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CPH6341-TL-E

Onsemi

CPH6341-TL-E by Onsemi

CPH6341-TL-E by Onsemi is a P-CHANNEL FET with 5A max drain current and 1.6W power dissipation. Ideal for applications requiring high temperature resistance up to 150 °C, such as power management in electronic devices. Surface mountable with tin bismuth finish for efficient assembly.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 2,433 parts In-Stock

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Digiode

USA . 1,154 parts In-Stock

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NexGen Digital

USA . 29 parts In-Stock

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Native Components

USA . 983 parts In-Stock

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$0.613

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Northwest PG Solutions

USA . 1,511 parts In-Stock

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$0.674

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Kepictronics

USA . 306,000 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

USA . 23,038 parts In-Stock

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Problanco Electronics

Mexico . 7,824 parts In-Stock

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Kulean Microsystems

USA . 6,566 parts In-Stock

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TANS Electronics

Latvia . 5,199 parts In-Stock

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SupplyDigital Components

Austria . 4,242 parts In-Stock

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Authorized Procurement Solutions

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Assy Fe

Spain . 1,637 parts In-Stock

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UHIMA Technologies

Türkiye . 453 parts In-Stock

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Corohmni

South Africa . 400 parts In-Stock

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Corphita

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Overview

Unleash the power of innovation with the CPH6341-TL-E by Onsemi. This high-quality P-CHANNEL Power FET offers unmatched efficiency and reliability, making it ideal for a wide range of applications. With Onsemi's reputation for excellence in semiconductor technology, you can trust that this transistor will deliver superior performance. Experience the value and benefits of this product, whether you're looking to optimize power management in automotive systems, industrial equipment, or consumer electronics. Upgrade your technology with the CPH6341-TL-E and see the difference for yourself.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-CHANNEL FETs are efficient in applications where high-side switching is required, making this product suitable for power management in various electronic devices.

Configuration: SINGLE

Single configuration simplifies circuit design and helps in reducing complexity, making it easier to integrate this FET into different electronic assemblies.

Surface Mount: YES

Surface mount capability allows for compact and space-saving designs, ideal for applications where PCB real estate is limited or where smaller form factors are desired.

Maximum Drain Current (Abs) (ID): 5 A

With a high maximum drain current rating, this FET can handle higher loads, making it suitable for power applications that require handling significant currents.

Maximum Power Dissipation (Abs): 1.6 W

The low maximum power dissipation indicates that this FET can operate efficiently without overheating, ensuring reliable performance in various operating conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal oxide semiconductor technology offers good performance and reliability, making this FET a durable and stable component for different electronic systems.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, enabling it to be used in applications where heat dissipation is a concern.

Terminal Finish: TIN BISMUTH

The use of tin bismuth terminal finish enhances solderability and ensures good conductivity, facilitating easy and reliable connections in the circuit.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature indicates quick soldering process, reducing assembly time and making this FET suitable for high-volume production.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures that this FET can withstand soldering processes without damage, ensuring robust performance during manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) CPH6341-TL-E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

CPH6341-TL-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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