwest PG Solutions

USA . 948 parts In-Stock

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Kepictronics

USA . 45,000 parts In-Stock

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SupplyDigital Components

Austria . 6,958 parts In-Stock

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TANS Electronics

Latvia . 4,685 parts In-Stock

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Problanco Electronics

Mexico . 871 parts In-Stock

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UHIMA Technologies

Türkiye . 869 parts In-Stock

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Corphita

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Kulean Microsystems

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Corohmni

South Africa . 399 parts In-Stock

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Native Components

USA . 110 parts In-Stock

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Overview

Looking to power up your electronic devices with efficiency and reliability? Look no further than the CPH6337 by Onsemi. This high-quality Power Field Effect Transistor (FET) offers a range of applications, from switching to enhancement mode operation. With a maximum pulsing drain current of 14A and a built-in diode, this P-Channel transistor provides seamless performance in a compact package. Trust Onsemi's reputation for excellence and invest in the CPH6337 for all your power needs. Add value to your projects with this versatile component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: P-CHANNEL

Suitable for applications requiring P-channel transistors, offering flexibility in circuit design.

Configuration: SINGLE WITH BUILT-IN DIODE

Includes a built-in diode for improved efficiency and functionality in switching applications.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring reliable performance in such scenarios.

Surface Mount: YES

Enables easy and efficient mounting on circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 12 V

With a minimum breakdown voltage of 12V, this transistor can handle a range of voltages in its operation.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode allows for enhanced control and efficiency in switching operations.

Maximum Pulsed Drain Current (IDM): 14 A

Capable of handling high pulsed drain currents, making it suitable for applications requiring temporary high power.

Maximum Drain Current (Abs) (ID): 3.5 A

Provides a consistent and reliable maximum drain current rating for normal operation.

Maximum Power Dissipation (Abs): 1.6 W

Efficiently dissipates heat to ensure stable operation within its maximum power rating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology for improved efficiency and performance in power switching applications.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, suitable for various environments.

Transistor Element Material: SILICON

Silicon-based construction provides reliability and stability in the transistor's operation.

Maximum Drain-Source On Resistance: 0.07 ohm

Low on-resistance results in minimal power loss and improved efficiency in switching applications.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit design and ease of connection.

Technical Specifications

Power Field Effect Transistors (FET) CPH6337 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (Abs) (ID):

3.5 A

Maximum Drain Current (ID):

3.5 A

Maximum Drain-Source On Resistance:

.07 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

14 A

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CPH6337 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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