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CPH6315

Onsemi

CPH6315 by Onsemi

CPH6315 by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage and 12A IDM. Ideal for SWITCHING applications, it features SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has 0.15 ohm Drain-Source On Resistance and 40pF Crss.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Fibra_Brandt Electronic GMBH

Germany . 3,000 parts In-Stock

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Vyrian

USA . 1,451 parts In-Stock

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Digiode

USA . 681 parts In-Stock

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Native Components

USA . 321 parts In-Stock

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$0.357

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$0.343

321

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$0.343

Northwest PG Solutions

USA . 1,650 parts In-Stock

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$0.393

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$0.346

1,650

$0.393

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$0.346

SupplyDigital Components

Austria . 8,250 parts In-Stock

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TANS Electronics

Latvia . 8,159 parts In-Stock

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Kulean Microsystems

USA . 5,924 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 1,643 parts In-Stock

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UHIMA Technologies

Türkiye . 802 parts In-Stock

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Corphita

USA . 585 parts In-Stock

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Corohmni

South Africa . 281 parts In-Stock

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Overview

Unleash the power of innovation with the CPH6315 by Onsemi! Crafted with precision and expertise, this P-Channel Power Field Effect Transistor (FET) offers seamless switching capabilities for a wide range of applications. With a built-in diode and enhancement mode operation, this transistor delivers top-notch performance and reliability. Say goodbye to compromise and hello to efficiency with the CPH6315 - the perfect choice for your next project. Experience the quality and value that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components, making this FET suitable for rugged environments.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance and high current-carrying capability, making them efficient for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for the efficient handling of back EMF (electromotive force) in inductive loads, protecting the circuit from voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power dissipation, making it ideal for power management.

Surface Mount: YES

Being surface mountable, this FET can be easily integrated into compact electronic designs, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 20 V

With a high breakdown voltage, this FET can handle higher voltage levels without breakdown, ensuring reliable performance in various applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during the assembly process, enhancing the overall reliability of the product.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage at the gate to conduct, offering better control over the switching behavior and reducing the risk of accidental activation.

Maximum Pulsed Drain Current (IDM): 12 A

With a high pulsed drain current rating, this FET can handle short-term current surges without overheating, ensuring reliable operation in high-demand applications.

No. of Terminals: 6

The six terminals provide flexibility in circuit design and connectivity options, allowing for versatile application possibilities.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space and facilitates heat dissipation, making it suitable for compact electronic devices with limited space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and fast switching speeds, making this FET energy-efficient and suitable for high-frequency applications.

Maximum Power Dissipation Ambient: 1.6 W

With a low power dissipation rating, this FET generates less heat during operation, improving overall energy efficiency and reducing the need for extensive cooling mechanisms.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature tolerance allows this FET to be used in demanding environments without the risk of overheating or performance degradation.

Transistor Element Material: SILICON

Silicon-based FETs offer reliable performance, low leakage currents, and high temperature tolerance, making them suitable for a wide range of applications.

Maximum Drain Current (ID): 3 A

The high maximum drain current rating ensures that this FET can handle substantial current loads, making it suitable for power-hungry applications.

Maximum Drain-Source On Resistance: 0.15 ohm

With a low on-resistance, this FET minimizes power losses and voltage drops during operation, improving overall efficiency and performance.

Terminal Position: DUAL

Dual terminal positions offer additional flexibility in circuit design and layout, allowing for optimized connections and improved signal integrity.

Maximum Feedback Capacitance (Crss): 40 pF

The low feedback capacitance minimizes the risk of signal distortion and interference, ensuring reliable and stable performance in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) CPH6315 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

40 pF

JESD-30 Code:

R-PDSO-G6

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

1.6 W

Maximum Pulsed Drain Current (IDM):

12 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CPH6315 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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