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CPH6337-TL-E

Onsemi

CPH6337-TL-E by Onsemi

CPH6337-TL-E by Onsemi is a P-CHANNEL FET with 3.5A max drain current and 1.6W power dissipation. Ideal for applications requiring high temperature tolerance up to 150 °C, it features surface mount configuration for compact designs in power electronics projects.

Median Price

$0.183

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 53,950 parts In-Stock

1+ parts

-

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$0.198

1k+ parts

$0.164

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$0.147

53,950

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$0.198

$0.164

$0.147

DigiKey

USA . 53,950 parts In-Stock

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$0.170

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$0.170

Verical

USA . 21,000 parts In-Stock

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$0.183

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$0.183

Distributors (In-Stock)

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Digiode

USA . 471 parts In-Stock

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$0.155

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Vyrian

USA . 1,167 parts In-Stock

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$0.163

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DigiKey Marketplace

USA . 53,950 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,375 parts In-Stock

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$0.147

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$0.147

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Corohmni

South Africa . 228 parts In-Stock

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$0.163

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228

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Kepictronics

USA . 306,000 parts In-Stock

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Continental Prestige Electronics

USA . 53,950 parts In-Stock

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$0.149

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Problanco Electronics

Mexico . 1,706 parts In-Stock

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TANS Electronics

Latvia . 731 parts In-Stock

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Native Components

USA . 726 parts In-Stock

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Northwest PG Solutions

USA . 702 parts In-Stock

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SupplyDigital Components

Austria . 506 parts In-Stock

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UHIMA Technologies

Türkiye . 494 parts In-Stock

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Kulean Microsystems

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Overview

Unleash the power of innovation with the CPH6337-TL-E by Onsemi. Crafted with precision and expertise, this P-CHANNEL Power Field Effect Transistor offers unmatched performance and reliability in various applications. From cutting-edge electronics to industrial machinery, this FET delivers exceptional value and efficiency. Trust in Onsemi's legacy of excellence and elevate your projects with the CPH6337-TL-E. Experience the difference today.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance, making them suitable for high efficiency power switching applications.

Configuration: SINGLE

Single configuration simplifies the circuit design and reduces complexity, making it easier to integrate into various systems.

Surface Mount: YES

Surface mount capability allows for easy placement on PCBs, saving space and facilitating automated assembly processes.

Maximum Drain Current (Abs) (ID): 3.5 A

High maximum drain current rating of 3.5A allows for handling higher power levels and ensures robust performance in demanding applications.

Maximum Power Dissipation (Abs): 1.6 W

With a maximum power dissipation of 1.6W, this FET can operate efficiently without overheating, increasing its reliability and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low gate leakage and high switching speed, enhancing the FET's overall performance.

Maximum Operating Temperature: 150 °C

High maximum operating temperature of 150 °C ensures stable performance even in elevated temperature environments, making it suitable for industrial applications.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Tin/Bismuth terminal finish provides good solderability and reliability in various operating conditions, contributing to the overall durability of the product.

Technical Specifications

Power Field Effect Transistors (FET) CPH6337-TL-E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

3.5 A

Maximum Drain Current (ID):

3.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Trade Compliance

CPH6337-TL-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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