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CPH6445-TL-W

Onsemi

CPH6445-TL-W by Onsemi

CPH6445-TL-W by Onsemi is a N-CHANNEL FET with 3.5A max drain current and 1.6W power dissipation. Ideal for applications requiring high efficiency in enhancement mode operation, such as power management systems or motor control circuits.

Median Price

$0.080

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 2 parts In-Stock

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$0.021

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Rochester

USA . 9,000 parts In-Stock

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$0.138

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$0.130

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$0.117

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Chip1Stop

Japan . 2 parts In-Stock

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Digiode

USA . 1,188 parts In-Stock

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$0.074

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Vyrian

USA . 4,447 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Semicontronic

India . 3,691 parts In-Stock

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$0.018

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$0.018

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$0.017

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3,691

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$0.018

$0.017

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Ampacity Inc.

Singapore . 2,072 parts In-Stock

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$0.018

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Corphita

USA . 1,760 parts In-Stock

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$0.070

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Corohmni

South Africa . 209 parts In-Stock

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$0.078

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$0.489

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$0.465

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$0.465

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$0.489

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Aztec Data Supply Inc.

USA . 3,272 parts In-Stock

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$0.600

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AZTECH Wire

Italy . 135 parts In-Stock

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$14.070

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RC Electronics

USA . 92,890 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

USA . 22,172 parts In-Stock

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Lixinc

USA . 4,846 parts In-Stock

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TANS Electronics

Latvia . 4,562 parts In-Stock

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Kepictronics

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Problanco Electronics

Mexico . 3,026 parts In-Stock

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 2,413 parts In-Stock

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Kulean Microsystems

USA . 2,318 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

USA . 1,382 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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UHIMA Technologies

Türkiye . 21 parts In-Stock

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Overview

Experience the power of innovation with the CPH6445-TL-W by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Field Effect Transistors. This N-CHANNEL FET offers enhanced performance and efficiency for a wide range of applications. With a maximum drain current of 3.5 A and operating temperature of 150°C, this transistor is designed to deliver optimal results. Trust Onsemi to provide value, benefits, and advantages that exceed expectations, making the CPH6445-TL-W a smart choice for your next project.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors offer higher mobility and conductivity compared to P-CHANNEL transistors, making them suitable for high-performance applications.

Configuration: SINGLE

SINGLE configuration simplifies circuit design and reduces the number of components required, making the product more cost-effective.

Surface Mount: YES

Surface mount technology allows for higher component density on PCBs, enabling compact and space-saving designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy and precise control of the output, making them ideal for applications requiring precise modulation or switching.

Maximum Drain Current (Abs) (ID): 3.5 A

High maximum drain current allows the FET to handle higher power loads, making it suitable for applications requiring high current capabilities.

Maximum Power Dissipation (Abs): 1.6 W

High power dissipation capability ensures the FET can withstand high power levels without overheating, improving overall reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds, low on-resistance, and high input impedance, making it suitable for high-frequency applications and power management.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures the FET can operate reliably in high-temperature environments without performance degradation.

Terminal Finish: TIN BISMUTH

TIN BISMUTH terminal finish provides good solderability and ensures reliable electrical connections, increasing the overall durability of the product.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time reduces the risk of damage to the FET during soldering, ensuring optimal performance and longevity.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for efficient and reliable soldering, ensuring strong mechanical and electrical connections.

Technical Specifications

Power Field Effect Transistors (FET) CPH6445-TL-W attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

3.5 A

Maximum Drain Current (ID):

3.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

CPH6445-TL-W Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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