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AUIRF7341QTR

Infineon Technologies

AUIRF7341QTR by Infineon Technologies

AUIRF7341QTR by Infineon is a N-CHANNEL FET with 55V DS breakdown voltage, ideal for SWITCHING applications. Features include 42A max pulsed drain current, 140mJ avalanche energy rating, and 0.05 ohm max drain-source resistance. Suitable for high-power switching in various electronic devices.

Median Price

$1.459

Lifecycle Status

Suppliers In-Stock

16

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1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 13,735 parts In-Stock

1+ parts

$0.832

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$0.832

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$0.832

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$0.832

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Chip1Stop

Japan . 3,950 parts In-Stock

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$2.690

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$1.390

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$2.690

$1.390

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Element14

Singapore . 47,915 parts In-Stock

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$1.996

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$1.532

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$1.502

47,915

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$1.996

$1.532

$1.502

Rochester

USA . 43,975 parts In-Stock

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$1.430

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$1.190

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$1.060

43,975

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$1.060

Farnell

UK . 41,863 parts In-Stock

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$1.560

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$1.240

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Verical

USA . 40,000 parts In-Stock

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$1.488

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$1.325

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$1.488

$1.325

RS (Exports)

UK . 15,600 parts In-Stock

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$1.262

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$1.262

Mouser Electronics

USA . 1,140 parts In-Stock

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$1.250

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Distributors (In-Stock)

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Digiode

USA . 676 parts In-Stock

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$0.790

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676

$0.790

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Nova Conductors

Japan . 200 parts In-Stock

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$1.896

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200

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Maritex

Poland . 28,000 parts In-Stock

1+ parts

$2.748

100+ parts

$1.480

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$1.163

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$0.979

28,000

$2.748

$1.480

$1.163

$0.979

Vyrian

USA . 18,633 parts In-Stock

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Sensible Micro Corp

USA . 2,752 parts In-Stock

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VNN

France . 909 parts In-Stock

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Euro-Tech

UK . 200 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Corohmni

South Africa . 215 parts In-Stock

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$0.556

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215

$0.556

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Aztec Data Supply Inc.

USA . 147 parts In-Stock

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$0.558

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147

$0.558

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Ampacity Inc.

Singapore . 24,505 parts In-Stock

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$0.710

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$0.710

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Corphita

USA . 945 parts In-Stock

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$0.749

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945

$0.749

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Modulus Dynamics

Lithuania . 14,024 parts In-Stock

1+ parts

$0.844

100+ parts

$0.810

1k+ parts

$0.776

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14,024

$0.844

$0.810

$0.776

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Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$1.143

100+ parts

$1.086

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$1.086

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870

$1.143

$1.086

$1.086

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Argo Parts USA

USA . 3,327 parts In-Stock

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$1.334

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$1.334

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Semicontronic

India . 23,946 parts In-Stock

1+ parts

$1.540

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$1.502

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$1.494

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$1.540

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Netroflash

USA . 2,000 parts In-Stock

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$1.896

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Microchip USA

USA . 3,016 parts In-Stock

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$6.500

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$6.460

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$6.460

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$6.460

3,016

$6.500

$6.460

$6.460

$6.460

Metaverse IC Inc.

Canada . 180,000 parts In-Stock

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Continental Prestige Electronics

USA . 48,242 parts In-Stock

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$1.610

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$1.120

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RC Electronics

USA . 38,207 parts In-Stock

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$1.520

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$1.390

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$1.350

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QUARKTWIN TECHNOLOGY LTD

USA . 18,446 parts In-Stock

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Lixinc

USA . 14,822 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,184 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,789 parts In-Stock

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Robosynatics

Brazil . 4,713 parts In-Stock

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$1.036

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$1.015

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$1.015

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Lucentia Tech

USA . 4,713 parts In-Stock

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$1.036

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$1.015

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$1.015

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$1.036

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$1.015

iodParts Technologies Inc.

India . 2,949 parts In-Stock

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$1.383

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Futuretech Components

Singapore . 1,220 parts In-Stock

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Perfect Parts

USA . 24 parts In-Stock

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Overview

Unlock the power of innovation with the AUIRF7341QTR by Infineon Technologies. This top-of-the-line Power Field Effect Transistor (FET) boasts high-quality materials and advanced technology, making it perfect for a wide range of switching applications. With its N-CHANNEL design and built-in diode, this transistor offers unparalleled performance and efficiency. Experience seamless operation and reliable results with the AUIRF7341QTR, the ultimate choice for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and insulation for the transistor, making it durable and reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs have lower on-resistance and higher electron mobility, making them efficient for switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The built-in diode allows for efficient protection against reverse voltage while the separate elements offer flexibility in circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance and efficiency in power control.

Surface Mount: YES

Surface mount packaging allows for easy integration onto circuit boards, saving space and facilitating automated assembly.

Minimum DS Breakdown Voltage: 55 V

With a high breakdown voltage, this FET can handle higher input voltages without failing, making it suitable for a wide range of applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off and require a positive voltage at the gate to turn on, providing better control over switching operations.

Maximum Pulsed Drain Current (IDM): 42 A

The high pulsed drain current rating allows this FET to handle surge currents without damage, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 140 mJ

The high avalanche energy rating indicates the FET's ability to withstand sudden voltage spikes and transients without breakdown, ensuring reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 5.1 A

With a high maximum drain current rating, this FET can handle significant power loads while maintaining stability and efficiency.

Maximum Power Dissipation (Abs): 2.4 W

The low power dissipation helps in minimizing heat generation and improving overall efficiency of the circuit.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds, low gate drive requirements, and low on-resistance, making it ideal for power control applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows this FET to operate reliably in a wide range of environmental conditions.

Transistor Element Material: SILICON

Silicon-based FETs offer good thermal stability, high breakdown voltage, and low conduction losses, ensuring long-term performance and reliability.

Maximum Drain-Source On Resistance: 0.05 ohm

With a low on-resistance, this FET minimizes power losses and heat dissipation during operation, improving overall efficiency.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit layout and connection options, making it easier to integrate this FET into various designs.

Technical Specifications

Power Field Effect Transistors (FET) AUIRF7341QTR attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

140 mJ

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

5.1 A

Maximum Drain Current (ID):

5.1 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MS-012AA

JESD-30 Code:

R-PDSO-G8

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

42 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

AUIRF7341QTR Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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