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BSP318S

Infineon Technologies

BSP318S by Infineon Technologies

BSP318S by Infineon Technologies is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 10.4A and EAS of 60mJ, operating in ENHANCEMENT MODE. With a 0.15 ohm Drain-Source On Resistance, it offers high performance in a SMALL OUTLINE package for efficient power dissipation up to 1.8W at temperatures ranging from -55 to 150°C.

Median Price

$0.665

Lifecycle Status

EOL

Suppliers In-Stock

12

In-Stock Inventory

1k+

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RS (Exports)

UK . 50 parts In-Stock

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$0.665

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$0.568

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DF Sales Co.

USA . 830 parts In-Stock

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DF Sales Co.

USA . 830 parts In-Stock

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Zilex Electronics Inc.

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ACDS - Activité Composants Distribution Service

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J2 Sourcing AB

Sweden . 400 parts In-Stock

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R&J Components

USA . 325 parts In-Stock

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Digiode

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Vyrian

USA . 50 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 271 parts In-Stock

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$0.540

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Ampacity Inc.

Singapore . 23 parts In-Stock

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$0.570

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Modulus Dynamics

Lithuania . 24,868 parts In-Stock

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$0.776

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$0.745

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$0.714

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24,868

$0.776

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$0.714

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Semicontronic

India . 32 parts In-Stock

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$1.230

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$1.199

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$1.193

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Aztec Data Supply Inc.

USA . 1,741 parts In-Stock

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AZTECH Wire

Italy . 818 parts In-Stock

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Andel Nordic

Denmark . 4,018 parts In-Stock

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$40.797

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Lixinc

USA . 14,306 parts In-Stock

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Metaverse IC Inc.

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Continental Prestige Electronics

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Cyclops Electronics Ltd (Excess)

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Overview

Elevate your power management with the BSP318S by Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled quality and performance. Ideal for switching applications, this single configuration transistor comes with a built-in diode for added convenience. With a maximum pulsing drain current of 10.4 A and a minimum DS breakdown voltage of 60 V, this transistor delivers exceptional power and efficiency. Say goodbye to power limitations and hello to seamless operation with the BSP318S. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, making it durable and long-lasting.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics compared to P-channel FETs in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient and reliable switching operations.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in those scenarios.

Minimum DS Breakdown Voltage: 60 V

Can handle higher voltages, providing a safety margin for various circuit designs.

Surface Mount: YES

Easy to mount on PCBs, making it suitable for mass production and compact circuit designs.

Maximum Drain-Source On Resistance: 0.15 ohm

Low on-resistance leads to reduced power losses and heat generation during switching.

Maximum Operating Temperature: 150 °C

Can operate reliably at high temperatures, suitable for demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) BSP318S attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE, AVALANCHE RATED

Avalanche Energy Rating (EAS):

60 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

2.6 A

Maximum Drain Current (ID):

2.6 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10.4 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSP318S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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