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CPH6354-TL-H

Onsemi

CPH6354-TL-H by Onsemi

CPH6354-TL-H by Onsemi is a P-CHANNEL FET with 4A max drain current and 1.6W power dissipation. Ideal for applications requiring high temperature resistance up to 150 °C, such as power management in automotive electronics or industrial control systems.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 1,234 parts In-Stock

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ComSIT Distribution GmbH

Germany . 129 parts In-Stock

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Digiode

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Native Components

USA . 72 parts In-Stock

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$5.285

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Component Stockers USA

USA . 362 parts In-Stock

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$99.990

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Kepictronics

USA . 26,584 parts In-Stock

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TANS Electronics

Latvia . 8,041 parts In-Stock

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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SupplyDigital Components

Austria . 5,834 parts In-Stock

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Kulean Microsystems

USA . 5,731 parts In-Stock

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Assy Fe

Spain . 2,300 parts In-Stock

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Problanco Electronics

Mexico . 2,113 parts In-Stock

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Corphita

USA . 1,328 parts In-Stock

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UHIMA Technologies

Türkiye . 576 parts In-Stock

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Corohmni

South Africa . 425 parts In-Stock

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Northwest PG Solutions

USA . 287 parts In-Stock

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Overview

Experience the superior quality and reliability of the CPH6354-TL-H P-CHANNEL Power Field Effect Transistor by Onsemi. With a maximum drain current of 4A and a maximum power dissipation of 1.6W, this surface-mount transistor is perfect for a variety of applications. Whether you're designing power management systems or motor control circuits, this transistor offers unmatched performance and efficiency. Trust Onsemi's cutting-edge technology and innovation to deliver exceptional value and benefits to your projects. Upgrade to the CPH6354-TL-H today and experience the difference!

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-channel FETs offer low on-state resistance and high current-carrying capability, making them suitable for efficient power management applications.

Configuration: SINGLE

Single configuration simplifies circuit design and reduces component count, leading to cost-effective solutions.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Drain Current (Abs) (ID): 4 A

High maximum drain current rating enables the FET to handle heavy loads and high power applications reliably.

Maximum Power Dissipation (Abs): 1.6 W

Low power dissipation helps in minimizing heat generation, ensuring stable operation and prolonged lifespan of the device.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency, fast switching speeds, and low gate drive power requirements, ideal for power management applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance allows for reliable performance in harsh environments and extended use scenarios.

Terminal Finish: TIN BISMUTH

Tin Bismuth terminal finish provides good solderability and reliability in solder joints, enhancing overall product durability.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time ensures efficient soldering process and minimizes thermal stress on the component and surrounding circuitry.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for lead-free soldering and complies with RoHS regulations for environmental friendliness.

Technical Specifications

Power Field Effect Transistors (FET) CPH6354-TL-H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

CPH6354-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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