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CPH6350-TL-E

Onsemi

CPH6350-TL-E by Onsemi

Power Field-Effect Transistors; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e6; Terminal Finish: Tin/Bismuth (Sn/Bi);

Median Price

$13.900

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 903 parts In-Stock

1+ parts

$13.900

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903

$13.900

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Distributors (In-Stock)

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Digiode

USA . 1,014 parts In-Stock

1+ parts

$13.205

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1,014

$13.205

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Chip Stock

USA . 15,105 parts In-Stock

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15,105

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Vyrian

USA . 4,288 parts In-Stock

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4,288

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Flip Electronics

USA . 950 parts In-Stock

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950

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,706 parts In-Stock

1+ parts

$12.510

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1,706

$12.510

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Corohmni

South Africa . 365 parts In-Stock

1+ parts

$13.900

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365

$13.900

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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90,000

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Perfect Parts

USA . 14,379 parts In-Stock

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14,379

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SupplyDigital Components

Austria . 7,217 parts In-Stock

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7,217

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TANS Electronics

Latvia . 6,133 parts In-Stock

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6,133

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Kulean Microsystems

USA . 5,421 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,699 parts In-Stock

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2,699

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Authorized Procurement Solutions

USA . 1,661 parts In-Stock

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1,661

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Problanco Electronics

Mexico . 933 parts In-Stock

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933

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GreenTree Electronics

Israel . 933 parts In-Stock

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933

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UHIMA Technologies

Türkiye . 931 parts In-Stock

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931

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Kepictronics

USA . 478 parts In-Stock

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478

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Native Components

USA . 475 parts In-Stock

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475

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Northwest PG Solutions

USA . 141 parts In-Stock

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141

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Technical Specifications

Power Field Effect Transistors (FET) CPH6350-TL-E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Trade Compliance

CPH6350-TL-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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