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FDS2582

Onsemi

FDS2582 by Onsemi

FDS2582 by Onsemi is a N-CHANNEL Power FET with 150V DS Breakdown Voltage. It features a built-in diode, 4.1A Drain Current, and 0.066 ohm On Resistance. Ideal for SWITCHING applications, this transistor operates in ENHANCEMENT MODE with an EAS of 252mJ and can handle up to 2.5W power dissipation.

Median Price

$0.536

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 60 parts In-Stock

1+ parts

$0.496

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$0.472

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$0.472

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60

$0.496

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$0.472

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Mouser Electronics

USA . 4,193 parts In-Stock

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$2.080

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$0.902

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$2.080

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Future Electronics

Canada . 10,000 parts In-Stock

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$0.545

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$0.545

Verical

USA . 5,000 parts In-Stock

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$0.509

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$0.509

Chip1Stop

Japan . 5,000 parts In-Stock

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$0.526

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Arrow

USA . 2,500 parts In-Stock

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$0.546

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$0.546

Distributors (In-Stock)

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Digiode

USA . 1,449 parts In-Stock

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$0.471

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$0.471

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Nova Conductors

Japan . 300 parts In-Stock

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$0.965

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300

$0.965

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TME

Poland . 4 parts In-Stock

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$1.550

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$0.870

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$0.730

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$0.710

4

$1.550

$0.870

$0.730

$0.710

Forefront Electronics and Design

USA . 300 parts In-Stock

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$2.450

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Chip Stock

USA . 71,507 parts In-Stock

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IBS Electronics

USA . 7,500 parts In-Stock

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$1.543

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NAC Semi

USA . 5,000 parts In-Stock

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$1.670

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Vyrian

USA . 4,425 parts In-Stock

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Sensible Micro Corp

USA . 4,032 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 1,385 parts In-Stock

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Flip Electronics

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Speed Components Ltd

Israel . 29 parts In-Stock

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HZD GmbH

Germany . 15 parts In-Stock

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Bristol Electronics

USA . 10 parts In-Stock

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J2 Sourcing AB

Sweden . 6 parts In-Stock

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Prism Electronics

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,343 parts In-Stock

1+ parts

$0.421

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4,343

$0.421

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Semicontronic

India . 4,334 parts In-Stock

1+ parts

$0.421

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$0.410

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$0.408

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4,334

$0.421

$0.410

$0.408

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Corphita

USA . 2,537 parts In-Stock

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$0.446

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$0.446

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Corohmni

South Africa . 336 parts In-Stock

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$0.495

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336

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$0.496

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$0.472

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$0.472

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60

$0.496

$0.472

$0.472

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Continental Prestige Electronics

USA . 6,824 parts In-Stock

1+ parts

$0.965

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$0.946

6,824

$0.965

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$0.946

Argo Parts USA

USA . 786 parts In-Stock

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$0.965

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786

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Netroflash

USA . 100 parts In-Stock

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$0.965

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$0.946

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Aztec Data Supply Inc.

USA . 3,224 parts In-Stock

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$1.424

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Andel Nordic

Denmark . 1,677 parts In-Stock

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$3.767

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$3.617

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$3.617

1,677

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$3.617

Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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RC Electronics

USA . 69,318 parts In-Stock

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$0.610

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$0.560

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$0.540

69,318

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$0.610

$0.560

$0.540

Kepictronics

USA . 29,073 parts In-Stock

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Perfect Parts

USA . 17,662 parts In-Stock

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Eastek

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Authorized Procurement Solutions

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Assy Fe

Spain . 7,500 parts In-Stock

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TANS Electronics

Latvia . 7,254 parts In-Stock

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Kulean Microsystems

USA . 6,102 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,827 parts In-Stock

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Futuretech Components

Singapore . 2,500 parts In-Stock

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GreenTree Electronics

Israel . 2,002 parts In-Stock

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Problanco Electronics

Mexico . 1,247 parts In-Stock

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SupplyDigital Components

Austria . 1,154 parts In-Stock

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UHIMA Technologies

Türkiye . 606 parts In-Stock

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Supply Digital

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Overview

Power up your devices with the high-quality FDS2582 by Onsemi, a leading manufacturer in the industry. This N-CHANNEL Power Field Effect Transistor (FET) is perfect for switching applications, offering enhanced performance and reliability. With a maximum DS Breakdown Voltage of 150V and a Maximum Drain Current of 4.1A, this transistor ensures efficient power management. Whether you're designing consumer electronics or industrial equipment, the FDS2582 provides the value and benefits you need for seamless operation. Trust Onsemi for top-notch quality and superior technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties, making the product suitable for high voltage applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and higher efficiency compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast response times and efficient operation.

Surface Mount: YES

Easily mounted on PCBs, saving space and enabling automated assembly processes.

Minimum DS Breakdown Voltage: 150 V

Suitable for applications requiring high voltage handling capabilities.

Avalanche Energy Rating (EAS): 252 mJ

Can withstand high energy spikes, providing durability in demanding environments.

Maximum Drain Current (ID): 4.1 A

Capable of handling high current loads, making it versatile for various applications.

Maximum Power Dissipation (Abs): 2.5 W

Efficient power handling, reducing the risk of overheating and ensuring reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high performance and reliability in power switching applications.

Maximum Operating Temperature: 150 °C

Can operate in high temperature environments without performance degradation.

Maximum Drain-Source On Resistance: 0.066 ohm

Low on-resistance leads to reduced power loss and improved efficiency.

Technical Specifications

Power Field Effect Transistors (FET) FDS2582 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

252 mJ

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

4.1 A

Maximum Drain Current (ID):

4.1 A

Maximum Drain-Source On Resistance:

.066 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS2582 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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