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IRF9540NSTRLPBF

Infineon Technologies

IRF9540NSTRLPBF by Infineon Technologies

Infineon's IRF9540NSTRLPBF is a P-CHANNEL FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring 92A IDM and 84mJ EAS, it operates in ENHANCEMENT MODE with -55 to 175°C temperature range. The PLASTIC/EPOXY package has GULL WING terminals and DRAIN connection, making it suitable for high-power circuits.

Median Price

$1.297

Lifecycle Status

Suppliers In-Stock

41

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 4,148 parts In-Stock

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Adafruit Industries

USA . 350 parts In-Stock

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Chip1Stop

Japan . 795 parts In-Stock

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$1.680

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$0.809

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$0.785

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795

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Distrelec

Netherlands . 759 parts In-Stock

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DigiKey

USA . 16,052 parts In-Stock

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$0.767

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Farnell

UK . 13,332 parts In-Stock

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Mouser Electronics

USA . 11,993 parts In-Stock

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Element14

Singapore . 5,577 parts In-Stock

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Avnet

USA . 119,200 parts In-Stock

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Arrow

USA . 91,200 parts In-Stock

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Verical

USA . 88,000 parts In-Stock

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EBV Elektronik

Germany . 25,600 parts In-Stock

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Canada . 3,200 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 574 parts In-Stock

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Nova Conductors

Japan . 92 parts In-Stock

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Maritex

Poland . 2,905 parts In-Stock

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Ozdisan Elektronik

Türkiye . 940 parts In-Stock

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NAC Semi

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Germany . 3,910 parts In-Stock

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Sensible Micro Corp

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Micros

Poland . 480 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 424 parts In-Stock

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Partservice

France . 380 parts In-Stock

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Micros sp.j. W. Kędra i J. Lic

Poland . 195 parts In-Stock

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Decca Corp

Germany . 12,272 parts In-Stock

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$0.490

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$0.480

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$0.475

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Ampacity Inc.

Singapore . 11,095 parts In-Stock

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Semicontronic

India . 12,188 parts In-Stock

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$0.556

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$0.553

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Corphita

USA . 883 parts In-Stock

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Modulus Dynamics

Lithuania . 2,509 parts In-Stock

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$0.887

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$0.852

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$0.816

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Corohmni

South Africa . 523 parts In-Stock

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Advanced Electronics

New Zealand . 350 parts In-Stock

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Argo Parts USA

USA . 1,342 parts In-Stock

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Bastille Electronics

Australia . 650 parts In-Stock

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$1.020

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$0.969

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$0.956

650

$1.074

$1.020

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$0.956

Continental Prestige Electronics

USA . 2,233 parts In-Stock

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$1.320

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$0.733

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$0.485

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Aztec Data Supply Inc.

USA . 2,588 parts In-Stock

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Eastek

USA . 52,800 parts In-Stock

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Perfect Parts

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RC Electronics

USA . 43,984 parts In-Stock

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$0.870

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$0.840

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$0.840

Robosynatics

Brazil . 24,476 parts In-Stock

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$0.869

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$0.852

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Lucentia Tech

USA . 24,476 parts In-Stock

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Infinite Electronics LLP (Excess)

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iodParts Technologies Inc.

India . 7,704 parts In-Stock

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GreenTree Electronics

Israel . 7,481 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,250 parts In-Stock

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Spain . 2,200 parts In-Stock

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UK . 424 parts In-Stock

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Computer Components Inc. - USA

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Overview

Unleash the power of innovation with the IRF9540NSTRLPBF by Infineon Technologies. Crafted with precision and reliability in mind, this P-Channel Power Field Effect Transistor is designed for switching applications, offering enhanced performance and efficiency. With a maximum operating temperature of 175°C and a minimum DS breakdown voltage of 100V, this transistor delivers top-notch quality and durability. Whether you're looking to optimize your electronic devices or enhance your power management systems, the IRF9540NSTRLPBF is the perfect choice for all your power needs. Elevate your projects to new heights with this cutting-edge technology from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for long-term use in various applications.

Polarity or Channel Type: P-CHANNEL

P-channel FETs offer advantages in certain circuit designs and can be more efficient in certain applications compared to N-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can provide added protection against reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance when turning on and off electrical circuits.

Surface Mount: YES

Easy to mount on circuit boards, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle higher voltages without risk of damage, making it suitable for high-power applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement on the circuit board and efficient use of space.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and operate in comparison to depletion mode FETs, providing more flexibility in circuit design.

Maximum Pulsed Drain Current (IDM): 92 A

Capable of handling high current pulses, making it suitable for applications that require rapid switching and high power.

Avalanche Energy Rating (EAS): 84 mJ

The high energy rating indicates the FET's ability to withstand voltage spikes and transient events without damage, ensuring reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 23 A

With a high maximum drain current, this FET can handle significant power loads without overheating or failing.

No. of Terminals: 2

Having only two terminals simplifies the connections and can reduce the risk of wiring errors in the circuit.

Maximum Power Dissipation (Abs): 140 W

Capable of dissipating heat effectively, ensuring stable operation even under heavy load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the circuit board and allows for dense packing of components.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

A common and reliable technology for FETs, offering good performance characteristics and high efficiency.

Maximum Operating Temperature: 175 °C

Capable of operating at high temperatures without performance degradation, suitable for demanding industrial and automotive applications.

Transistor Element Material: SILICON

Silicon is a widely used and reliable material for transistors, providing good electrical characteristics and long-term reliability.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold temperatures, making it suitable for outdoor or refrigeration applications.

Terminal Finish: MATTE TIN OVER NICKEL

The finish provides good conductivity and resistance to corrosion, ensuring reliable connections over time.

Maximum Drain-Source On Resistance: 0.117 ohm

The low on-resistance minimizes power loss and heat generation, improving efficiency in power switching applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation and reduces the risk of errors in connecting the FET to the circuit.

Case Connection: DRAIN

The drain connection is common for power FETs and allows for easy integration into various circuit designs.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, the FET can be quickly and efficiently soldered onto the circuit board during assembly.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during assembly, ensuring a secure and reliable solder joint.

Technical Specifications

Power Field Effect Transistors (FET) IRF9540NSTRLPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH RELIABILITY

Avalanche Energy Rating (EAS):

84 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

23 A

Maximum Drain Current (ID):

23 A

Maximum Drain-Source On Resistance:

.117 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

92 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRF9540NSTRLPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

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