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IRLL014NTRPBF

Infineon Technologies

IRLL014NTRPBF by Infineon Technologies

IRLL014NTRPBF by Infineon Technologies is a N-CHANNEL Power FET with 55V DS Breakdown Voltage and 16A IDM. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has an EAS of 32mJ and 0.14 ohm Drain-Source On Resistance.

Median Price

$0.258

Lifecycle Status

Suppliers In-Stock

52

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 632 parts In-Stock

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Newark

USA . 2,967 parts In-Stock

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$0.402

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$0.297

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DigiKey

USA . 30,074 parts In-Stock

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Mouser Electronics

USA . 16,501 parts In-Stock

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Verical

USA . 307,500 parts In-Stock

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Arrow

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EBV Elektronik

Germany . 85,000 parts In-Stock

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UK . 12,656 parts In-Stock

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Element14

Singapore . 9,106 parts In-Stock

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Avnet

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Chip1Stop

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USA . 15 parts In-Stock

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USA . 20,000 parts In-Stock

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DF Sales Co.

USA . 200 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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TME

Poland . 4,465 parts In-Stock

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Freelance Electronics

USA . 1,280 parts In-Stock

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Galco

USA . 7 parts In-Stock

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NAC Semi

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SIE Connect GmbH - GreenChips

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Mil-Aero Solutions, Inc.

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ComSIT Distribution GmbH

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Connect4Technologies Inc.

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Micros

Poland . 759 parts In-Stock

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Ampacity Inc.

Singapore . 83,692 parts In-Stock

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Semicontronic

India . 81,969 parts In-Stock

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Corphita

USA . 280 parts In-Stock

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Argo Parts USA

USA . 4,094 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Advanced Electronics

New Zealand . 70 parts In-Stock

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Corohmni

South Africa . 36 parts In-Stock

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Aztec Data Supply Inc.

USA . 406 parts In-Stock

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Continental Prestige Electronics

USA . 23,052 parts In-Stock

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$0.450

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$0.286

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$0.231

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$0.231

Modulus Dynamics

Lithuania . 5,848 parts In-Stock

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$0.829

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$0.796

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Eastek

USA . 720,000 parts In-Stock

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USA . 263,372 parts In-Stock

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Component Connect

USA . 232,675 parts In-Stock

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Israel . 222,500 parts In-Stock

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Spain . 68,502 parts In-Stock

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Brazil . 22,716 parts In-Stock

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Lucentia Tech

USA . 22,716 parts In-Stock

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Futuretech Components

Singapore . 17,980 parts In-Stock

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UK . 3,181 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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Germany . 1,600 parts In-Stock

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Overview

Experience the superior quality and reliability of the IRLL014NTRPBF by Infineon Technologies, a top-of-the-line Power FET designed for switching applications. With a 55V minimum DS breakdown voltage and 16A maximum pulsed drain current, this N-channel transistor offers exceptional performance in a compact, easy-to-install package. Whether you're looking to optimize power management or enhance circuit efficiency, this transistor's built-in diode and low on-resistance (0.14 ohm) provide unparalleled value and benefits. Trust Infineon Technologies to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the transistor, making it suitable for various industrial and commercial applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-state resistance and can handle higher currents compared to P-channel FETs, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from reverse voltage spikes, enhancing the reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low ON-state resistance, making it ideal for high-efficiency power conversion.

Surface Mount: YES

The surface mount design allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Minimum DS Breakdown Voltage: 55 V

With a high breakdown voltage, this FET can handle higher voltages, making it suitable for power switching applications in industrial and automotive systems.

Maximum Pulsed Drain Current (IDM): 16 A

The high pulsed drain current rating allows for the handling of peak currents in transient conditions, increasing the reliability of the product.

Maximum Power Dissipation (Abs): 2.1 W

The low power dissipation rating ensures efficient operation and helps in preventing overheating of the transistor in high-power applications.

Maximum Drain-Source On Resistance: 0.14 ohm

The low ON-state resistance reduces power loss and improves efficiency in switching applications by minimizing voltage drops across the transistor.

Technical Specifications

Power Field Effect Transistors (FET) IRLL014NTRPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

32 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

.14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

30 pF

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

16 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRLL014NTRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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