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BSP316PH6327

Infineon Technologies

BSP316PH6327 by Infineon Technologies

Infineon's BSP316PH6327 is a P-CHANNEL FET with 100V DS breakdown voltage, ideal for automotive applications. Featuring single configuration with built-in diode, it offers 2.72A max pulsed drain current and 1.8 ohm max RDS(on). AEC-Q101 compliant, this MOSFET in small outline package suits power management needs.

Median Price

$1.020

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 15,167 parts In-Stock

1+ parts

$1.020

100+ parts

$0.414

1k+ parts

$0.287

10k+ parts

$0.231

15,167

$1.020

$0.414

$0.287

$0.231

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$0.428

100+ parts

-

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150

$0.428

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Bristol Electronics

USA . 383 parts In-Stock

1+ parts

$0.450

100+ parts

$0.167

1k+ parts

$0.144

10k+ parts

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383

$0.450

$0.167

$0.144

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Digiode

USA . 963 parts In-Stock

1+ parts

$0.884

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963

$0.884

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Rutronik

Germany . 51,000 parts In-Stock

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$0.260

10k+ parts

$0.200

51,000

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$0.260

$0.200

Vyrian

USA . 15,116 parts In-Stock

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VNN

France . 2,335 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,560 parts In-Stock

1+ parts

$0.428

100+ parts

-

1k+ parts

-

10k+ parts

$0.419

4,560

$0.428

-

-

$0.419

Argo Parts USA

USA . 2,276 parts In-Stock

1+ parts

$0.428

100+ parts

-

1k+ parts

-

10k+ parts

$0.415

2,276

$0.428

-

-

$0.415

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.428

100+ parts

-

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1,000

$0.428

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Aztec Data Supply Inc.

USA . 382 parts In-Stock

1+ parts

$0.535

100+ parts

-

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382

$0.535

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Ampacity Inc.

Singapore . 15,296 parts In-Stock

1+ parts

$0.790

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15,296

$0.790

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Semicontronic

India . 14,956 parts In-Stock

1+ parts

$0.790

100+ parts

$0.770

1k+ parts

$0.766

10k+ parts

-

14,956

$0.790

$0.770

$0.766

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Modulus Dynamics

Lithuania . 24,786 parts In-Stock

1+ parts

$0.837

100+ parts

$0.804

1k+ parts

$0.770

10k+ parts

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24,786

$0.837

$0.804

$0.770

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Corphita

USA . 661 parts In-Stock

1+ parts

$0.837

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661

$0.837

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Corohmni

South Africa . 1,255 parts In-Stock

1+ parts

$0.868

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1,255

$0.868

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Advanced Electronics

New Zealand . 300 parts In-Stock

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$1.144

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$1.087

1k+ parts

$1.087

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300

$1.144

$1.087

$1.087

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A-Z Elektronik GmbH

Germany . 18,844 parts In-Stock

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RC Electronics

USA . 7,200 parts In-Stock

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$0.550

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$0.520

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$0.510

7,200

-

$0.550

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$0.510

Kepictronics

USA . 7,038 parts In-Stock

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7,038

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Perfect Parts

USA . 3,808 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,398 parts In-Stock

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3,398

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Infinite Electronics LLP (Excess)

. 799 parts In-Stock

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799

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Lixinc

USA . 50 parts In-Stock

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50

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Overview

Experience the superior quality and reliability of Infineon Technologies with the BSP316PH6327 Power Field Effect Transistor. This P-Channel FET offers a single configuration with a built-in diode, perfect for a wide range of applications. With a minimum DS breakdown voltage of 100V and maximum pulsed drain current of 2.72A, this transistor provides exceptional performance. Trust in the industry-leading technology of Infineon to deliver powerful solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the internal components, making the product reliable and long-lasting.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low resistance and high switching speed, making this product suitable for efficient power management applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for convenient and compact circuit design, reducing the need for additional components and simplifying the overall system.

Surface Mount: YES

The surface mount capability enables easy and efficient installation on PCBs, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 100 V

With a high minimum breakdown voltage, this FET can handle relatively high voltages, making it suitable for a wide range of power applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a standard form factor for easy integration into existing designs and systems.

Terminal Form: GULL WING

The gull wing terminal form offers reliable connectivity and mechanical strength, ensuring secure and stable connections in the circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control over the FET's conductivity, providing efficient power regulation and optimal performance.

Maximum Pulsed Drain Current (IDM): 2.72 A

The high maximum pulsed drain current capability allows the FET to handle short-duration high current spikes, enhancing its robustness in demanding conditions.

No. of Terminals: 4

With four terminals, this FET offers versatile connectivity options for different circuit configurations and applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces the overall footprint of the component, saving space on the PCB and enabling compact device designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures high performance and reliability, making this FET suitable for critical power management applications.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its stability and efficiency, contributing to the FET's overall performance and longevity.

Maximum Drain Current (ID): 0.68 A

The maximum drain current rating of 0.68 A indicates the FET's ability to handle moderate power loads efficiently, making it suitable for various low to medium power applications.

Maximum Drain-Source On Resistance: 1.8 ohm

With a low drain-source on resistance, this FET minimizes power loss and heat dissipation, ensuring high efficiency in power conversion and amplification applications.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit design and layout, allowing for easy integration into different system configurations.

Case Connection: DRAIN

The case connection at the drain terminal simplifies the circuit connection and layout, enhancing the overall reliability and performance of the FET.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 automotive reliability standard ensures that this FET meets stringent quality and performance requirements for demanding automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) BSP316PH6327 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

.68 A

Maximum Drain-Source On Resistance:

1.8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

2.72 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

BSP316PH6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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