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CPH6412

Onsemi

CPH6412 by Onsemi

CPH6412 by Onsemi is a N-CHANNEL Power FET with 6A max drain current and 1.6W power dissipation. Ideal for applications requiring high efficiency in a compact design, such as power management systems or motor control circuits. Operating in enhancement mode, it offers reliable performance up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 577 parts In-Stock

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Vyrian

USA . 143 parts In-Stock

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Native Components

USA . 84 parts In-Stock

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$0.275

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$0.264

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Northwest PG Solutions

USA . 1,884 parts In-Stock

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$0.302

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$0.266

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Problanco Electronics

Mexico . 5,325 parts In-Stock

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TANS Electronics

Latvia . 3,024 parts In-Stock

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SupplyDigital Components

Austria . 2,714 parts In-Stock

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Corphita

USA . 2,191 parts In-Stock

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Kulean Microsystems

USA . 1,547 parts In-Stock

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UHIMA Technologies

Türkiye . 129 parts In-Stock

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Corohmni

South Africa . 129 parts In-Stock

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Overview

Upgrade your power systems with the CPH6412 by Onsemi, a top-quality N-CHANNEL Power Field Effect Transistor designed for enhanced performance and efficiency. Manufactured by industry leader Onsemi, this single configuration transistor offers a maximum drain current of 6 A and a maximum power dissipation of 1.6 W, making it perfect for a wide range of applications. From consumer electronics to industrial machinery, the CPH6412 provides exceptional value, reliability, and versatility to meet all your power requirements. Experience the difference with Onsemi's cutting-edge technology and unlock the full potential of your projects.

Feature Benefit Bullets

Polarity or Channel Type N-CHANNEL

N-CHANNEL transistors have higher mobility and conductivity, making them efficient for power applications.

Configuration SINGLE

SINGLE configuration simplifies the circuit design and reduces complexity.

Surface Mount YES

Surface mount capability allows for easy and efficient PCB assembly.

Operating Mode ENHANCEMENT MODE

ENHANCEMENT MODE operation allows for high switching speeds and low on-state resistance.

Maximum Drain Current (Abs) (ID) 6 A

High maximum drain current rating of 6A enables the transistor to handle large power loads.

Maximum Power Dissipation (Abs) 1.6 W

Efficient power dissipation of up to 1.6W ensures stable operation under high loads.

Field Effect Transistor Technology METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability and low leakage current.

Maximum Operating Temperature 150 °C

High maximum operating temperature of 150 °C allows for operation in demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) CPH6412 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

6 A

Maximum Drain Current (ID):

6 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

CPH6412 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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