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2N7002PS,115

NXP Semiconductors

2N7002PS,115 by NXP Semiconductors

2N7002PS,115 by NXP Semiconductors is an N-CHANNEL Power FET with 0.32A Max Drain Current and 0.99W Power Dissipation. It operates in ENHANCEMENT MODE and can withstand temperatures from -55 to 150 °C. Ideal for applications requiring high power efficiency in compact designs.

Median Price

$0.102

Lifecycle Status

Suppliers In-Stock

27

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1k+

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Chip1Stop

Japan . 1,359 parts In-Stock

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DigiKey

USA . 6,105 parts In-Stock

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$0.077

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Mouser Electronics

USA . 3,158 parts In-Stock

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$0.310

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$0.119

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$0.090

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Arrow

USA . 309,000 parts In-Stock

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Verical

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Elektronika Sales Private Limited

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Rochester

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RS (Exports)

UK . 123,900 parts In-Stock

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Farnell

UK . 51,000 parts In-Stock

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Newark

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Element14

Singapore . 30,000 parts In-Stock

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EBV Elektronik

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Digiode

USA . 4,187 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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TME

Poland . 6,951 parts In-Stock

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Bristol Electronics

USA . 655 parts In-Stock

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$1.500

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$0.555

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IBS Electronics

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NAC Semi

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Chip Stock

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ComSIT Distribution GmbH

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Semtec, LLC

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Prism Electronics

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Semicontronic

India . 799,916 parts In-Stock

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Ampacity Inc.

Singapore . 432,698 parts In-Stock

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Corphita

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Argo Parts USA

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AZTECH Wire

Italy . 8,531 parts In-Stock

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Netroflash

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Corohmni

South Africa . 477 parts In-Stock

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Advanced Electronics

New Zealand . 60 parts In-Stock

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Continental Prestige Electronics

USA . 164,893 parts In-Stock

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Aztec Data Supply Inc.

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Perfect Parts

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Eastek

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QUARKTWIN TECHNOLOGY LTD

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Lucentia Tech

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Lixinc

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Microchip USA

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Overview

Unlock the power of innovation with the 2N7002PS,115 by NXP Semiconductors. As a leading manufacturer in the industry, NXP guarantees top-notch quality and reliability. This power field effect transistor is perfect for applications requiring high performance, efficiency, and functionality. From consumer electronics to industrial automation, this enhancement mode transistor offers exceptional value and benefits. Experience the advantages of cutting-edge technology and elevate your projects to new heights with the 2N7002PS,115.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them a good choice for power applications.

Surface Mount: YES

Surface mount FETs are easier to mount on PCBs, saving space and making assembly more efficient.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs can be easily controlled using a positive voltage, providing better control and efficiency in power applications.

Maximum Drain Current (Abs) (ID): 0.32 A

With a high maximum drain current, this FET can handle higher power loads, making it suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 0.99 W

The high power dissipation capability ensures that the FET can handle power surges and thermal stress effectively, increasing its reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance and reliability, making this FET suitable for demanding applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can be used in environments with elevated temperatures without degrading performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures that the FET can operate in cold environments without any issues, increasing its versatility.

Terminal Finish: TIN

A tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections and longevity of the FET.

Maximum Time At Peak Reflow Temperature (s): 30

The FET can withstand high reflow temperatures for a short duration, facilitating efficient assembly processes without damaging the component.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering during assembly processes, ensuring a robust connection to the PCB.

Technical Specifications

Power Field Effect Transistors (FET) 2N7002PS,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Maximum Drain Current (Abs) (ID):

.32 A

Maximum Drain Current (ID):

.32 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

2N7002PS,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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