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CPH6413

Onsemi

CPH6413 by Onsemi

CPH6413 by Onsemi is a N-CHANNEL FET with 5A max drain current and 1.6W power dissipation. Ideal for applications requiring high efficiency in a single configuration, such as power management systems. Operating in enhancement mode, it can handle up to 150 °C temperature with surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,004 parts In-Stock

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Digiode

USA . 1,233 parts In-Stock

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Native Components

USA . 359 parts In-Stock

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$16.850

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359

$16.850

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Northwest PG Solutions

USA . 1,878 parts In-Stock

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$18.535

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$16.682

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Kulean Microsystems

USA . 6,679 parts In-Stock

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6,679

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SupplyDigital Components

Austria . 5,450 parts In-Stock

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Problanco Electronics

Mexico . 5,037 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Corphita

USA . 2,154 parts In-Stock

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TANS Electronics

Latvia . 976 parts In-Stock

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UHIMA Technologies

Türkiye . 304 parts In-Stock

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Corohmni

South Africa . 201 parts In-Stock

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Overview

Unleash the power of innovation with the CPH6413 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that ensure reliable performance and durability. Ideal for various applications, this N-CHANNEL transistor offers unmatched efficiency and precision. Experience the value and benefits of enhanced power management with the CPH6413, where quality meets excellence. Elevate your projects to new heights with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically offer lower on-state resistance and higher efficiency compared to P-CHANNEL FETs, making them a good choice for high-power applications.

Configuration: SINGLE

Single configuration FETs are simpler to design with and often have better thermal performance, making them suitable for various applications.

Surface Mount: YES

Surface mount FETs are easier to assemble, save space, and have better heat dissipation, making them ideal for compact circuit designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and offer better performance characteristics than depletion mode FETs, ensuring reliable operation in various circuits.

Maximum Drain Current (Abs) (ID): 5 A

A maximum drain current of 5A allows for handling higher power levels, making this FET suitable for applications requiring high current capability.

Maximum Power Dissipation (Abs): 1.6 W

With a maximum power dissipation of 1.6W, this FET can efficiently handle power without overheating, ensuring reliable operation in demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor FETs offer superior performance with low gate capacitance and high switching speeds, making them suitable for applications requiring high efficiency and fast response.

Maximum Operating Temperature: 150 °C

Operating at a maximum temperature of 150 °C ensures the FET can withstand high temperature environments without performance degradation, ideal for industrial or automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) CPH6413 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

CPH6413 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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